公开(公告)号：US20090236137A1

公开(公告)日：2009-09-24

申请号：US12227377

申请日：2006-05-17

申请人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

发明人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

IPC分类号： H05K1/11 ,  G03F7/20

CPC分类号： H05K3/426 ,  H05K1/116 ,  H05K3/002 ,  H05K3/108 ,  H05K2201/09545 ,  H05K2203/0191 ,  H05K2203/0574 ,  H05K2203/1184 ,  H05K2203/1394

摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

摘要翻译： 提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路 板。 一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和 通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法 图案和电路板。

公开(公告)号：US20110049104A1

公开(公告)日：2011-03-03

申请号：US12812815

申请日：2009-01-08

申请人： Makoto Kato ,  Yuji Toyoda ,  Kunihiro Nakagawa ,  Mariko Ishida ,  Yasuo Kaneda

发明人： Makoto Kato ,  Yuji Toyoda ,  Kunihiro Nakagawa ,  Mariko Ishida ,  Yasuo Kaneda

IPC分类号： C23F1/18 ,  C09K13/00 ,  C23F1/00

CPC分类号： C23F1/18 ,  H05K3/067 ,  H05K2203/0392 ,  H05K2203/1476

摘要： An etchant for copper or copper alloy, which contains water as a main component and comprises (1) 1 to 20 mass % of iron (III) chloride and (2) 5 to 100 mass %, based on the iron chloride, of oxalic acid, and an etching method using the above etchant are provided, and the etching method includes pretreatment to be carried out with an aqueous solution containing at least one component selected from a component that dissolves copper or copper alloy and an acid, whereby well yields can be materialized.

摘要翻译： 一种含有水作为主要成分的铜或铜合金的蚀刻剂，其含有（1）1〜20质量％的氯化铁（III）和（2）5〜100质量％的氯化铁，草酸 并且提供了使用上述蚀刻剂的蚀刻方法，并且蚀刻方法包括使用含有选自溶解铜或铜合金的组分和酸的至少一种成分的水溶液进行预处理，由此可以得到良好的产率 实现。

公开(公告)号：US20090173245A1

公开(公告)日：2009-07-09

申请号：US12226000

申请日：2007-04-06

申请人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

发明人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

IPC分类号： B05C17/06 ,  B05D1/32 ,  C25D5/02

CPC分类号： B41C1/14 ,  B41N1/24 ,  H05K3/1225

摘要： The method for making a screen printing mask, provided by this invention is a method for making a resin-formed screen printing mask having a resin layer on one main surface of a screen printing mask having openings, a resin layer having openings nearly in the same locations as those of said openings of the screen printing mask, and comprises the step of coating the one main surface of said screen printing mask with the resin layer by laminating, and the step of removing those parts of said resin layer which are positioned nearly in the same locations as those of the openings of said screen printing mask by self-alignment, to form the openings through the resin layer.

摘要翻译： 由本发明提供的丝网印刷掩模的制造方法是在具有开口的丝网印刷掩模的一个主表面上制造具有树脂层的树脂成形丝网印刷掩模的方法，具有几乎相同的开口的树脂层 位置与丝网印刷掩模的所述开口的位置相同，并且包括通过层压将所述丝网印刷掩模的一个主表面涂覆到树脂层的步骤，以及去除位于几乎位于所述树脂层中的那些部分的步骤 与通过自对准的所述丝网印刷掩模的开口相同的位置，以形成穿过树脂层的开口。

公开(公告)号：US20060173113A1

公开(公告)日：2006-08-03

申请号：US11344009

申请日：2006-02-01

申请人： Masami Yabuta ,  Nobuo Iga ,  Tomoya Tsuji ,  Yuji Toyoda

发明人： Masami Yabuta ,  Nobuo Iga ,  Tomoya Tsuji ,  Yuji Toyoda

IPC分类号： B05D3/02 ,  C08K9/12 ,  C08K3/08

CPC分类号： B05D7/532 ,  B05D1/04 ,  B05D3/0254 ,  B05D7/536 ,  B05D2202/25

摘要： It is an object of the present invention to provide a powder coating composition, which can exhibit a sufficient hiding power, a corrosion resistance and an excellent appearance and can reduce a coating process and is particularly suitable for coating of an aluminum wheel because of its high low temperature curability and has excellent storage stability, and a coating method of an aluminum wheel using the same. A powder coating composition consisting of a powder coating composition particle, wherein said powder coating composition particle comprises at least a thermosetting resin powder formed by binding a metallic pigment with a binder and said thermosetting resin powder comprises a β-hydroxyalkylamide curing agent expressed by the following general formula (1): wherein R1 represents a hydrogen atom, a methyl group or an ethyl group, R2 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms or HOCH(R1)CH2—, and A represents a bivalent hydrocarbon group.

摘要翻译： 本发明的目的是提供一种粉末涂料组合物，其可以显示出足够的遮盖力，耐腐蚀性和优异的外观，并且可以减少涂布过程，并且特别适用于铝轮的涂覆，因为其高 低温固化性和优异的储存稳定性，以及使用其的铝轮的涂布方法。 一种由粉末涂料组合物颗粒组成的粉末涂料组合物，其中所述粉末涂料组合物颗粒至少包含通过将金属颜料与粘合剂结合而形成的热固性树脂粉末和所述热固性树脂粉末包含由下列表示的β-羟基烷基酰胺固化剂 通式（1）：其中R 1表示氢原子，甲基或乙基，R 2表示氢原子，具有1〜5个的烷基 碳原子或HOCH（R 1）CH 2 - ，A表示二价烃基。

公开(公告)号：US08143533B2

公开(公告)日：2012-03-27

申请号：US12227377

申请日：2006-05-17

申请人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

发明人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

IPC分类号： H05K1/03

CPC分类号： H05K3/426 ,  H05K1/116 ,  H05K3/002 ,  H05K3/108 ,  H05K2201/09545 ,  H05K2203/0191 ,  H05K2203/0574 ,  H05K2203/1184 ,  H05K2203/1394

摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

摘要翻译： 提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路 板。 一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和 通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法 图案和电路板。

公开(公告)号：US5360839A

公开(公告)日：1994-11-01

申请号：US45431

申请日：1993-04-13

申请人： Motoi Tanimoto ,  Tatsuo Yoshida ,  Kenshiro Tobinaga ,  Yuji Toyoda

发明人： Motoi Tanimoto ,  Tatsuo Yoshida ,  Kenshiro Tobinaga ,  Yuji Toyoda

IPC分类号： C08F8/32 ,  C08F220/26 ,  C08F220/28 ,  C09D5/44 ,  C08J3/20 ,  C08K3/20 ,  C08L63/00

CPC分类号： C09D5/4473

摘要： Cathodic electrodeposition paints are rendered hardly susceptible to oil droplet-induced craters by incorporating an amine-modified acrylic copolymer of t-butyl (meth)acrylate with a hydroxyl group-containing monomer and an oxirane ring-containing monomer in the form of an aqueous emulsion. The amine-modified acrylic copolymer may be an adduct with a half blocked organic diisocyanate. The paint gives a cured film substantially free from oil droplet-induced craters and having a good adhesion to an overcoating and a good surface smoothness.

摘要翻译： 通过将（甲基）丙烯酸叔丁酯与含羟基的单体和含环氧乙烷环的单体的胺改性的丙烯酸共聚物以水乳液的形式引入，阴极电沉积涂料几乎不易受油滴诱导的凹坑的影响 。 胺改性的丙烯酸共聚物可以是与半封端的有机二异氰酸酯的加合物。 油漆产生基本上没有油滴诱发的凹坑的固化膜，并且对外涂层具有良好的粘附性和良好的表面光滑度。