公开(公告)号：US08154531B2

公开(公告)日：2012-04-10

申请号：US13137212

申请日：2011-07-28

申请人： Hirohisa Takahashi ,  Satoru Ishibashi ,  Noriaki Tani ,  Sadayuki Ukishima ,  Satoru Takasawa ,  Kyuzo Nakamura ,  Haruhiko Yamamoto

发明人： Hirohisa Takahashi ,  Satoru Ishibashi ,  Noriaki Tani ,  Sadayuki Ukishima ,  Satoru Takasawa ,  Kyuzo Nakamura ,  Haruhiko Yamamoto

IPC分类号： G06F3/041

CPC分类号： G06F3/045

摘要： A touch panel having high durability is provided. Either one or both of a display device and a flexible panel have island-shaped protective bodies formed on surfaces of electrode layers (upper electrode layer, lower electrode layer), and a transparent conductive film is exposed between the protective bodies. Since the protective bodies protrude highly from the surface of the transparent conductive film, when the flexible panel is pressed and the upper electrode and the lower electrode layer are brought into contact, a load to be applied to the transparent conductive film is reduced by the protective bodies, so that the transparent conductive film is not broken.

摘要翻译： 提供了具有高耐久性的触摸面板。 显示装置和柔性面板中的任一个或两者具有形成在电极层（上电极层，下电极层）的表面上的岛状保护体，并且在保护体之间露出透明导电膜。 由于保护体从透明导电膜的表面突出高度突出，当按压柔性面板并使上部电极和下部电极层接触时，通过保护性 使透明导电膜不破裂。

公开(公告)号：US08031183B2

公开(公告)日：2011-10-04

申请号：US12814039

申请日：2010-06-11

申请人： Hirohisa Takahashi ,  Satoru Ishibashi ,  Noriaki Tani ,  Sadayuki Ukishima ,  Satoru Takasawa ,  Kyuzo Nakamura ,  Haruhiko Yamamoto

发明人： Hirohisa Takahashi ,  Satoru Ishibashi ,  Noriaki Tani ,  Sadayuki Ukishima ,  Satoru Takasawa ,  Kyuzo Nakamura ,  Haruhiko Yamamoto

IPC分类号： G06F3/041

CPC分类号： G06F3/045

摘要： A touch panel having high durability is provided. Either one or both of a display device and a flexible panel have island-shaped protective bodies formed on surfaces of electrode layers (upper electrode layer, lower electrode layer), and a transparent conductive film is exposed between the protective bodies. Since the protective bodies protrude highly from the surface of the transparent conductive film, when the flexible panel is pressed and the upper electrode and the lower electrode layer are brought into contact, a load to be applied to the transparent conductive film is reduced by the protective bodies, so that the transparent conductive film is not broken.

摘要翻译： 提供了具有高耐久性的触摸面板。 显示装置和柔性面板中的任一个或两者具有形成在电极层（上电极层，下电极层）的表面上的岛状保护体，并且在保护体之间露出透明导电膜。 由于保护体从透明导电膜的表面突出高度突出，当按压柔性面板并使上部电极和下部电极层接触时，通过保护性 使透明导电膜不破裂。

公开(公告)号：US5840374A

公开(公告)日：1998-11-24

申请号：US661500

申请日：1996-06-11

申请人： Kazuyuki Ito ,  Kyuzo Nakamura ,  Michio Ishikawa ,  Jun Togawa ,  Noriaki Tani ,  Masanori Hashimoto ,  Yumiko Ohashi

发明人： Kazuyuki Ito ,  Kyuzo Nakamura ,  Michio Ishikawa ,  Jun Togawa ,  Noriaki Tani ,  Masanori Hashimoto ,  Yumiko Ohashi

IPC分类号： C23C16/40 ,  B05D3/06 ,  C23C16/22

CPC分类号： C23C16/401

摘要： An SiO.sub.2 passivation film is formed on a surface of a substrate made of a plastic material by plasma chemical vapor deposition (CVD) process in which organic oxysilane is used as a raw gas. Instead of a reactive gas having an ashing effect, Ar, He or NH.sub.3 is used as a reactive gas which serves as an auxiliary for decomposing the raw gas at a temperature not greater than a temperature at which the substrate is thermally deformed (i.e., about 250.degree. C.). The ashing of the substrate by oxygen or hydrogen radicals is thus prevented.

摘要翻译： 通过等离子体化学气相沉积（CVD）工艺在由塑料材料制成的衬底的表面上形成SiO 2钝化膜，其中使用有机氧化硅作为原料气体。 代替具有灰化效应的反应气体，使用Ar，He或NH 3作为反应气体，其用作在不高于基底热变形的温度（即，约 250℃）。 因此防止了氧或氢自由基对衬底的灰化。

公开(公告)号：US5288329A

公开(公告)日：1994-02-22

申请号：US616106

申请日：1990-11-20

申请人： Kyuzo Nakamura ,  Michio Ishikawa ,  Kazuyuki Ito ,  Noriaki Tani ,  Masanori Hashimoto ,  Yoshifumi Ota

发明人： Kyuzo Nakamura ,  Michio Ishikawa ,  Kazuyuki Ito ,  Noriaki Tani ,  Masanori Hashimoto ,  Yoshifumi Ota

IPC分类号： C23C16/44 ,  C23C16/02 ,  C23C16/50 ,  C23C16/54 ,  C23F4/00 ,  H01L21/205 ,  H01L21/31 ,  H01L21/00

CPC分类号： C23C16/54 ,  C23C16/0245

摘要： An in-line type chemical vapor deposition apparatus having an etching device for cleaning at least substrate holders, which is provided downstream of the substrate unloading station in which the processed substrates are removed from the substrate holders at atmosphere pressure. The etching device comprises a plasma etching means in which the substrate holders are positioned on an anode side or a dry-etching means in which the substrate holders are positioned on a cathode side, thereby reducing the down time of the apparatus without any influence of an exfoliation of an adhered film from the substrate holders or other portions.

摘要翻译： 一种在线型化学气相沉积装置，具有用于清洁至少基板保持件的蚀刻装置，该蚀刻装置设置在基板卸载站的下游，其中处理的基板在大气压力下从基板保持器移除。 蚀刻装置包括等离子体蚀刻装置，其中衬底保持器位于阳极侧或干蚀刻装置，其中衬底保持器位于阴极侧，从而减少装置的停机时间而不受任何影响 附着膜从基板保持器或其他部分剥离。

公开(公告)号：US5198309A

公开(公告)日：1993-03-30

申请号：US89022

申请日：1987-08-24

申请人： Kyuzo Nakamura ,  Yoshifumi Ota ,  Taiki Yamada ,  Michio Ishikawa ,  Noriaki Tani

发明人： Kyuzo Nakamura ,  Yoshifumi Ota ,  Taiki Yamada ,  Michio Ishikawa ,  Noriaki Tani

IPC分类号： G11B5/64 ,  G11B5/706

CPC分类号： G11B5/70621 ,  G11B5/64 ,  Y10S428/90 ,  Y10S428/928 ,  Y10T428/12847 ,  Y10T428/12854 ,  Y10T428/12861

摘要： An improved magnetic recording member comprising a magnetic metallic film having the composition Co.sub.x Cr.sub.y Ni.sub.z wherein x, y, and z are atomic ratios and 0.45.ltoreq.x

摘要翻译： 一种改进的磁记录元件，包括具有组成CoxCryNiz的磁性金属膜，其中x，y和z是原子比，0.45

公开(公告)号：US08218122B2

公开(公告)日：2012-07-10

申请号：US12475907

申请日：2009-06-01

申请人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

发明人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

IPC分类号： G02F1/13

CPC分类号： H01L23/53238 ,  H01L21/2855 ,  H01L23/53233 ,  H01L27/124 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/16 ,  H05K3/388 ,  H01L2924/00

摘要： A wiring film having excellent adhesion and barrier property and a low resistance value is formed. An oxygen gas is introduced into a vacuum chamber in which an object to be film formed is disposed; a sputtering target is sputtered in a vacuum ambience containing oxygen; and a first metallic film is formed on a surface of the object to be film formed. The first sputtering target includes copper as a major component and at least one kind of additive elements selected from an additive element group consisting of Mg, Al, Si, Be, Ca, Sr, Ba, Ra, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb and Dy. Thereafter, a second metallic film is formed on a surface of the first metallic film by sputtering the sputtering target in a state in which the introduction of the oxygen gas into a vacuum ambience is stopped, and then a wiring film is formed by etching the first and second metallic films.

摘要翻译： 形成具有优异的粘附性和阻隔性和低电阻值的布线膜。 将氧气引入其中设置有被成膜物体的真空室中; 溅射靶在含有氧的真空环境中溅射; 并且在待成膜物体的表面上形成第一金属膜。 第一溅射靶包括铜作为主要成分，以及选自由Mg，Al，Si，Be，Ca，Sr，Ba，Ra，Sc，Y，La，Ce组成的添加元素组中的至少一种添加元素， Pr，Nd，Pm，Sm，Eu，Gd，Tb和Dy。 此后，在将氧气引入真空环境的状态下，通过溅射溅射靶溅射溅射靶，在第一金属膜的表面上形成第二金属膜，然后通过蚀刻第一金属膜形成布线膜 和第二金属膜。

公开(公告)号：US20090236603A1

公开(公告)日：2009-09-24

申请号：US12480150

申请日：2009-06-08

申请人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

发明人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

IPC分类号： H01L27/06 ,  H01L21/768 ,  H01L29/786 ,  H01L29/772 ,  H01L33/00 ,  C23C14/00

CPC分类号： H01L23/53238 ,  H01L21/2855 ,  H01L27/124 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/16 ,  H05K3/388 ,  H01L2924/00

摘要： A wiring film having excellent adhesion and a low resistance is formed. A barrier film having copper as a main component and containing oxygen is formed on an object to form a film thereon by introducing an oxygen gas into a vacuum chamber in which the object to form a film thereon and sputtering a pure copper target. Then, after the introduction of the oxygen gas is stopped, a low-resistance film made of pure copper is formed by sputtering the pure copper target. Since the barrier film and the low-resistance film have copper as the main component, they can be patterned at a time. Since the low-resistance film has a resistance lower than that of the barrier film, the resistance of the entire wiring film is reduced. Since the barrier layer has high adhesion to glass and silicon, the entire wiring film has high adhesion.

摘要翻译： 形成具有优异的粘附性和低电阻的布线膜。 在物体上形成具有铜作为主要成分并含有氧的阻挡膜，以通过将氧气引入到其中形成膜的物体的真空室中并溅射纯铜靶来形成膜。 然后，在停止引入氧气之后，通过溅射纯铜靶而形成由纯铜制成的低电阻膜。 由于阻挡膜和低电阻膜具有铜作为主要成分，因此可以一次形成图案。 由于低电阻膜的阻抗低于阻挡膜的电阻，因此整个布线膜的电阻降低。 由于阻挡层对玻璃和硅具有高粘附性，因此整个布线膜具有高粘附性。

公开(公告)号：US20080069724A1

公开(公告)日：2008-03-20

申请号：US11896124

申请日：2007-08-29

申请人： Atsushi Ota ,  Isao Sugiura ,  Noriaki Tani ,  Masahiro Matsumoto ,  Hiroaki Katagiri ,  Tadashi Masuda ,  Satorui Ishibashi ,  Takaharu Ito

发明人： Atsushi Ota ,  Isao Sugiura ,  Noriaki Tani ,  Masahiro Matsumoto ,  Hiroaki Katagiri ,  Tadashi Masuda ,  Satorui Ishibashi ,  Takaharu Ito

IPC分类号： C22C1/00

CPC分类号： C22C1/026 ,  C23C14/3414

摘要： A target is produced inexpensively by safely incorporating an additive which is inflammable in the atmosphere. A primary alloy in a molten state is formed by adding an additive into a principal material in a low-level oxygen atmosphere, and a secondary alloy is produced by increasing the volume of the primary alloy through adding the principal material to the molten primary alloy in the atmospheric atmosphere. Since the primary alloys in the molten or solid condition are stable, it does not ignite in the atmosphere. Since the volume of the primary alloy is smaller than that of the secondary alloy, a smaller size of a vacuum chamber 11 for the formation of the first atmosphere suffices.

摘要翻译： 通过安全地并入在大气中易燃的添加剂，廉价地生产目标。 熔融状态下的初级合金是通过在低级氧气氛中的主要材料中添加添加剂而形成的，通过将主要原料添加到熔融一次合金中来增加一次合金的体积来制造二次合金 大气层。 由于熔融或固态条件下的主要合金是稳定的，因此在大气中不会点燃。 由于一次合金的体积小于二次合金的体积，所以形成第一气氛的真空室11的尺寸较小。

公开(公告)号：US08119462B2

公开(公告)日：2012-02-21

申请号：US12364836

申请日：2009-02-03

申请人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

发明人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

IPC分类号： H01L21/00

CPC分类号： H01L29/41733 ,  C23C14/185 ,  C23C14/3407 ,  C23C14/5806 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76877 ,  H01L23/53238 ,  H01L27/124 ,  H01L29/42384 ,  H01L29/458 ,  H01L29/4908 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A conductive film having high adhesion and low specific resistance is formed. A target containing copper as a main component is sputtered in vacuum ambience while an oxygen gas introduced, and then, a conductive film containing copper as a main component and additive metals, such as Ti or Zr, is formed. Such a conductive film has high adhesion to a silicon layer and a glass substrate and is hardly peeled off from the substrate. Furthermore, the specific resistance is low and the contact resistance to a transparent conductive film is also low. Thus, no deterioration in the electric characteristics occurs even when the conductive film is used for an electrode film. Accordingly, the conductive film formed by the present invention suited for TFT, and electrode films and barrier films of semiconductor elements, in particular.

摘要翻译： 形成具有高粘附性和低电阻率的导电膜。 在真空环境中溅射含有铜作为主要成分的靶，同时引入氧气，然后形成以铜为主要成分的导电膜和添加金属如Ti或Zr。 这种导电膜对硅层和玻璃基板具有高粘附性，并且几乎不从基板剥离。 此外，电阻率低，并且对透明导电膜的接触电阻也低。 因此，即使将导电膜用于电极膜也不会发生电特性的劣化。 因此，特别是适用于TFT的本发明形成的导电膜以及半导体元件的电极膜和阻挡膜。

公开(公告)号：US20090303406A1

公开(公告)日：2009-12-10

申请号：US12475907

申请日：2009-06-01

申请人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

发明人： Satoru Takasawa ,  Masaki Takei ,  Hirohisa Takahashi ,  Hiroaki Katagiri ,  Sadayuki Ukishima ,  Noriaki Tani ,  Satoru Ishibashi ,  Tadashi Masuda

IPC分类号： G02F1/1343 ,  C23F1/00 ,  H01L29/78

CPC分类号： H01L23/53238 ,  H01L21/2855 ,  H01L23/53233 ,  H01L27/124 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/16 ,  H05K3/388 ,  H01L2924/00

摘要： A wiring film having excellent adhesion and barrier property and a low resistance value is formed. An oxygen gas is introduced into a vacuum chamber in which an object to be film formed is disposed; a sputtering target is sputtered in a vacuum ambience containing oxygen; and a first metallic film is formed on a surface of the object to be film formed. The first sputtering target includes copper as a major component and at least one kind of additive elements selected from an additive element group consisting of Mg, Al, Si, Be, Ca, Sr, Ba, Ra, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb and Dy. Thereafter, a second metallic film is formed on a surface of the first metallic film by sputtering the sputtering target in a state in which the introduction of the oxygen gas into a vacuum ambience is stopped, and then a wiring film is formed by etching the first and second metallic films.

摘要翻译： 形成具有优异的粘附性和阻隔性和低电阻值的布线膜。 将氧气引入其中设置有被成膜物体的真空室中; 溅射靶在含有氧的真空环境中溅射; 并且在待成膜物体的表面上形成第一金属膜。 第一溅射靶包括铜作为主要成分，以及选自由Mg，Al，Si，Be，Ca，Sr，Ba，Ra，Sc，Y，La，Ce组成的添加元素组中的至少一种添加元素， Pr，Nd，Pm，Sm，Eu，Gd，Tb和Dy。 此后，在将氧气引入真空环境的状态下，通过溅射溅射靶溅射溅射靶，在第一金属膜的表面上形成第二金属膜，然后通过蚀刻第一金属膜形成布线膜 和第二金属膜。