摘要:
The present invention is a copper-based bonding wire for use in a semiconductor element. The bonding wire of the present invention can be manufactured with an inexpensive material cost, and has a superior PCT reliability in a high-humidity/temperature environment. Further, the bonding wire of the present invention exhibits: a favorable TCT reliability through a thermal cycle test; a favorable press-bonded ball shape; a favorable wedge bondability; a favorable loop formability, and so on. Specifically, the bonding wire of the present invention is a copper alloy bonding wire for semiconductor manufactured by drawing a copper alloy containing 0.13 to 1.15% by mass of Pd and a remainder comprised of copper and unavoidable impurities.
摘要:
The present invention relates to a fine grained WC-Co cemented carbide. By adding an extremely small amount of Ti, V, Zr, Ta or Nb alone or in combinations, a grain refined cemented carbide structure with less abnormal WC-grains has been obtained.
摘要:
A phosphor-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Sn of 4 to 15 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Zn of 0.1 to 7.5 mass % as needed, and further containing one or more kinds of Pb of 0.01 to 4.5 mass %, Bi of 0.01 to 3.0 mass %, Se of 0.03 to 1.0 mass %, and Te of 0.01 to 1.0 mass % as needed.
摘要:
We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________ in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength. Specifically, it can be used for electric wires with high mechanical requirements and/or high annealing temperatures, for high-risk applications and for electrical wires and components in the electronic and micro-electronic industry.
摘要翻译:我们提供一种新的铜微合金,具有高导电性,优异的耐热性和高应变强度,这可以通过常规的连续或半连续铸造获得,其基本上由至少一种选自下列的元素组成:5-800 mg / Kg Pb(铅) - 10-100 mg / Kg Sb(锑) - 5-1000 mg / Kg Ag(银) - 5-700 mg / Kg Sn(锡) - 1-25 mg / Kg Cd ) - 1-30 mg / Kg Bi(铋) - 20-500 mg / Kg Zn(锌) - 10-400 mg / Kg Fe(铁) - 15-500 mg / Kg Ni(镍) - 1-15 mg / Kg S(硫) - 在所有情况下,含有20-500 mg / Kg O(氧气)。 该合金适用于需要类似于纯铜的电导率的所有应用,但具有更好的耐热性,更好的机械性能和较低的应变强度标准偏差值。 具体地说,它可用于高机械要求和/或高退火温度的电线,用于高风险应用以及电子和微电子工业中的电线和元件。
摘要:
A Cu-Pb system composite bearing has three layers including a backing metal, a bearing alloy layer formed on the backing metal, and an overlay formed on the bearing alloy layer. The Cu-Pb bearing alloy contains 2 to 10% Ni and 0.05 to 1.0% B. An example of the composition of the Cu-Pb system bearing alloy consists of 0.5 to 8% Sn, 15 to 30% Pb, 0.2% or less P, 2 to 10% Ni, 0.05 to 1.0% B and the balance of Cu and unavoidable impurities. The Cu-Pb bearing alloy must have a hardness over HV80. Ni and B contained in the bearing alloy decrease the affinity of the Cu-Pb bearing alloy for tin in the overlay of a tin-containing lead alloy. The corrosion resistance of the bearing is improved by plating the both surfaces of the composite bearing with Sn, Pb or an alloy thereof.
摘要:
A multilayer sliding material for high-speed engine, comprising a steel back metal, a Cu or Cu-base alloy plating layer, a Cu-Pb bearing alloy layer, and an overlay, said steel back metal having 155 or more of Vickers hardness and 42 kgf/mm.sup.2 or more of 0.2% yield strength, a Cu-Pb bearing alloy layer containing 15-30 wt % of Pb and 0.5-2.0 wt % of Sn and having 0.25 cal/cm.s..degree. C. or more of thermal conductivity, 75 or more of Vickers hardness and 18 kgf/mm.sup.2 or more of tensile strength, said overlay of a lead base alloy containing 2-8 wt % of Sn and 3-11 wt % of In and having more than 250.degree. C. of melting start temperature. The material has a superior antiseizure property at high speed of engine. In particular, the rising of the melting start temperature of the metal of the overlay and the thermal conductivity of the bearing alloy provides a superior sliding property of plain bearing at high speed of engine.
摘要:
Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.
摘要:
The sliding member of the invention comprises a steel backing and a sintered Cu-alloy layer mounted integrally on one surface of the backing metal, wherein the sintered Cu-alloy comprises 1 to 15% Sn, 1 to 20% Ni-B compound, 1% or less phosphorus, and the balance of Cu and impurities. Cu-alloy may further contain 1 to 30% Pb and/or 0.5 to 8% graphite. Pb and graphite provide the sliding alloy layer with good lubrication property. Preferably the Ni-B compound is used, which is composed of 7 to 15% B and the balance of Ni and impurities.
摘要:
The properties of copper-tin-lead alloys are improved with respect to mechanical resistance and resistance to corrosion by the incorporation therein, in specific proportions of nickel. Antifriction layers on steel supporting strips are obtained by sintering and rolling onto steel strips metal powder particles obtained by powdering a metal alloy of 2-10% nickel, 8-27% lead, 0.5-10% tin and the balance copper.