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公开(公告)号:US20110241202A1
公开(公告)日:2011-10-06
申请号:US12750468
申请日:2010-03-30
申请人: Tzuan-Horng Liu , Shang-Yun Hou , Shin-Puu Jeng , Wei-Cheng Wu , Hsiu-Ping Wei , Chih-Hua Chen , Chen-Cheng Kuo , Chen-Shien Chen , Ming Hung Tseng
发明人: Tzuan-Horng Liu , Shang-Yun Hou , Shin-Puu Jeng , Wei-Cheng Wu , Hsiu-Ping Wei , Chih-Hua Chen , Chen-Cheng Kuo , Chen-Shien Chen , Ming Hung Tseng
IPC分类号: H01L23/485
CPC分类号: H01L23/585 , H01L23/552 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/1147 , H01L2224/11912 , H01L2224/13022 , H01L2224/13147 , H01L2224/13655 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2224/05552 , H01L2924/00
摘要: An integrated circuit structure includes a semiconductor chip, a metal pad at a major surface of the semiconductor chip, and an under-bump metallurgy (UBM) over and contacting the metal pad. A metal bump is formed over and electrically connected to the UBM. A dummy pattern is formed at a same level, and formed of a same metallic material, as the metal pad.
摘要翻译: 集成电路结构包括半导体芯片,在半导体芯片的主表面处的金属焊盘和在凸块下金属(UBM)上方并接触金属焊盘。 金属凸块形成在UBM上并与UBM电连接。 在同一水平上形成虚拟图案,并由与金属垫相同的金属材料形成。