公开(公告)号：US20090173245A1

公开(公告)日：2009-07-09

申请号：US12226000

申请日：2007-04-06

申请人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

发明人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

IPC分类号： B05C17/06 ,  B05D1/32 ,  C25D5/02

CPC分类号： B41C1/14 ,  B41N1/24 ,  H05K3/1225

摘要： The method for making a screen printing mask, provided by this invention is a method for making a resin-formed screen printing mask having a resin layer on one main surface of a screen printing mask having openings, a resin layer having openings nearly in the same locations as those of said openings of the screen printing mask, and comprises the step of coating the one main surface of said screen printing mask with the resin layer by laminating, and the step of removing those parts of said resin layer which are positioned nearly in the same locations as those of the openings of said screen printing mask by self-alignment, to form the openings through the resin layer.

摘要翻译： 由本发明提供的丝网印刷掩模的制造方法是在具有开口的丝网印刷掩模的一个主表面上制造具有树脂层的树脂成形丝网印刷掩模的方法，具有几乎相同的开口的树脂层 位置与丝网印刷掩模的所述开口的位置相同，并且包括通过层压将所述丝网印刷掩模的一个主表面涂覆到树脂层的步骤，以及去除位于几乎位于所述树脂层中的那些部分的步骤 与通过自对准的所述丝网印刷掩模的开口相同的位置，以形成穿过树脂层的开口。

公开(公告)号：US20070181994A1

公开(公告)日：2007-08-09

申请号：US10598524

申请日：2005-03-02

申请人： Katsuya Fukase ,  Toyoaki Sakai ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Yasuo Kaneda ,  Masanori Natsuka ,  Wakana Aizawa

发明人： Katsuya Fukase ,  Toyoaki Sakai ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Yasuo Kaneda ,  Masanori Natsuka ,  Wakana Aizawa

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H05K3/064 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/065 ,  H05K3/108 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/09381 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/098 ,  H05K2203/0517 ,  H05K2203/0577 ,  H05K2203/0582 ,  H05K2203/1184 ,  H05K2203/1394

摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.

摘要翻译： 作为在电路基板的制造方法中解决在形成抗蚀剂层和电镀抗蚀剂层时的取向引起的焊盘和孔的位置偏移的问题的方法，提供了一种方法， 制造电路板，包括以下步骤：在表面上具有导电层的绝缘基板的表面上形成第一树脂层和通孔或/或非通孔的内壁，形成第二树脂层，所述第二树脂层 在设置在表面导电层上的第一树脂层上的第一树脂层的显影液中不溶或微溶，用第一树脂层的显影液除去设在孔上的第一树脂层， 制造电路板，包括对第一树脂层的表面均匀充电以对设置在孔上的第一树脂层引起电位差的步骤， 在形成第二树脂层之前，在表面导电层上设置阴极层。 此外，提供一种电路板，其具有位置偏移小且精度高的孔。

公开(公告)号：US06551753B1

公开(公告)日：2003-04-22

申请号：US09550310

申请日：2000-04-14

申请人： Masanori Natsuka ,  Yasuo Kaneda ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Noritaka Inoue ,  Kenji Hyodo

发明人： Masanori Natsuka ,  Yasuo Kaneda ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Noritaka Inoue ,  Kenji Hyodo

IPC分类号： G03G1310

CPC分类号： G03G13/22 ,  H05K3/065

摘要： There is disclosed a liquid developing method of a printed wiring board using a one-surface stepwise developing system which forms a resist pattern stepwisely according to an electrophotographic reverse developing method on each surface of a material to be developed obtained by forming photo-conductive layers on both surfaces of a both-surfaces copper-clad laminated board, wherein the method comprises the steps of subjecting to a static charging treatment on a surface to which no electrostatic latent image is formed which surface is positioned opposing to an electrostatic latent image-formed surface which is a surface to be exposed, or to a non-developing surface between completion of an exposure treatment and before a liquid toner developing treatment, and subjecting to the liquid toner developing treatment to form a toner image corresponding to the resist pattern on the electrostatically latent image-formed surface.

摘要翻译： 公开了一种使用单面逐步显影系统的印刷电路板的液体显影方法，所述单面逐步显影系统根据电子照相反显影方法在通过在其上形成光导层获得的待显影材料的每个表面上逐步形成抗蚀剂图案 两面覆铜层压板的两面，其特征在于，所述方法包括以下步骤：在不与静电潜像形成表面相对的表面上形成没有静电潜像的表面进行静电充电处理 即在曝光处理完成之前和在液体调色剂显影处理之前的待曝光表面或非显影表面，以及进行液体调色剂显影处理以在静电上形成对应于抗蚀剂图案的调色剂图像 潜像形成表面。

公开(公告)号：US08143533B2

公开(公告)日：2012-03-27

申请号：US12227377

申请日：2006-05-17

申请人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

发明人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

IPC分类号： H05K1/03

CPC分类号： H05K3/426 ,  H05K1/116 ,  H05K3/002 ,  H05K3/108 ,  H05K2201/09545 ,  H05K2203/0191 ,  H05K2203/0574 ,  H05K2203/1184 ,  H05K2203/1394

摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

摘要翻译： 提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路 板。 一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和 通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法 图案和电路板。

公开(公告)号：US07679004B2

公开(公告)日：2010-03-16

申请号：US10598524

申请日：2005-03-02

申请人： Katsuya Fukase ,  Toyoaki Sakai ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Yasuo Kaneda ,  Masanori Natsuka ,  Wakana Aizawa

发明人： Katsuya Fukase ,  Toyoaki Sakai ,  Munetoshi Irisawa ,  Toyokazu Komuro ,  Yasuo Kaneda ,  Masanori Natsuka ,  Wakana Aizawa

IPC分类号： H01R12/04 ,  H05K1/00

CPC分类号： H05K3/064 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/065 ,  H05K3/108 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/09381 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/098 ,  H05K2203/0517 ,  H05K2203/0577 ,  H05K2203/0582 ,  H05K2203/1184 ,  H05K2203/1394

摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.

摘要翻译： 作为在电路基板的制造方法中解决在形成抗蚀剂层和电镀抗蚀剂层时的取向引起的焊盘和孔的位置偏移的问题的方法，提供了一种方法， 制造电路板，包括以下步骤：在表面上具有导电层的绝缘基板的表面上形成第一树脂层和通孔或/或非通孔的内壁，形成第二树脂层，所述第二树脂层 在设置在表面导电层上的第一树脂层上的第一树脂层的显影液中不溶或微溶，用第一树脂层的显影液除去设在孔上的第一树脂层， 制造电路板，包括对第一树脂层的表面均匀充电以对设置在孔上的第一树脂层引起电位差的步骤， 在形成第二树脂层之前，在表面导电层上设置阴极层。 此外，提供一种电路板，其具有位置偏移小且精度高的孔。

公开(公告)号：US06645685B2

公开(公告)日：2003-11-11

申请号：US09945807

申请日：2001-09-05

申请人： Masakazu Takata ,  Hidetoshi Miura ,  Tamotsu Horiuchi ,  Munetoshi Irisawa ,  Masanori Natsuka ,  Kenji Tsuda ,  Kazuchiyo Takaoka ,  Kenji Hyodo

发明人： Masakazu Takata ,  Hidetoshi Miura ,  Tamotsu Horiuchi ,  Munetoshi Irisawa ,  Masanori Natsuka ,  Kenji Tsuda ,  Kazuchiyo Takaoka ,  Kenji Hyodo

IPC分类号： G03G1305

CPC分类号： H05K3/065 ,  G03G13/26 ,  G03G13/28 ,  G03G13/283 ,  G03G13/286

摘要： Disclosed is disclosed a process for producing a printed wiring board which comprises the steps of: a) exposing a wiring board having at least one photoconductive layer in which its chargeability is changed by light exposure on at least one surface of a conductive support which comprises an insulating substrate and at least one metal conductive layer provided at least one surface thereof through a resist pattern; b) charging the photoconductive layer to form an electrostatic latent image; c) forming a toner image on the photoconductive layer by toner developing treatment; d) removing a portion of the photoconductive layer to which no toner is attached by dissolution to form a resist image; and e) removing a portion of the metal conductive layer other than a portion where the resist image is formed by etching.

摘要翻译： 公开了一种制造印刷电路板的方法，该方法包括以下步骤：a）将具有至少一个光电导层的布线板暴露在导电载体的至少一个表面上，其中其电荷变化被改变，其中包括 绝缘基板和至少一个金属导电层通过抗蚀剂图案提供至少一个表面; b）对光电导层充电以形成静电潜像; c）通过调色剂显影处理在光电导层上形成调色剂图像; d） 通过溶解去除不附着调色剂的光电导层的一部分以形成抗蚀剂图像; 并且除去除了通过蚀刻形成抗蚀剂图像的部分之外的金属导电层的一部分。

公开(公告)号：US08546066B2

公开(公告)日：2013-10-01

申请号：US12865259

申请日：2009-01-22

申请人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

发明人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

IPC分类号： G03F7/20

CPC分类号： H05K3/064 ,  G03F7/093 ,  G03F7/168 ,  G03F7/2022 ,  H05K3/0094 ,  H05K3/427 ,  H05K2203/0505 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/1394 ,  H05K2203/1476

摘要： A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a′) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b′) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound.

摘要翻译： 一种形成导体图案的方法，包括以下步骤：（a）在其表面上具有导电层的基底上形成光可交联树脂层，（b）用碱水溶液处理光交联树脂层， 更薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻，依次包括的步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物 或形成导体图案的方法包括以下步骤：（a）在基材上形成光交联性树脂层，在其表面和内部形成导电层，（i）使光交联性树脂层固化 在孔单独或孔上及其周围区域，（b'）用碱性水溶液处理未固化部分中的光交联性树脂层使其变薄，（c）进行电路图案的曝光， （d ）显影和（e）蚀刻，这些步骤按顺序包含，所述碱性水溶液是含有5〜20质量％的无机碱性化合物的水溶液。

公开(公告)号：US20100330504A1

公开(公告)日：2010-12-30

申请号：US12865259

申请日：2009-01-22

申请人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

发明人： Munetoshi Irisawa ,  Yuji Toyoda ,  Yasuo Kaneda ,  Kunihiro Nakagawa

IPC分类号： G03F7/20

CPC分类号： H05K3/064 ,  G03F7/093 ,  G03F7/168 ,  G03F7/2022 ,  H05K3/0094 ,  H05K3/427 ,  H05K2203/0505 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/1394 ,  H05K2203/1476

摘要： A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a′) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b′) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound.

摘要翻译： 一种形成导体图案的方法，包括以下步骤：（a）在其表面上具有导电层的基底上形成光可交联树脂层，（b）用碱水溶液处理光交联树脂层， 更薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻，依次包括的步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物 或形成导体图案的方法包括以下步骤：（a）在基材上形成光交联性树脂层，在其表面和内部形成导电层，（i）使光交联性树脂层固化 在孔单独或孔上及其周围区域，（b'）用碱性水溶液处理未固化部分中的光交联性树脂层使其变薄，（c）进行电路图案的曝光 ，（d）显影和（e）蚀刻这些步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物的水溶液。

公开(公告)号：US20090236137A1

公开(公告)日：2009-09-24

申请号：US12227377

申请日：2006-05-17

申请人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

发明人： Yasuo Kaneda ,  Munetoshi Irisawa ,  Yuji Toyoda ,  Toyokazu Komuro ,  Katsuya Fukase ,  Toyoaki Sakai

IPC分类号： H05K1/11 ,  G03F7/20

CPC分类号： H05K3/426 ,  H05K1/116 ,  H05K3/002 ,  H05K3/108 ,  H05K2201/09545 ,  H05K2203/0191 ,  H05K2203/0574 ,  H05K2203/1184 ,  H05K2203/1394

摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

摘要翻译： 提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路 板。 一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和 通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法 图案和电路板。