公开(公告)号：US20140377463A1

公开(公告)日：2014-12-25

申请号：US14297768

申请日：2014-06-06

Applicant: Tokyo Electron Limited

Inventor： Yosuke Hachiya ,  Hisashi Kawano ,  Mitsunori Nakamori ,  Jun Nonaka ,  Shogo Mizota ,  Tatsuya Nagamatsu ,  Daisuke Saiki ,  Kazuhiro Teraoka ,  Takashi Yabuta

IPC: B05D3/10 ,  B05C11/08 ,  B05C5/00 ,  B05D5/00 ,  B05B3/00 ,  B05B12/04 ,  B05D1/00 ,  B05D1/02 ,  B05C5/02

CPC classification number: B05D3/107 ,  B05B3/001 ,  B05B12/04 ,  B05D1/005 ,  B05D5/08 ,  H01L21/67051 ,  H01L21/68792

Abstract: Disclosed is a liquid processing method which may de-electrify the surface of a hydrophobized substrate. A substrate electrified according to a liquid processing is de-electrified by supplying a hydrophobizing liquid to a surface of the substrate subjected to the liquid processing while rotating the substrate, and performing rinsing by supplying an alkaline rinsing liquid to the hydrophobized surface of the substrate.

Abstract translation: 公开了一种可以使疏水化基材的表面去电的液体处理方法。 通过在旋转基板的同时向经过液体处理的基板的表面供给疏水化液体，将通过液体处理带电的基板脱气，并且通过向基板的疏水化表面供给碱性冲洗液体进行冲洗。