摘要:
The invention provides a method of manufacturing a semiconductor device including a non-volatile memory with high yield, and a semiconductor device manufactured by the method. A method of manufacturing a semiconductor device includes a process of forming a second side wall such that the width of the second side wall, which is formed on the side of a portion of a second gate electrode that does not face dummy gates on a drain forming region side, in a gate length direction is larger than that of the second side wall, which is formed on the side of the second gate electrode on a source forming region side, in the gate length direction, in a non-volatile memory forming region.
摘要:
An electrical fuse including a polysilicon layer; a silicide layer formed over the polysilicon layer; and a first metal contact and a second metal contact arranged over the silicide layer, while being spaced from each other, the electrical fuse being configured so that the silicide layer, after disconnection, is excluded from a region right under the second metal contact, and from a region between the second metal contact and the first metal contact is provided.
摘要:
A vapor deposition material which is a sintered body of zirconia containing a stabilizer, wherein the content of monoclinic phase is from 25 to 70%, the content of tetragonal phase is at most 3% and the rest is cubic phase, and of which the bulk density is from 3.0 to 5.0 g/cm.sup.3, the porosity is from 15 to 50%, the mode size of pores is from 0.5 to 3 .mu.m, and the volume of pores of from 0.1 to 5 .mu.m constitutes at least 90% of the total pore volume.
摘要翻译:作为含有稳定剂的氧化锆烧结体的气相沉积材料,其中单斜相含量为25〜70%,四方相为3%以下,其余为立方相,其中体积 密度为3.0〜5.0g / cm 3,孔隙率为15〜50%,孔的模尺寸为0.5〜3μm,孔的体积为0.1〜5μm构成至少90% 总孔体积。
摘要:
A high strength metal working tool such as cutting tools and dies made of a zirconia-base sintered material comprising 50 to 98 weight percent of zirconia (ZrO.sub.2) containing 1.5 to 5 mol percent of yttira (Y.sub.2 O.sub.3) and 50 to 2 weight percent of alumina (Al.sub.2 O.sub.3) and/or spinel (MgAl.sub.2 O.sub.4) and having a three point bending strength of not less than 1700 MPa.
摘要翻译:一种高强度金属加工工具,例如由氧化锆基烧结材料制成的切削工具和模具,其包含50至98重量%的含有1.5-5摩尔%的钇(Y 2 O 3)的氧化锆(ZrO 2)和50至2重量%的氧化铝 (Al 2 O 3)和/或尖晶石(MgAl 2 O 4),并且具有不低于1700MPa的三点弯曲强度。
摘要:
This invention describes a water-impermeable elastomer-coated cloth composite in which the end sections of mutually adjacent elastomer-coated cloths are overlapped and sewn together in such a way that the thread passes up and down through this overlapped section. After a seam is sewn together, it is covered by an adhesive tape applied so that it extends over the sewn section of the seam and onto the portion of each section of the cloth beyond the sewn section to form a strong, watertight, airtight composite.
摘要:
In a method of manufacturing a semiconductor device, element properties of an element property extraction pattern formed on a semiconductor wafer is extracted as element properties of a current control element corresponding to the element property extraction pattern. A supply energy to the current control element is set which is formed between nodes on the semiconductor wafer, based on the extracted element properties. The set supply energy is supplied to the current control element to irreversible control an electrical connection between the nodes through the device breakdown by the current control element.
摘要:
An electrical fuse including a polysilicon layer; a silicide layer formed over the polysilicon layer; and a first metal contact and a second metal contact arranged over the silicide layer, while being spaced from each other, the electrical fuse being configured so that the silicide layer, after disconnection, is excluded from a region right under the second metal contact, and from a region between the second metal contact and the first metal contact is provided.
摘要:
A semiconductor device (200) includes an electric fuse (100) including: an upper layer fuse interconnect (112) formed on a substrate (not shown); a lower layer fuse interconnect (122); and a via (130) which is connected to one end of the upper layer fuse interconnect (112) and connects the upper layer fuse interconnect (112) and the lower layer fuse interconnect (122). The upper fuse interconnect (112) includes a width varying region (118) having a small interconnect width on a side of the one end.