Memory cell using spin induced switching effects
    11.
    发明授权
    Memory cell using spin induced switching effects 失效
    存储单元使用自旋感应开关效应

    公开(公告)号:US07715225B2

    公开(公告)日:2010-05-11

    申请号:US12036518

    申请日:2008-02-25

    IPC分类号: G11C11/00

    摘要: According to an embodiment, an integrated circuit includes a magneto-resistive memory cell. The magneto-resistive memory cell includes: a first ferromagnetic layer; a second ferromagnetic layer; and a nonmagnetic layer being disposed between the first ferromagnetic layer and the second ferromagnetic layer. The integrated circuit further includes a programming circuit configured to route a programming current through the magneto-resistive memory cell, wherein the programming current programs the magnetizations of the first ferromagnetic layer and of the second ferromagnetic layer by spin induced switching effects.

    摘要翻译: 根据实施例,集成电路包括磁阻存储单元。 磁阻存储单元包括:第一铁磁层; 第二铁磁层; 并且非磁性层设置在第一铁磁层和第二铁磁层之间。 集成电路还包括编程电路,其被配置为将编程电流路由到磁阻存储器单元,其中编程电流通过自旋感应开关效应对第一铁磁层和第二铁磁层的磁化进行编程。

    INTEGRATED BINARY PHASE SHIFT KEYING WITH SILICON MEMS RESONATORS
    12.
    发明申请
    INTEGRATED BINARY PHASE SHIFT KEYING WITH SILICON MEMS RESONATORS 有权
    与硅MEMS谐振器的集成二进制相移键控

    公开(公告)号:US20090085686A1

    公开(公告)日:2009-04-02

    申请号:US11863534

    申请日:2007-09-28

    IPC分类号: H03C3/42

    CPC分类号: H03C3/42 H03J2200/19

    摘要: A modulator includes a micro-electromechanical resonator device configured to receive an input signal and generate two output signals in response thereto, wherein the two signals having a predetermined phase relationship therebetween. The modulator further includes a switching system configured to selectively pass one of the two signals to an output of the modulator in an alternating fashion in response to phase modulation data.

    摘要翻译: 调制器包括被配置为接收输入信号并响应于此产生两个输出信号的微机电谐振器装置,其中两个信号之间具有预定的相位关系。 该调制器还包括一个交换系统,配置成响应于相位调制数据以交替的方式选择性地将两个信号之一传送到调制器的输出端。

    Method for producing an annular microstructure element
    13.
    发明授权
    Method for producing an annular microstructure element 有权
    环形微结构元件的制造方法

    公开(公告)号:US07316933B2

    公开(公告)日:2008-01-08

    申请号:US11112743

    申请日:2005-04-22

    IPC分类号: H01L21/00

    摘要: An annular microstructure element, in particular an annularly arranged monolayer or multilayer thin film, is formed over a substrate (S), e.g., for use in a magnetoresistive memory. To that end, a masking layer is applied over the substrate. An opening (C) is etched into the masking layer, so that a partial region of the surface is uncovered. The etching operation is performed in such a way that the opening (C) is formed with an overhang (B). The overhang at least partially shades the uncovered surface from an incident particle beam (TS). A particle beam (TS) is directed at the substrate (S) at an oblique angle (α) of incidence. In this case, the substrate (S) is rotated relative to the directed particle beam (TS). From the particle beam, material is thereby deposited annularly on the uncovered surface for the purpose of forming a hole-like microstructure element (R).

    摘要翻译: 在衬底(S)上形成环形微结构元件,特别是环形布置的单层或多层薄膜,例如用于磁阻存储器。 为此,在衬底上施加掩模层。 将开口(C)蚀刻到掩模层中,使得表面的部分区域不被覆盖。 蚀刻操作以使得开口(C)形成有突出部(B)的方式进行。 突出部分至少部分地遮蔽未被覆盖的表面与入射的粒子束(TS)。 粒子束(TS)以倾斜角(α)入射到基底(S)。 在这种情况下,基板(S)相对于定向粒子束(TS)旋转。 为了形成孔状微结构元件(R),从粒子束中,材料环状地沉积在未覆盖的表面上。

    MRAM structure using sacrificial layer for anti-ferromagnet and method of manufacture
    14.
    发明申请
    MRAM structure using sacrificial layer for anti-ferromagnet and method of manufacture 有权
    用于抗铁磁体的牺牲层的MRAM结构及其制造方法

    公开(公告)号:US20070278602A1

    公开(公告)日:2007-12-06

    申请号:US11448170

    申请日:2006-06-06

    IPC分类号: H01L43/00

    CPC分类号: H01L43/08 H01L43/12

    摘要: A magnetic random access memory structure comprising an anti-ferromagnetic layer structure, a crystalline ferromagnetic structure physically coupled to the anti-ferromagnetic layer structure and a ferromagnetic free layer structure physically coupled to the crystalline ferromagnetic structure.

    摘要翻译: 磁性随机存取存储器结构包括反铁磁层结构,物理耦合到反铁磁层结构的结晶铁磁结构和物理耦合到结晶铁磁结构的铁磁自由层结构。

    MTJ STACK WITH CRYSTALLIZATION INHIBITING LAYER
    15.
    发明申请
    MTJ STACK WITH CRYSTALLIZATION INHIBITING LAYER 失效
    具有结晶抑制层的MTJ堆叠

    公开(公告)号:US20050282295A1

    公开(公告)日:2005-12-22

    申请号:US10870780

    申请日:2004-06-17

    申请人: Wolfgang Raberg

    发明人: Wolfgang Raberg

    摘要: A method of forming a magnetic stack and a structure for a magnetic stack of a resistive memory device. A crystallization inhibiting layer is formed over the free layer of a magnetic stack, improving thermal stability. The crystallization inhibiting layer comprises an amorphous material having a higher crystallization temperature than the crystallization temperature of the free layer material. The crystallization inhibiting layer inhibits the crystallization of the underlying free layer, providing improved thermal stability for the resistive memory device.

    摘要翻译: 形成磁性堆叠的方法和用于电阻式存储器件的磁性堆叠的结构。 在磁性堆叠的自由层上形成结晶抑制层,从而提高热稳定性。 结晶抑制层包括具有比自由层材料的结晶温度更高的结晶温度的无定形材料。 结晶抑制层抑制下面的自由层的结晶,为电阻式存储器件提供改进的热稳定性。

    Small, scalable resistive element and method of manufacturing
    16.
    发明申请
    Small, scalable resistive element and method of manufacturing 审中-公开
    小型,可扩展的电阻元件和制造方法

    公开(公告)号:US20050014342A1

    公开(公告)日:2005-01-20

    申请号:US10622422

    申请日:2003-07-18

    摘要: An improved scalable, resistive element for use in a semiconductor device that can be produced with a small feature size and precise resistance is provided by the present invention. The resistive element includes a base layer positioned on top of a metal line. A seed layer of is deposited on top of the base layer. A thin barrier layer of Al is deposited on top of the seed layer and oxidized. A non-magnetic metal layer is then deposited on top of the barrier layer. The base layer and the non-magnetic metal layer form electrodes on either side of the barrier layer. The barrier layer is thin enough that a tunneling current can travel between the electrodes. The resulting resistive element may be constructed with a high resistance and a very small feature size.

    摘要翻译: 通过本发明提供了一种用于半导体器件的改进的可扩展的电阻元件,其可以以小的特征尺寸和精确的电阻产生。 电阻元件包括位于金属线顶部的基层。 种子层沉积在基层的顶部。 Al的薄势垒层沉积在种子层的顶部并被氧化。 然后将非磁性金属层沉积在阻挡层的顶部上。 基极层和非磁性金属层在势垒层的两侧形成电极。 阻挡层足够薄,使得隧道电流可以在电极之间行进。 所得到的电阻元件可以被构造成具有高电阻和非常小的特征尺寸。

    Magnetic field sensor having XMR elements in a full bridge circuit having diagonal elements sharing a same shape anisotropy
    17.
    发明授权
    Magnetic field sensor having XMR elements in a full bridge circuit having diagonal elements sharing a same shape anisotropy 有权
    磁场传感器在全桥电路中具有XMR元件,其具有共享相同形状各向异性的对角线元件

    公开(公告)号:US09411024B2

    公开(公告)日:2016-08-09

    申请号:US13451737

    申请日:2012-04-20

    申请人: Wolfgang Raberg

    发明人: Wolfgang Raberg

    IPC分类号: G01R33/09

    摘要: Embodiments of the present invention provide a magnetic field sensor. The magnetic field sensor includes at least four XMR elements connected in a full bridge circuit including parallel branches. The at least four XMR elements are GMR or TMR elements (GMR=giant magnetoresistance; TMR=tunnel magnetoresistance). Two diagonal XMR elements of the full bridge circuit include the same shape anisotropy, wherein XMR elements in the same branch of the full bridge circuit include different shape anisotropies.

    摘要翻译: 本发明的实施例提供一种磁场传感器。 磁场传感器包括连接在包括平行分支的全桥电路中的至少四个XMR元件。 至少四个XMR元件是GMR或TMR元件(GMR =巨磁电阻; TMR =隧道磁阻)。 全桥电路的两个对角XMR元件包括相同的形状各向异性,其中全桥电路的同一分支中的XMR元件包括不同的形状各向异性。

    Methods of manufacture MEMS devices
    18.
    发明授权
    Methods of manufacture MEMS devices 有权
    制造MEMS器件的方法

    公开(公告)号:US09266719B2

    公开(公告)日:2016-02-23

    申请号:US13406069

    申请日:2012-02-27

    IPC分类号: H01L41/00 B81C1/00 H01L41/09

    摘要: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.

    摘要翻译: 公开了微机电系统(MEMS)装置及其制造方法。 在一个实施例中,MEMS器件包括第一半导体材料和设置在第一半导体材料中的至少一个沟槽,所述至少一个沟槽具有侧壁。 绝缘材料层设置在第一半导体材料中的至少一个沟槽的侧壁的上部上方,以及靠近侧壁的第一半导体材料的顶表面的一部分之上。 第二半导体材料或导电材料设置在至少一个沟槽内,并且至少在绝缘材料层的上方设置在靠近侧壁的第一半导体材料的顶表面的部分之上。