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公开(公告)号：US12176183B2
公开(公告)日：2024-12-24
申请号：US18486220
申请日：2023-10-13
Applicant: Tokyo Electron Limited
Inventor： Barton Lane , Merritt Funk , Yohei Yamazawa , Justin Moses , Chelsea DuBose , Michael Hummel
Abstract: A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.
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公开(公告)号：US11094507B2
公开(公告)日：2021-08-17
申请号：US16517779
申请日：2019-07-22
Applicant: Tokyo Electron Limited
Inventor： Merritt Funk , Chelsea DuBose , Justin Moses , Kazuki Moyama , Kazushi Kaneko
Abstract: Embodiments are described herein for power generation systems and methods that use quadrature splitters and combiners to facilitate plasma stability and control. For one embodiment, a quadrature splitter receives an input signal and generates a first and second signals as outputs with the second signal being ninety degrees out of phase with respect to the first signal. Two amplifiers then generate a first and second amplified signals. A quadrature combiner receives the first and second amplified signals and generates a combined amplified signal that represents re-aligned versions of the first and second amplified signals. The power amplifiers can be combined into a system to generate a high power output to a processing chamber. Further, detectors can generate measurements used to monitor and control power generation. The power amplifiers, system, and methods provide significant advantages for high-power generation delivered to process chambers for plasma generation during plasma processing.
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公开(公告)号：US20210027992A1
公开(公告)日：2021-01-28
申请号：US16517779
申请日：2019-07-22
Applicant: Tokyo Electron Limited
Inventor： Merritt Funk , Chelsea DuBose , Justin Moses , Kazuki Moyama , Kazushi Kaneko
Abstract: Embodiments are described herein for power generation systems and methods that use quadrature splitters and combiners to facilitate plasma stability and control. For one embodiment, a quadrature splitter receives an input signal and generates a first and second signals as outputs with the second signal being ninety degrees out of phase with respect to the first signal. Two amplifiers then generate a first and second amplified signals. A quadrature combiner receives the first and second amplified signals and generates a combined amplified signal that represents re-aligned versions of the first and second amplified signals. The power amplifiers can be combined into a system to generate a high power output to a processing chamber. Further, detectors can generate measurements used to monitor and control power generation. The power amplifiers, system, and methods provide significant advantages for high-power generation delivered to process chambers for plasma generation during plasma processing.
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公开(公告)号：US20190228950A1
公开(公告)日：2019-07-25
申请号：US15880435
申请日：2018-01-25
Applicant: Tokyo Electron Limited
Inventor： Merritt Funk , Megan Doppel , Kazuki Moyama , Chelsea DuBose , Justin Moses
IPC: H01J37/32 , H01L21/3065
Abstract: Embodiments of method and system for controlling plasma performance are described. In an embodiment a method may include supplying power at a first set of power parameters to a plasma chamber. Additionally, the method may include forming plasma within the plasma chamber using the first set of power parameters. The method may also include measuring power coupling to the plasma at the first set of power parameters. Also, the method may include supplying power at a second set of power parameters to the plasma chamber. The method may additionally include measuring power coupling to the plasma at the second set of power parameters to the plasma. The method may also include adjusting the first set of power parameters based, at least in part, on the measuring of the power coupling at the second set of power parameters.
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公开(公告)号：US20240380114A1
公开(公告)日：2024-11-14
申请号：US18781542
申请日：2024-07-23
Applicant: Tokyo Electron Limited
Inventor： Chelsea DuBose , Barton Lane , Merritt Funk , Justin Moses
Abstract: According to an embodiment, a radiating structure of a resonating structure used for plasma processing is disclosed. The radiating structure includes a set of first arms and a set of second arms. Each first arm has a first inductance and is coupled to a respective first capacitor and a respective second capacitor of the resonating structure to form a corresponding first resonant circuit operating at a first resonance frequency. Each second arm has a second inductance and is coupled to a respective third capacitor and a respective fourth capacitor of the resonating structure to form a corresponding second resonant circuit operating at a second resonance frequency. In a first mode of operation, the resonating structure operates as a single resonance antenna. In a second mode of operation, the resonating structure operates as a parallel resonance antenna.
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Patent Agency Ranking
公开(公告)号：US12074390B2
公开(公告)日：2024-08-27
申请号：US17985360
申请日：2022-11-11
Applicant: Tokyo Electron Limited
Inventor： Chelsea DuBose , Barton Lane , Merritt Funk , Justin Moses
Abstract: According to an embodiment, a radiating structure of a resonating structure used for plasma processing is disclosed. The radiating structure includes a set of first arms and a set of second arms. Each first arm has a first inductance and is coupled to a respective first capacitor and a respective second capacitor of the resonating structure to form a corresponding first resonant circuit operating at a first resonance frequency. Each second arm has a second inductance and is coupled to a respective third capacitor and a respective fourth capacitor of the resonating structure to form a corresponding second resonant circuit operating at a second resonance frequency. In a first mode of operation, the resonating structure operates as a single resonance antenna. In a second mode of operation, the resonating structure operates as a parallel resonance antenna.
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公开(公告)号：US20240258074A1
公开(公告)日：2024-08-01
申请号：US18162876
申请日：2023-02-01
Applicant: Tokyo Electron Limited
Inventor： Chelsea DuBose , Barton Lane , Justin Moses , Merritt Funk , Mitsunori Ohata
IPC: H01J37/32
CPC classification number: H01J37/3222 , H01J2237/327
Abstract: According to an embodiment, a plasma processing system includes a plasma chamber, a planar antenna, a dielectric plate, and a plurality of magnets. The planar antenna is configured to generate plasma within the plasma chamber. The dielectric plate is disposed between the plasma chamber and the planar antenna. The magnets are arranged vertically above an outer surface of the dielectric plate that faces the plasma chamber.
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公开(公告)号：US11050394B2
公开(公告)日：2021-06-29
申请号：US16441517
申请日：2019-06-14
Applicant: Tokyo Electron Limited
Inventor： Chelsea DuBose , Merritt Funk , Justin Moses , Kazuki Moyama , Kazushi Kaneko
Abstract: Embodiments are described for modules, multi-stage systems, and related methods for radio frequency (RF) power amplifiers with reduced size and weight requirements. Fluid cooling is incorporated directly into the power amplifier (PA) module design rather than requiring PA modules to be mounted on separate cooling devices. For one embodiment, a PA module includes a circuit board, RF circuit components, a ground plane, and a cooling plate having one or more cooling channels to receive a cooling fluid. The cooling channels are positioned to dissipate heat from the RF circuit components through the ground plane. For a further embodiment, the PA module also includes RF bias and power electronics within a housing for the PA module without requiring an external control board or power conversion electronics. Also disclosed are multi-stage PA systems having a plurality of PA modules that are similarly cooled using cooling channels.
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公开(公告)号：US12272520B2
公开(公告)日：2025-04-08
申请号：US16506202
申请日：2019-07-09
Applicant: Tokyo Electron Limited
Inventor： Merritt Funk , Peter Ventzek , Alok Ranjan , Barton Lane , Justin Moses , Chelsea DuBose
IPC: H01J37/32 , C23C16/509 , H01L21/67 , H01L21/683
Abstract: In one exemplary embodiment described herein are innovative plasma processing methods and system that utilize direct measurement of direct current (DC) field or self-bias voltage (Vdc) in a plasma processing chamber. In one embodiment, a non-plasma contact measurement using the electric field effect from Vdc is provided. The Vdc sensing method may be robust to a variety of process conditions. In one embodiment, the sensor is integrated with any focus ring material (for example, quartz or doped-undoped silicon). Robust extraction of the Vdc measurement signal may be used for process control. In one embodiment, the sensor may be integrated, at least in part, with the substrate being processed in the chamber.
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公开(公告)号：US12224164B2
公开(公告)日：2025-02-11
申请号：US17514815
申请日：2021-10-29
Applicant: Tokyo Electron Limited
Inventor： Chelsea Dubose , Barton Lane , Merritt Funk , Justin Moses , Yohei Yamazawa
IPC: H01J37/32
Abstract: A radio frequency (RF) system including: a first conductive covering surface, a portion of the first conductive covering surface including a portion of the first outer wall of a first RF device; a second conductive covering surface aligned to the first conductive covering surface, the second conductive covering surface being disposed around the insulating hole; an insulating hole for an RF center conductor extending through the first conductive covering surface and the second conductive covering surface, the first conductive covering surface and the second conductive covering surface being disposed around the insulating hole; a cavity bounded by the first conductive covering surface and the second conductive covering surface, the cavity being an insulating region; and an RF signal pickup disposed within the cavity.
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