Pb-FREE COPPER ALLOY SLIDING MATERIAL AND PLAIN BEARINGS
    2.
    发明申请
    Pb-FREE COPPER ALLOY SLIDING MATERIAL AND PLAIN BEARINGS 审中-公开
    无铅铜合金滑动材料和普通轴承

    公开(公告)号:US20110129173A1

    公开(公告)日:2011-06-02

    申请号:US12600178

    申请日:2008-05-14

    摘要: [Task] In the provided Cu-based sliding material, the properties equivalent to those of a Pb-containing material is attained even free of Pb, and material has stable friction coefficient.[Solution Means] A Pb-free copper-alloy sliding material contains 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, and 0.5 to 30.0% of Zn is contained. Further, if necessary, 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 μm is contained.

    摘要翻译: [任务]在所提供的Cu基滑动材料中,即使没有Pb也能够获得与含Pb材料相当的性能,材料具有稳定的摩擦系数。 [解决方案]无铅铜合金滑动材料含有1.0至15.0%的Sn,0.5至15.0%的Bi和0.05至5.0%的Ag,Ag和Bi由Ag-Bi共晶体组成。 如果需要,含有0.1〜5.0%的Ni,0.02〜0.2%的P和0.5〜30.0%的Zn中的至少一种。 此外,根据需要,含有1.0〜10.0质量%的平均粒径为1.5〜70μm的Fe 3 P,Fe 2 P,FeB,NiB,AlN等中的至少一种。

    Pb-FREE COPPER ALLOY SLIDING MATERIAL
    10.
    发明申请
    Pb-FREE COPPER ALLOY SLIDING MATERIAL 审中-公开
    无铅铜合金滑动材料

    公开(公告)号:US20100266444A1

    公开(公告)日:2010-10-21

    申请号:US12376381

    申请日:2007-08-02

    IPC分类号: C22C9/02

    摘要: When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.

    摘要翻译: 当使用Cu-Sn-Bi颗粒基滑动材料进行滑动时,Cu基体的Cu流动并覆盖Bi相。 随着时间的推移,抗癫痫药物耐药性下降。 提供了防止耐发霉性降低的无铅滑动材料。 (1)组成:Sn的1〜15%,Bi的1〜15%,P的0.02〜0.2%,平均粒径为50〜70μm的1〜10%的硬质粒子, 余量为Cu和不可避免的杂质。 (2)结构:Bi相,硬质粒分散在铜基体中,所有的硬粒子均与铜基体结合。