摘要:
A data communication apparatus which is capable of preventing reception of undesired data by a destination without increasing the load on a network, etc. Data and a destination thereof are input. A sender ID related to a sender who sends the input data is input. The input data is sent to the input destination. A sender ID for data transmission to the input destination is permitted is stored as a permission ID. The input sender ID is collated with the stored permission ID. Whether to permit data transmission is determined according to the collation result.
摘要:
A data communication apparatus which is capable of preventing reception of undesired data by a destination without increasing the load on a network, etc. Data and a destination thereof are input. A sender ID related to a sender who sends the input data is input. The input data is sent to the input destination. A sender ID for data transmission to the input destination is permitted is stored as a permission ID. The input sender ID is collated with the stored permission ID. Whether to permit data transmission is determined according to the collation result.
摘要:
A data communication apparatus which is capable of preventing reception of undesired data by a destination without increasing the load on a network, etc. Data and a destination thereof are input. A sender ID related to a sender who sends the input data is input. The input data is sent to the input destination. A sender ID for data transmission to the input destination is permitted is stored as a permission ID. The input sender ID is collated with the stored permission ID. Whether to permit data transmission is determined according to the collation result.
摘要:
A data communication apparatus which is capable of preventing reception of undesired data by a destination without increasing the load on a network, etc. Data and a destination thereof are input. A sender ID related to a sender who sends the input data is input. The input data is sent to the input destination. A sender ID for data transmission to the input destination is permitted is stored as a permission ID. The input sender ID is collated with the stored permission ID. Whether to permit data transmission is determined according to the collation result.
摘要:
A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN may be added.
摘要:
A semiconductor wafer having a surface with a thin film formed thereon is transported into a chamber and held by a holder. After an atmosphere provided in the chamber is replaced, flashes of light are directed from flash lamps in a light irradiation part toward the semiconductor wafer to perform a baking process on the thin film. The irradiation of the semiconductor wafer with light from halogen lamps in the light irradiation part also starts at the same time as the irradiation thereof with the flashes of light. The flashes of light emitted for an extremely short period of time and having a high intensity allow the surface temperature of the thin film to rise momentarily. This prevents the occurrence of abnormal grain growth resulting from prolonged baking in the film.
摘要:
A semiconductor wafer, on the surface of which a silicon dioxide base material and an amorphous silicon thin film are formed in this order, is carried into a chamber. An insulated gate bipolar transistor (IGBT) is connected with a power supply circuit to a flash lamp, and the IGBT makes an energization period to the flash lamp to be 0.01 millisecond or more and 1 millisecond or less, consequently making a flash light irradiation time to be 0.01 millisecond or more and 1 millisecond or less. Since a flash heat treatment is performed with a remarkably short flash light irradiation time, the excessive heating of the thin film of amorphous silicon is suppressed and harmful influence such as the exfoliation of the film is prevented.
摘要:
A film of silicon dioxide is formed on the silicon-germanium layer, and a high dielectric constant film is further formed on the film of silicon dioxide. First irradiation from a flash lamp is performed on the semiconductor wafer to increase the temperature of a front surface of the semiconductor wafer from a preheating temperature to a target temperature for a time period in the range of 3 milliseconds to 1 second. Subsequently, second irradiation from the flash lamp is performed to maintain the temperature of the front surface of the semiconductor wafer within a ±25° C. range around the target temperature for a time period in the range of 3 milliseconds to 1 second. This promotes the crystallization of the high dielectric constant film while suppressing the alleviation of distortion in the silicon-germanium layer.
摘要:
An ink composition for ink jet providing excellent in the curability based on ultraviolet irradiation in the presence of water or a solvent, the ejection stability with respect to the factors such as dot loss or flight deflection, and the storage stability of ink. Also provided herein is an ink composition for ink jet including: a pigment; a water-soluble organic solvent; a surfactant; at least either of a urethane (meth)acrylate being represented by the following general formula (1) and having a weight average molecular weight of 1,000 to 10,000 and a cross-linked urethane (meth)acrylate having a constitutional unit including the urethane (meth)acrylate; a compound having a radical polymerizable group(s); a photoradical polymerization initiator; and water: A1-O—(CONH—B1—NHCOO—C1—O)n—CONH—B1—NH—COO-D1 (1) where each of A1, B1, C1, D1, and n in formula (1) are described herein.
摘要:
A semiconductor wafer in which a carbon thin film is formed on a surface of a silicon substrate implanted with impurities is irradiated with flash light emitted from flash lamps. Absorbing the flash light causes the temperature of the carbon thin film to increase. The surface temperature of the silicon substrate implanted with impurities is therefore increased to be higher than that in a case where no thin film is formed, and the sheet resistance value can be thereby decreased. When the semiconductor wafer with the carbon thin film formed thereon is irradiated with flash light in high concentration oxygen atmosphere, since the carbon of the thin film is oxidized to be vaporized, removal of the thin film is performed concurrently with flash heating.