公开(公告)号：US11817296B2

公开(公告)日：2023-11-14

申请号：US16913545

申请日：2020-06-26

Applicant: Tokyo Electron Limited

Inventor： Barton Lane ,  Merritt Funk ,  Yohei Yamazawa ,  Justin Moses ,  Chelsea DuBose ,  Michael Hummel

IPC: H01J37/32 ,  G01R29/08

CPC classification number: H01J37/32174 ,  G01R29/0878

Abstract: A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.

公开(公告)号：US10510512B2

公开(公告)日：2019-12-17

申请号：US15880435

申请日：2018-01-25

Applicant: Tokyo Electron Limited

Inventor： Merritt Funk ,  Megan Doppel ,  Kazuki Moyama ,  Chelsea DuBose ,  Justin Moses

IPC: H01J37/32 ,  H01L21/3065

Abstract: Embodiments of method and system for controlling plasma performance are described. In an embodiment a method may include supplying power at a first set of power parameters to a plasma chamber. Additionally, the method may include forming plasma within the plasma chamber using the first set of power parameters. The method may also include measuring power coupling to the plasma at the first set of power parameters. Also, the method may include supplying power at a second set of power parameters to the plasma chamber. The method may additionally include measuring power coupling to the plasma at the second set of power parameters to the plasma. The method may also include adjusting the first set of power parameters based, at least in part, on the measuring of the power coupling at the second set of power parameters.

公开(公告)号：US20240380114A1

公开(公告)日：2024-11-14

申请号：US18781542

申请日：2024-07-23

Applicant: Tokyo Electron Limited

Inventor： Chelsea DuBose ,  Barton Lane ,  Merritt Funk ,  Justin Moses

IPC: H01Q9/27 ,  H01Q5/25

Abstract: According to an embodiment, a radiating structure of a resonating structure used for plasma processing is disclosed. The radiating structure includes a set of first arms and a set of second arms. Each first arm has a first inductance and is coupled to a respective first capacitor and a respective second capacitor of the resonating structure to form a corresponding first resonant circuit operating at a first resonance frequency. Each second arm has a second inductance and is coupled to a respective third capacitor and a respective fourth capacitor of the resonating structure to form a corresponding second resonant circuit operating at a second resonance frequency. In a first mode of operation, the resonating structure operates as a single resonance antenna. In a second mode of operation, the resonating structure operates as a parallel resonance antenna.

公开(公告)号：US12074390B2

公开(公告)日：2024-08-27

申请号：US17985360

申请日：2022-11-11

Applicant: Tokyo Electron Limited

Inventor： Chelsea DuBose ,  Barton Lane ,  Merritt Funk ,  Justin Moses

IPC: H01Q9/27 ,  H01Q5/25

CPC classification number: H01Q9/27 ,  H01Q5/25

Abstract: According to an embodiment, a radiating structure of a resonating structure used for plasma processing is disclosed. The radiating structure includes a set of first arms and a set of second arms. Each first arm has a first inductance and is coupled to a respective first capacitor and a respective second capacitor of the resonating structure to form a corresponding first resonant circuit operating at a first resonance frequency. Each second arm has a second inductance and is coupled to a respective third capacitor and a respective fourth capacitor of the resonating structure to form a corresponding second resonant circuit operating at a second resonance frequency. In a first mode of operation, the resonating structure operates as a single resonance antenna. In a second mode of operation, the resonating structure operates as a parallel resonance antenna.

公开(公告)号：US20240258074A1

公开(公告)日：2024-08-01

申请号：US18162876

申请日：2023-02-01

Applicant: Tokyo Electron Limited

Inventor： Chelsea DuBose ,  Barton Lane ,  Justin Moses ,  Merritt Funk ,  Mitsunori Ohata

IPC: H01J37/32

CPC classification number: H01J37/3222 ,  H01J2237/327

Abstract: According to an embodiment, a plasma processing system includes a plasma chamber, a planar antenna, a dielectric plate, and a plurality of magnets. The planar antenna is configured to generate plasma within the plasma chamber. The dielectric plate is disposed between the plasma chamber and the planar antenna. The magnets are arranged vertically above an outer surface of the dielectric plate that faces the plasma chamber.

公开(公告)号：US11050394B2

公开(公告)日：2021-06-29

申请号：US16441517

申请日：2019-06-14

Applicant: Tokyo Electron Limited

Inventor： Chelsea DuBose ,  Merritt Funk ,  Justin Moses ,  Kazuki Moyama ,  Kazushi Kaneko

IPC: H03F1/00 ,  H03F3/24 ,  H05K7/20 ,  H03F1/30

Abstract: Embodiments are described for modules, multi-stage systems, and related methods for radio frequency (RF) power amplifiers with reduced size and weight requirements. Fluid cooling is incorporated directly into the power amplifier (PA) module design rather than requiring PA modules to be mounted on separate cooling devices. For one embodiment, a PA module includes a circuit board, RF circuit components, a ground plane, and a cooling plate having one or more cooling channels to receive a cooling fluid. The cooling channels are positioned to dissipate heat from the RF circuit components through the ground plane. For a further embodiment, the PA module also includes RF bias and power electronics within a housing for the PA module without requiring an external control board or power conversion electronics. Also disclosed are multi-stage PA systems having a plurality of PA modules that are similarly cooled using cooling channels.