摘要:
A process for forming a high dielectric constant, (High K), layer, for a metal-oxide-metal, capacitor structure, featuring localized oxidation of an underlying metal layer, performed at a temperature higher than the temperature experienced by surrounding structures, has been developed. A first iteration of this process features the use of a laser ablation procedure, performed to a local region of an underlying metal layer, in an oxidizing ambient. The laser ablation procedure creates the desired, high temperature, only at the laser spot, allowing a high K layer to be created at this temperature, while the surrounding structures on a semiconductor substrate, not directly exposed to the laser ablation procedure remain at lower temperatures. A second iteration features the exposure of specific regions of an underlying metal layer, to a UV, or to an I line exposure procedure, performed in an oxidizing ambient, with the regions of an underlying metal layer exposed to the UV or I line procedure, via clear regions in an overlying photolithographic plate. This procedure also results in the formation of a high K layer, on a top portion of the underlying metal layer.
摘要:
A method for forming an electrostatic discharge device using silicon-on-insulator technology is described. A silicon-on-insulator substrate is provided comprising a semiconductor substrate underlying an oxide layer underlying a silicon layer. The silicon layer and oxide layer are patterned to form a gate electrode wherein the semiconductor substrate is exposed. Ions are implanted into the exposed semiconductor substrate to form source and drain regions adjacent to the gate electrode. Spacers are formed on sidewalls of the gate electrode. An interlevel dielectric layer is deposited overlying the gate electrode. Openings are formed through the interlevel dielectric layer to the source and drain regions and filled with a conducting layer. The conducting layer is patterned to form conducting lines to complete formation of an electrostatic discharge device using SOI technology in the fabrication of integrated circuits.
摘要:
A method of patterning a hard mask, the comprising the following steps. A semiconductor structure is provided. A conductor film is formed over the semiconductor structure. An oxide layer is formed over the conductor film. A patterned metal oxide layer is formed over the conductor film. The oxide layer and the conductor film are etched, using the metal oxide layer as a hard mask, to form a patterned structure.
摘要:
A new method is provided for the creation of an ESD protection device for deep submicron semiconductor technology. An STI trench is created and filled with oxide. The surface of the STI region is polished after which a gate structure is created over the STI region. A high energy ESD implant is performed that is self-aligned with the created gate structure after which the EDS device structure is completed by implanting the source and drain regions of the ESD device.
摘要:
A process for fabricating a MOSFET device, featuring source/drain extension regions, formed after the utilization of high temperature processes, such as heavily doped source/drain regions, has been developed. Disposable insulator spacers are formed on the sides of doped, SEG silicon regions, followed formation of a gate insulator layer, and an overlying gate structure, on a region of the semiconductor substrate located between the doped SEG silicon regions. The temperature experienced during these process steps result in the formation of the heavily doped source/drain, underlying the SEG silicon regions. Selective removal of the disposable spacers, allows the source/drain extension regions to be placed in the space vacated by the disposable spacers, adjacent to the heavily doped source/drain region. Insulator spacers are then used to fill the spaces vacated by removal of the disposable spacers, directly overlying the source/drain extension regions. Additional iterations include the use of an L shaped spacer, overlying the source/drain extension region, as well as the formation of metal silicide, on the doped SEG silicon regions, and on the gate structures.
摘要:
A process for forming a high dielectric constant, (High K), layer, for a metal-oxide-metal, capacitor structure, featuring localized oxidation of an underlying metal layer, performed at a temperature higher than the temperature experienced by surrounding structures, has been developed. A first iteration of this process features the use of a laser ablation procedure, performed to a local region of an underlying metal layer, in an oxidizing ambient. The laser ablation procedure creates the desired, high temperature, only at the laser spot, allowing a high K layer to be created at this temperature, while the surrounding structures on a semiconductor substrate, not directly exposed to the laser ablation procedure remain at lower temperatures. A second iteration features the exposure of specific regions of an underlying metal layer, to a UV, or to an I line exposure procedure, performed in an oxidizing ambient, with the regions of an underlying metal layer exposed to the UV or I line procedure, via clear regions in an overlying photolithographic plate. This procedure also results in the formation of a high K layer, on a top portion of the underlying metal layer.
摘要:
In an embodiment, a method for manufacturing a thin layer chromatography (“TLC”) plate is disclosed. The method includes forming a layer of elongated nanostructures (e.g., carbon nanotubes), and at least partially coating the elongated nanostructures with a coating. The coating includes a stationary phase and/or precursor of a stationary phase for use in chromatography. At least a portion of the elongated nanostructures may be removed after being coated. Embodiments for TLC plates and related methods are also disclosed.
摘要:
An apparatus for implementing policy control for home gateway comprises a Co-located Policy Decision Function Entity (PD-FE) for receiving the QoS policy issued by the PD-FE at network side and sending the QoS policy to the home gateway or issuing the QoS policy configured thereon to the home gateway. A method for implementing the policy control for home gateway, the method comprises: the Co-located PD-FE receiving the QoS policy issued by the PD-FE at network side or being configured with the QoS policy; and the Co-located PD-FE issuing the QoS policy to home gateways. With the present invention, the Resource and Admission Control Function (RACF) avoids controlling the home gateway directly or sending the policy to the home gateways in the case that there are a lot of home gateways and all the home gateways are scattered at the edge of the network.
摘要:
The present invention provides a method for resource and admission control. In the process of resource requesting: upon receiving a resource initialization request, which is used for requesting a QoS resource for a service, sent by an SCF, a PD-FE of a visited network performing an authorization check and a resource availability check for the resource initialization request, and sending the resource initialization request to a PD-FE of a home network; the PD-FE of the home network performing an authorization check and making an initial policy decision for the resource initialization request, and sending a resource initialization response containing the generated initial policy decision to the PD-FE of the visited network; and the PD-FE of the visited network making a final admission decision for the resource initialization request according to the initial decision policy and the result of the resource availability check. The method provided by the present invention specifies respective functional attributes of the PACF in the home network and of the PACF in the visited network and the interaction process between the two, and solves the problem of resource and admission control supporting roaming.
摘要:
A method and system for controlling home gateway policy are disclosed. The method comprises: a Resource and Admission Control Function (RACF) entity sends down a policy to a home gateway, and the home gateway performs a policy execution for an uplink packet passing through the home gateway according to the policy received. With the policy control method and system of the present invention, the policy is sent down to the home gateway through the RACF, Quality of Service (QoS) control is made for the uplink packet passing through the home gateway before Bandwidth Remote Access Server (BRAS), effective QoS assurance is provided for the uplink packets before arriving at the BRAS, and meanwhile, the problem of heavy load of a convergence layer of a metropolitan area network in the prior art is solved.