公开(公告)号：US09666998B1

公开(公告)日：2017-05-30

申请号：US15053707

申请日：2016-02-25

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Thomas Taake de Boer ,  Michael John Phillips ,  John Joseph Consoli ,  Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields

IPC: H01R13/648 ,  H01R13/6599 ,  H01R13/6596 ,  H01R13/6587 ,  H01R13/6585

CPC classification number: H01R13/6599 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/659 ,  H01R13/6596

Abstract: A ground contact module includes a ground leadframe having a ground contact with a transition portion extending between mating and terminating ends. A ground dielectric body holds the ground leadframe. The ground dielectric body has a low loss layer overmolded over the ground leadframe. The ground dielectric body has a lossy band separate and discrete from the low loss layer and attached thereto in proximity to the ground contact such that the lossy band is electrically coupled to the ground contact. The lossy band is manufactured from lossy material having conductive particles in a dielectric binder material and absorbs electrical resonance propagating through the contact module stack.

公开(公告)号：US09590338B1

公开(公告)日：2017-03-07

申请号：US14954045

申请日：2015-11-30

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Matthew Ryan Schmitt ,  Linda Ellen Shields ,  Randall R. Henry ,  Sandeep Patel ,  Mailoan Tran

IPC: H01R12/00 ,  H01R12/79

CPC classification number: H01R12/718 ,  H01R12/58 ,  H01R12/714 ,  H01R12/79

Abstract: A rigid-flex circuit connector is provided that includes a layered circuit board and an array of electrical contacts. The layered circuit board has a rigid board stacked above a flex board. The rigid board includes at least one rigid substrate and a rigid board circuit. The rigid board circuit includes a plurality of conductive vias extending into the rigid board from a top surface of the rigid board. The flex board includes at least one flexible substrate and a flex board circuit. The flex board circuit electrically connects to the conductive vias of the rigid board circuit. The array of electrical contacts is loaded in the conductive vias. The electrical contacts have mating ends that protrude from the top surface of the rigid board to mechanically engage and electrically connect to mating contacts of a mating electronic component.

Abstract translation: 提供了一种刚性 - 柔性电路连接器，其包括分层电路板和电触点阵列。 分层电路板具有堆叠在柔性板上方的刚性板。 刚性板包括至少一个刚性基板和刚性板电路。 刚性板电路包括从刚性板的顶表面延伸到刚性板中的多个导电通孔。 柔性板包括至少一个柔性基板和柔性板电路。 柔性板电路电连接到刚性板电路的导电通孔。 电触点阵列装载在导电通孔中。 电触头具有从刚性板的顶表面突出的配合端，以机械地接合并电连接到配合电子部件的配合触点。

公开(公告)号：US20170018881A1

公开(公告)日：2017-01-19

申请号：US14798536

申请日：2015-07-14

Applicant: Tyco Electronics Corporation ,  Tyco Electronics Japan G.K.

Inventor： Sandeep Patel ,  Linda Ellen Shields ,  Bruce Allen Champion ,  Chad William Morgan ,  Masayuki Aizawa

IPC: H01R13/6471 ,  H01R13/66

CPC classification number: H01R13/6471 ,  H01R13/6616 ,  H05K1/0228 ,  H05K1/023 ,  H05K1/117 ,  H05K2201/09409

Abstract: Pluggable connector includes a plug housing configured to couple to a communication cable. The plug housing has a plug cavity. The pluggable connector also includes a module board that is disposed within the plug cavity and configured to be communicatively coupled to the communication cable. The module board has a mating edge configured to interface with a mating connector. The module board includes a plurality of signal pathways and a plurality of ground pathways in which the signal pathways are interleaved between corresponding ground pathways. The signal and ground pathways include respective contact pads that are disposed proximate to the mating edge for engaging corresponding contacts of the mating connector. Each of the ground pathways has separate first and second trace segments and a damping component that electrically joins the first and second trace segments.

Abstract translation: 可插拔连接器包括被配置为耦合到通信电缆的插头壳体。 插头壳体具有插头腔。 可插拔连接器还包括模块板，其设置在插塞空腔内并且被配置为可通信地耦合到通信电缆。 模块板具有配置成与配合连接器相接合的配合边缘。 模块板包括多个信号路径和多个接地路径，其中信号路径在对应的接地路径之间交错。 信号和接地路径包括各自的接触垫，其设置在配合边缘附近，用于接合配合连接器的相应触点。 每个接地路径具有分离的第一和第二迹线段和电连接第一和第二迹线段的阻尼分量。

公开(公告)号：US09531130B1

公开(公告)日：2016-12-27

申请号：US14993832

申请日：2016-01-12

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R24/00 ,  H01R13/6471 ,  H01R13/6585 ,  H01R12/70

CPC classification number: H01R13/6471 ,  H01R12/7005 ,  H01R12/724 ,  H01R13/6585 ,  H01R24/60

Abstract: An electrical connector includes a housing having a mating housing and a contact organizer. The mating housing has a mating slot configured to receive a mating connector having contact pads. The contact organizer has signal and ground contact channels separated by separating walls with inner ends between the separating walls. The contact organizer has lossy fillers at the inner ends of the ground contact channels. The lossy fillers are manufactured from lossy material capable of absorbing electrical resonance propagating through the housing. The electrical connector includes a contact assembly disposed in the housing with ground contacts and signal contacts interspersed between corresponding ground contacts in corresponding ground and signal contact channels of the contact organizer. The ground contacts are positioned adjacent the lossy fillers at the inner ends of the corresponding ground contact channels.

Abstract translation: 电连接器包括具有配合壳体和接触组织器的壳体。 配合壳体具有配置成接纳具有接触垫的配合连接器的配合槽。 接触管理器具有信号和接地接触通道，分隔壁与分隔壁之间的内端分开。 接触管理器在地面接触通道的内端具有有损填料。 有损填料由能够吸收通过壳体传播的电谐振的有损材料制成。 电连接器包括设置在壳体中的接触组件，其中接地触头和信号触头散布在触点组织器的相应接地和信号接触通道中的相应接地触点之间。 接地触点位于相应地面接触通道内端附近的有损填料附近。

公开(公告)号：US09472900B1

公开(公告)日：2016-10-18

申请号：US14967585

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R13/514 ,  H01R13/6471 ,  H01R12/70

CPC classification number: H01R13/6471

Abstract: An electrical connector includes a housing having a first end and a second end. The housing has a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A contact array is received in the housing. The contact array includes ground contacts and signal contacts interspersed between corresponding ground contacts. The ground contacts include attachment portions thereon. At least one lossy ground absorber is received in the housing and is coupled to at least one corresponding ground contact. Each lossy ground absorber includes at least one opening. The at least one opening receives the attachment portion of the corresponding ground contact.

Abstract translation: 电连接器包括具有第一端和第二端的壳体。 壳体具有形成在第一和第二端部之间的配合槽，其构造成接收具有接触垫的配合连接器。 触点阵列接收在外壳中。 触点阵列包括散布在相应接地触点之间的接地触点和信号触点。 接地触点包括其上的附接部分。 至少一个有损耗的地面吸收器被容纳在壳体中并且被耦合到至少一个相应的接地触点。 每个有损地面吸收器包括至少一个开口。 所述至少一个开口接收相应地面接触件的附接部分。

公开(公告)号：US20160043508A1

公开(公告)日：2016-02-11

申请号：US14454043

申请日：2014-08-07

Applicant: Tyco Electronics Corporation

Inventor： David Wayne Helster ,  Linda Ellen Shields ,  Michael John Phillips ,  Bruce Allen Champion ,  Sandeep Patel

IPC: H01R13/6467 ,  H01R12/71

CPC classification number: H01R13/6467 ,  H01R12/585 ,  H01R12/714 ,  H01R12/716 ,  H01R12/724 ,  H01R12/727 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6587

Abstract: An electrical connector includes a housing and a plurality of contact modules and ground plates held by the housing. Each contact module includes left and right signal wafers stacked next to each other along a stack axis. The signal wafers include electrical terminals held by a dielectric body. The electrical terminals have mounting contacts protruding from the dielectric body at a mounting face of the housing. The electrical terminals of at least one of the signal wafers in each contact module are jogged toward the other signal wafer such that the mounting contacts of each contact module align in a column. Each of the ground plates is disposed along an outer side of a corresponding contact module.

Abstract translation: 电连接器包括壳体和由壳体保持的多个接触模块和接地板。 每个触点模块包括沿着堆叠轴线彼此堆叠的左和右信号晶片。 信号晶片包括由绝缘体保持的电端子。 电气端子具有在壳体的安装面处从电介质体突出的安装触头。 每个接触模块中的信号晶片中的至少一个的电端子向另一个信号晶片慢跑，使得每个接触模块的安装触点在一列中对齐。 每个接地板沿对应的接触模块的外侧设置。