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    Solid state surface evaluation methods and devices
    12.
    发明授权
    Solid state surface evaluation methods and devices 失效
    固态表面评估方法和装置

    公开(公告)号：US5534698A

    公开(公告)日：1996-07-09

    申请号：US271741

    申请日：1994-07-07

    申请人： Hisayoshi Ohshima ,  Yoshiyasu Yamada

    发明人： Hisayoshi Ohshima ,  Yoshiyasu Yamada

    IPC分类号： G01B11/30 ,  G01N21/55 ,  G01N21/59 ,  G01J3/42

    CPC分类号： G01B11/30 ,  G01N21/55 ,  G01N21/59

    摘要： Methods and devices for evaluating solid-state surface properties use infrared absorption of lattice vibration. These methods and devices are characterized by reflection spectrometry by injecting infrared rays from the reverse of the solids, placing a light transmissible solid-state sample in ways that its surface faces the plane reflex mirror on the interaction region formed by reflected infrared rays, or by injecting infrared rays from the rear of a sample or from the front thereof after upright installation of the light transmissible solid-state sample through a slit created across the plane reflex mirror or on the surface of plane reflex mirror. These methods and devices enable simplified and accurate reflection spectrometry of solid-surface properties, featuring an economical system configuration that dispenses with expensive prism, unlike the conventional ATR method.

    摘要翻译： 用于评估固态表面性质的方法和装置使用晶格振动的红外吸收。 这些方法和装置的特征在于通过从固体反向注入红外线的反射光谱法，将透光固态样品放置在其表面面对由反射红外线形成的相互作用区域上的平面反射镜的方式，或者由 在通过穿过平面反射镜或平面反射镜的表面上形成的狭缝直立安装透光固体样品之后，从样品的后部或从其前方注入红外线。 这些方法和装置能够实现固体表面性质的简化和准确的反射光谱测定，其特征在于与常规ATR方法不同，其具有省去昂贵的棱镜的经济系统配置。

    IMAGE FORMING DEVICE, AND IMAGE FORMING METHOD
    14.
    发明申请
    IMAGE FORMING DEVICE, AND IMAGE FORMING METHOD 有权
    图像形成装置和图像形成方法

    公开(公告)号：US20130093810A1

    公开(公告)日：2013-04-18

    申请号：US13704321

    申请日：2012-04-12

    申请人： Ryota Suzuki ,  Takeo Tsukamoto ,  Takeshi Orito ,  Manabu Seo ,  Hideomi Sakuma ,  Aino Hasegawa ,  Hiroyuki Yamashita ,  Yuuma Usui ,  Hisayoshi Ohshima ,  Takahiko Matsumoto

    发明人： Ryota Suzuki ,  Takeo Tsukamoto ,  Takeshi Orito ,  Manabu Seo ,  Hideomi Sakuma ,  Aino Hasegawa ,  Hiroyuki Yamashita ,  Yuuma Usui ,  Hisayoshi Ohshima ,  Takahiko Matsumoto

    IPC分类号： B41J2/115

    CPC分类号： B41J2/115 ,  B41J2/0057 ,  B41J2/04563 ,  B41J2/04581 ,  B41J2/3855

    摘要： An image forming device includes a head including a nozzle that discharges an electrically-conductive recording liquid in accordance with a driving signal; an intermediate transfer body on which the recording liquid discharged by the head is applied; a voltage apply unit that applies a voltage between the intermediate transfer body and the head, so as to decompose the electrically-conductive recording liquid by electrolysis; a transfer unit that transfers an image supported on the intermediate transfer body onto a recording material; and a discharging control unit that generates the driving signal that causes the electrically-conductive recording liquid to be discharged from the nozzle. The discharging control unit generates the driving signal so that a position of a meniscus is placed outside the nozzle during a time interval in which the recording liquid temporarily bridges between the head and the intermediate transfer body.

    摘要翻译： 图像形成装置包括：头部，其包括根据驱动信号对导电记录液体进行排出的喷嘴; 其上施加有由头部排出的记录液体的中间转印体; 电压施加单元，其在所述中间转印体和所述头之间施加电压，以通过电解分解所述导电记录液; 传送单元，其将支撑在所述中间转印体上的图像转印到记录材料上; 以及放电控制单元，其产生使导电记录液体从喷嘴排出的驱动信号。 放电控制单元产生驱动信号，使得在记录液临时桥接在头部和中间转印体之间的时间间隔期间，弯液面的位置被放置在喷嘴外部。

    Semiconductor substrate manufacturing method
    17.
    发明授权
    Semiconductor substrate manufacturing method 失效
    半导体衬底制造方法

    公开(公告)号：US06251754B1

    公开(公告)日：2001-06-26

    申请号：US09074384

    申请日：1998-05-08

    申请人： Hisayoshi Ohshima ,  Masaki Matsui ,  Kunihiro Onoda ,  Shoichi Yamauchi

    发明人： Hisayoshi Ohshima ,  Masaki Matsui ,  Kunihiro Onoda ,  Shoichi Yamauchi

    IPC分类号： H01L2120

    CPC分类号： H01L21/76254

    摘要： The invention provides a number of semiconductor substrate manufacturing methods with which, in manufacturing a semiconductor substrate having a semiconductor layer in an insulated state on a supporting substrate, it is possible to obtain a thick semiconductor layer with a simple process and cheaply while reducing impurity contamination of the semiconductor layer to a minimum. One of these methods includes a defective layer forming step of carrying out ion implantation to a predetermined depth from the surface of a base substrate to partition off a monocrystalline thin film layer at the surface of the base substrate by a defective layer formed by implanted ions, a semiconductor film forming step of forming a monocrystalline semiconductor film of a predetermined thickness on the monocrystalline thin film layer, a laminating step of laminating the base substrate by the surface of the monocrystalline semiconductor film to the supporting substrate, and a detaching step of detaching the base substrate laminated to the supporting substrate at the defective layer.

    摘要翻译： 本发明提供了许多半导体衬底制造方法，在制造具有在支撑衬底上具有绝缘状态的半导体层的半导体衬底的情况下，可以以简单的工艺获得厚半导体层并且在降低杂质污染的同时廉价 的半导体层。 这些方法之一包括从基底表面进行离子注入到预定深度的缺陷层形成步骤，以通过由注入离子形成的缺陷层在基底基板的表面分隔单晶薄膜层， 在单晶薄膜层上形成预定厚度的单晶半导体膜的半导体膜形成步骤，通过单晶半导体膜的表面将基底基板层压到支撑基板上的层压步骤，以及将基板 基底基板层叠到不良层的支撑基板。

    Method for producing a semiconductor substrate
    18.
    发明授权
    Method for producing a semiconductor substrate 有权
    半导体基板的制造方法

    公开(公告)号：US6060344A

    公开(公告)日：2000-05-09

    申请号：US136294

    申请日：1998-08-19

    申请人： Masaki Matsui ,  Masatake Nagaya ,  Hisayoshi Ohshima

    发明人： Masaki Matsui ,  Masatake Nagaya ,  Hisayoshi Ohshima

    IPC分类号： H01L21/02 ,  H01L21/76 ,  H01L21/762 ,  H01L27/12 ,  H02L21/20

    CPC分类号： H01L21/76264 ,  H01L21/76297 ,  H01L21/76275 ,  H01L21/76286

    摘要： In a method for producing a semiconductor substrate completed through a bonding process for joining a semiconductor wafer to a support substrate by performing heat treatment thereto in a state in which the semiconductor wafer is closely joined to the support substrate, the method according to the present invention includes the following steps, i.e., a depositing process for depositing a poly-crystal semiconductor which covers all areas of a surface to be bonded on the surface of the semiconductor wafer; a heat treatment process for performing the heat treatment to the semiconductor wafer provided after the depositing process, during a predetermined time under a temperature equal to or higher than the heat treatment temperature at the bonding process; and a polishing process for flattening the surface of the poly-crystal semiconductor provided after the heat treatment process. After the above processes were performed in order, the bonding process is performed after the polishing process.

    摘要翻译： 在半导体基板的制造方法中，通过在将半导体晶片紧密接合到支撑基板的状态下对半导体晶片与支撑基板进行热处理的接合工序而完成，本发明的方法 包括以下步骤，即，用于沉积覆盖半导体晶片表面上要接合的表面的所有区域的多晶半导体的沉积工艺; 在接合工序的等于或高于所述热处理温度的温度下的预定时间内对所述沉积工艺之后提供的所述半导体晶片进行热处理的热处理工艺; 以及用于使在热处理工艺之后提供的多晶半导体的表面变平的抛光工艺。 在进行上述处理之后，在抛光处理之后进行接合处理。

    Image forming device, and image forming method
    19.
    发明授权
    Image forming device, and image forming method 有权
    图像形成装置和图像形成方法

    公开(公告)号：US08870350B2

    公开(公告)日：2014-10-28

    申请号：US13704321

    申请日：2012-04-12

    申请人： Ryota Suzuki ,  Takeo Tsukamoto ,  Takeshi Orito ,  Manabu Seo ,  Hideomi Sakuma ,  Aino Hasegawa ,  Hiroyuki Yamashita ,  Yuuma Usui ,  Hisayoshi Ohshima ,  Takahiko Matsumoto

    发明人： Ryota Suzuki ,  Takeo Tsukamoto ,  Takeshi Orito ,  Manabu Seo ,  Hideomi Sakuma ,  Aino Hasegawa ,  Hiroyuki Yamashita ,  Yuuma Usui ,  Hisayoshi Ohshima ,  Takahiko Matsumoto

    IPC分类号： B41J2/06 ,  B41J2/005 ,  B41J2/045 ,  B41J2/115 ,  B41J2/385

    CPC分类号： B41J2/115 ,  B41J2/0057 ,  B41J2/04563 ,  B41J2/04581 ,  B41J2/3855

    摘要： An image forming device includes a head including a nozzle that discharges an electrically-conductive recording liquid in accordance with a driving signal; an intermediate transfer body on which the recording liquid discharged by the head is applied; a voltage apply unit that applies a voltage between the intermediate transfer body and the head, so as to decompose the electrically-conductive recording liquid by electrolysis; a transfer unit that transfers an image supported on the intermediate transfer body onto a recording material; and a discharging control unit that generates the driving signal that causes the electrically-conductive recording liquid to be discharged from the nozzle. The discharging control unit generates the driving signal so that a position of a meniscus is placed outside the nozzle during a time interval in which the recording liquid temporarily bridges between the head and the intermediate transfer body.

    摘要翻译： 图像形成装置包括：头部，其包括根据驱动信号对导电记录液体进行排出的喷嘴; 其上施加有由头部排出的记录液体的中间转印体; 电压施加单元，其在所述中间转印体和所述头之间施加电压，以通过电解分解所述导电记录液; 传送单元，其将支撑在所述中间转印体上的图像转印到记录材料上; 以及放电控制单元，其产生使导电记录液体从喷嘴排出的驱动信号。 排出控制单元产生驱动信号，使得在记录液临时桥接在头部和中间转印体之间的时间间隔期间，弯液面的位置位于喷嘴外部。