公开(公告)号：US20150147888A1

公开(公告)日：2015-05-28

申请号：US14548453

申请日：2014-11-20

Applicant: Tokyo Electron Limited

Inventor： Jun Nonaka ,  Shogo Mizota ,  Tatsuya Nagamatsu ,  Daisuke Saiki ,  Kazuhiro Teraoka ,  Takashi Yabuta

IPC: H01L21/67 ,  H01L21/306

CPC classification number: H01L21/6708

Abstract: A liquid processing apparatus of the present disclosure holds and rotate a substrate in a substrate holding unit, ejects an etching liquid while moving a main nozzle of a main nozzle unit between a first position where the etching liquid reaches a center of the substrate and a second position closer to a peripheral side of the substrate than the first position, and then, ejects the etching liquid to the substrate from a sub nozzle provided at a third position closer to the peripheral side of the substrate than the first position at an ejection flow rate higher than that from the main nozzle.

Abstract translation: 本公开的液体处理装置保持并旋转衬底保持单元中的衬底，在将主喷嘴单元的主喷嘴移动到蚀刻液到达衬底的中心的第一位置和第二位置之间时，喷射蚀刻液体 位于比第一位置更靠近基板周边的位置，然后以比喷射流速比第一位置更靠近基板周边的第三位置从喷嘴喷射蚀刻液体到基板 高于主喷嘴。

公开(公告)号：US20140377463A1

公开(公告)日：2014-12-25

申请号：US14297768

申请日：2014-06-06

Applicant: Tokyo Electron Limited

Inventor： Yosuke Hachiya ,  Hisashi Kawano ,  Mitsunori Nakamori ,  Jun Nonaka ,  Shogo Mizota ,  Tatsuya Nagamatsu ,  Daisuke Saiki ,  Kazuhiro Teraoka ,  Takashi Yabuta

IPC: B05D3/10 ,  B05C11/08 ,  B05C5/00 ,  B05D5/00 ,  B05B3/00 ,  B05B12/04 ,  B05D1/00 ,  B05D1/02 ,  B05C5/02

CPC classification number: B05D3/107 ,  B05B3/001 ,  B05B12/04 ,  B05D1/005 ,  B05D5/08 ,  H01L21/67051 ,  H01L21/68792

Abstract: Disclosed is a liquid processing method which may de-electrify the surface of a hydrophobized substrate. A substrate electrified according to a liquid processing is de-electrified by supplying a hydrophobizing liquid to a surface of the substrate subjected to the liquid processing while rotating the substrate, and performing rinsing by supplying an alkaline rinsing liquid to the hydrophobized surface of the substrate.

Abstract translation: 公开了一种可以使疏水化基材的表面去电的液体处理方法。 通过在旋转基板的同时向经过液体处理的基板的表面供给疏水化液体，将通过液体处理带电的基板脱气，并且通过向基板的疏水化表面供给碱性冲洗液体进行冲洗。

公开(公告)号：US10236192B2

公开(公告)日：2019-03-19

申请号：US14548453

申请日：2014-11-20

Applicant: Tokyo Electron Limited

Inventor： Jun Nonaka ,  Shogo Mizota ,  Tatsuya Nagamatsu ,  Daisuke Saiki ,  Kazuhiro Teraoka ,  Takashi Yabuta

IPC: H01L21/67

Abstract: A liquid processing apparatus of the present disclosure holds and rotate a substrate in a substrate holding unit, ejects an etching liquid while moving a main nozzle of a main nozzle unit between a first position where the etching liquid reaches a center of the substrate and a second position closer to a peripheral side of the substrate than the first position, and then, ejects the etching liquid to the substrate from a sub nozzle provided at a third position closer to the peripheral side of the substrate than the first position at an ejection flow rate higher than that from the main nozzle.

公开(公告)号：US09627192B2

公开(公告)日：2017-04-18

申请号：US14803421

申请日：2015-07-20

Applicant: Tokyo Electron Limited

Inventor： Naoyuki Okamura ,  Kazuki Kosai ,  Kazuhiro Teraoka ,  Fumihiro Kamimura

IPC: B08B3/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/67051

Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.

公开(公告)号：US20160027635A1

公开(公告)日：2016-01-28

申请号：US14803421

申请日：2015-07-20

Applicant: Tokyo Electron Limited

Inventor： Naoyuki Okamura ,  Kazuki Kosai ,  Kazuhiro Teraoka ,  Fumihiro Kamimura

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/67051

Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.

Abstract translation: 公开了一种用聚合物去除液清洗蚀刻的基板的基板处理装置（基板处理方法和其中存储有基板处理程序的计算机可读存储介质），其中异丙醇蒸气，水蒸气，去离子水 在用聚合物除去液体清洗基材之前，向基材供给异丙醇，氨水，氨水和异丙醇。