Plasma Doping Method and Apparatus
    11.
    发明申请
    Plasma Doping Method and Apparatus 审中-公开
    等离子体掺杂法和装置

    公开(公告)号:US20090181526A1

    公开(公告)日:2009-07-16

    申请号:US11887381

    申请日:2006-03-30

    IPC分类号: H01L21/22 C23C16/00

    摘要: An object of the invention is to provide a plasma doping method and a plasma doping apparatus in which uniformity of concentration of impurities introduced into a sample surface are excellent.The plasma doping apparatus of the invention introduces a predetermined mass flow of gas from a gas supply device (2) into a vacuum chamber (1) while discharging the gas through an exhaust port (11) by a turbo-molecular pump (3), which is an exhaust device in order to maintain the vacuum chamber (1) under a predetermined pressure by a pressure adjusting valve (4). A high-frequency power source (5) supplies high-frequency power of 13.56 MHz to a coil (8) disposed in the vicinity of a dielectric window (7) opposite a sample electrode (6) in order to generate an inductively coupled plasma in the vacuum chamber (1). A high-frequency power source (10) for supplying high-frequency power to the sample electrode (6) is provided. A sum of an area of an opening of a gas flow-off port (15) opposed to a center portion of the sample electrode (6) is configured to be smaller than that of an area of an opening of the gas flow-off port (15) opposed to a peripheral portion of the sample electrode (6) in order to improve the uniformity.

    摘要翻译: 本发明的目的是提供一种等离子体掺杂方法和等离子体掺杂装置,其中引入样品表面的杂质的浓度均匀。 本发明的等离子体掺杂装置通过涡轮分子泵(3)将气体从气体供给装置(2)引入真空室(1),同时通过排气口排出气体, 其是为了通过压力调节阀(4)将真空室(1)保持在预定压力下的排气装置。 高频电源(5)向布置在与样品电极(6)相对的电介质窗口(7)附近的线圈(8)提供13.56MHz的高频功率,以便产生电感耦合等离子体 真空室(1)。 提供了一种用于向样品电极(6)提供高频电力的高频电源(10)。 与样品电极(6)的中心部分相对的气体流出口(15)的开口面积的总和被构造成小于气体流出口的开口面积的面积 (15)与样品电极(6)的周边部分相对,以提高均匀性。

    Plasma Doping Method and Plasma Processing Device
    12.
    发明申请
    Plasma Doping Method and Plasma Processing Device 失效
    等离子体掺杂法和等离子体处理装置

    公开(公告)号:US20090176355A1

    公开(公告)日:2009-07-09

    申请号:US11887323

    申请日:2006-03-29

    IPC分类号: H01L21/425 C23C16/513

    摘要: An object of the invention is to provide a plasma doping method excellent in the uniformity of concentration of impurities introduced into the surface of a sample and a plasma processing device capable of uniformly performing plasma processing of a sample.In a plasma doping device according to the invention, a vacuum chamber (1) is evacuated with a turbo-molecular pump (3) as an exhaust device via a exhaust port 11 while a predetermined gas is being introduced from a gas supply device (2) in order to maintain the inside of the vacuum chamber (1) to a predetermined pressure with a pressure regulating valve (4). A high-frequency power of 13.56 MHz is supplied by a high-frequency power source (5) to a coil (8) provided in the vicinity of a dielectric window (7) opposed to a sample electrode (6) to generate inductive-coupling plasma in the vacuum chamber (1). A high-frequency power source (10) for supplying a high-frequency power to the sample electrode (6) is provided. Uniformity of processing is enhanced by driving a gate shutter (18) and covering a through gate (16).

    摘要翻译: 本发明的目的是提供一种等离子体掺杂方法,该等离子体掺杂方法在引入样品表面的杂质的浓度均匀性和等离子体处理装置中均匀地进行等离子体处理。 在根据本发明的等离子体掺杂装置中,在从气体供给装置(2)引入预定气体的同时,通过排气口11,用作为排气装置的涡轮分子泵(3)将真空室(1)抽真空 ),以便通过压力调节阀(4)将真空室(1)的内部保持在预定压力。 高频电源(5)将13.56MHz的高频功率提供给设置在与样品电极(6)相对的电介质窗口(7)附近的线圈(8),以产生电感耦合 真空室(1)中的等离子体。 提供了用于向样品电极(6)提供高频电力的高频电源(10)。 通过驱动闸门(18)并覆盖通过门(16)来增强处理的均匀性。

    Plasma processing method and plasma processing apparatus
    13.
    发明授权
    Plasma processing method and plasma processing apparatus 失效
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US07858155B2

    公开(公告)日:2010-12-28

    申请号:US11666773

    申请日:2005-10-27

    IPC分类号: A61N5/00 G21G5/00

    摘要: It is intended to provide a plasma processing method and apparatus capable of increasing the uniformity of amorphyzation processing.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 through a gas inlet 11 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus through an exhaust hole 12. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided and functions as a voltage source for controlling the potential of the sample electrode 6. A surface crystal layer of a silicon wafer 9 was rendered amorphous successfully by improving the structure of the sample-electrode 6.

    摘要翻译: 本发明旨在提供一种能够提高薰蒸处理的均匀性的等离子体处理方法和装置。 通过排气孔12,通过作为排气装置的涡轮分子泵3排出,通过气体入口11将气体从气体供给装置2引入真空容器1。真空容器1内的压力保持在 通过压力调节阀4的规定值。13.56MHz的高频电力从高频电源5供给到靠近与样品电极6相对的电介质窗7的线圈8, 在真空容器1中产生耦合等离子体。提供用于向样品电极6提供高频电力的高频电源10,并且用作用于控制样品电极6的电位的电压源。表面晶体 通过改善样品电极6的结构,使硅晶片9的层成为无定形。

    Plasma Processing Method and Plasma Processing Apparatus
    15.
    发明申请
    Plasma Processing Method and Plasma Processing Apparatus 失效
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US20080258082A1

    公开(公告)日:2008-10-23

    申请号:US11666773

    申请日:2005-10-27

    IPC分类号: G21G5/00

    摘要: It is intended to provide a plasma processing method and apparatus capable of increasing the uniformity of amorphyzation processing.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 through a gas inlet 11 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus through an exhaust hole 12. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided and functions as a voltage source for controlling the potential of the sample electrode 6. A surface crystal layer of a silicon wafer 9 was rendered amorphous successfully by improving the structure of the sample-electrode 6.

    摘要翻译: 本发明旨在提供一种能够提高薰蒸处理的均匀性的等离子体处理方法和装置。 通过排气孔12通过作为排气装置的涡轮分子泵3排出,将规定的气体从气体供给装置2经由气体入口11导入真空容器1。 真空容器1中的压力通过压力调节阀4保持在规定值。 从高频电源5将13.56MHz的高频电力供给到与样品电极6相对的电介质窗7附近设置的线圈8,由此在真空容器1内产生感应耦合等离子体 。 提供了用于向样品电极6提供高频电力的高频电源10,并且用作用于控制样品电极6的电位的电压源。 通过改善样品电极6的结构,使硅晶片9的表面晶体层成为非晶体。

    Plasma doping method with gate shutter
    16.
    发明授权
    Plasma doping method with gate shutter 失效
    等离子体掺杂法与栅极快门

    公开(公告)号:US08652953B2

    公开(公告)日:2014-02-18

    申请号:US13560648

    申请日:2012-07-27

    IPC分类号: H01L21/26 H01L21/42

    摘要: In a plasma doping device according to the invention, a vacuum chamber is evacuated with a turbo-molecular pump as an exhaust device via a exhaust port while a predetermined gas is being introduced from a gas supply device in order to maintain the inside of the vacuum chamber to a predetermined pressure with a pressure regulating valve. A high-frequency power of 13.56 MHz is supplied by a high-frequency power source to a coil provided in the vicinity of a dielectric window opposed to a sample electrode to generate inductive-coupling plasma in the vacuum chamber. A high-frequency power source for supplying a high-frequency power to the sample electrode is provided. Uniformity of processing is enhanced by driving a gate shutter and covering a through gate.

    摘要翻译: 在根据本发明的等离子体掺杂装置中,在从气体供给装置引入预定气体的同时,通过排气口将涡轮分子泵作为排气装置抽真空室,以保持真空内部 通过压力调节阀到达预定压力。 13.56MHz的高频功率由高频电源提供给设置在与样品电极相对的电介质窗口附近的线圈,以在真空室中产生电感耦合等离子体。 提供了用于向样品电极提供高频电力的高频电源。 通过驱动闸门并覆盖通过门来增强处理的均匀性。

    Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device
    17.
    发明授权
    Method for forming impurity-introduced layer, method for cleaning object to be processed apparatus for introducing impurity and method for producing device 有权
    形成杂质导入层的方法,用于清洗待加工物体的方法,用于引入杂质的方法及其制造方法

    公开(公告)号:US07759254B2

    公开(公告)日:2010-07-20

    申请号:US10569464

    申请日:2004-08-25

    IPC分类号: H01L21/302

    CPC分类号: H01L21/02052 H01L21/2236

    摘要: A method of forming an impurity-introduced layer is disclosed. The method includes at least a step of forming a resist pattern on a principal face of a solid substrate such as a silicon substrate (S27); a step of introducing impurity into the solid substrate through plasma-doping in ion mode (S23), a step of removing a resist (S28), a step of cleaning metal contamination and particles attached to a surface of the solid substrate (S25a); a step of anneal (S26). The step of removing a resist (S28) irradiates the resist with oxygen-plasma or brings mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the resist. The step of cleaning (S25a) brings mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the principal face of the solid substrate. The step of removing a resist (S28) and the step of cleaning (S25a) can be conducted simultaneously by bringing mixed solution of sulfuric acid and hydrogen peroxide water, or mixed solution of NH4OH, H2O2 and H2O into contact with the principal face of the solid substrate.

    摘要翻译: 公开了一种形成杂质导入层的方法。 该方法至少包括在诸如硅衬底的固体衬底的主面上形成抗蚀剂图案的步骤(S27); 通过离子模式的等离子体掺杂(S23)将杂质引入固体基板的步骤,去除抗蚀剂的步骤(S28),清洁附着在固体基板表面上的金属污染物和颗粒的步骤(S25a); 退火步骤(S26)。 去除抗蚀剂的步骤(S28)用氧等离子体照射抗蚀剂,或者将硫酸和过氧化氢水的混合溶液,或NH 4 OH,H 2 O 2和H 2 O的混合溶液与抗蚀剂接触。 清洗步骤(S25a)将硫酸和过氧化氢水或NH 4 OH,H 2 O 2和H 2 O的混合溶液混合溶液与固体基质的主面接触。 除去抗蚀剂(S28)和清洗步骤(S25a)的步骤可以通过将硫酸和过氧化氢水的混合溶液或NH 4 OH,H 2 O 2和H 2 O的混合溶液与主要面接触来同时进行 固体基质。

    PLASMA DOPING METHOD AND APPARATUS
    18.
    发明申请
    PLASMA DOPING METHOD AND APPARATUS 失效
    等离子喷涂方法和装置

    公开(公告)号:US20100098837A1

    公开(公告)日:2010-04-22

    申请号:US12648142

    申请日:2009-12-28

    IPC分类号: C23C16/52 H05H1/24 C23C16/448

    摘要: It is intended to provide a plasma doping method and apparatus which are superior in the controllability of the concentration of an impurity that is introduced into a surface layer of a sample.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided. Every time a prescribed number of samples have been processed, a dummy sample is subjected to plasma doping and then to heating. The conditions for processing of a sample are controlled so that the measurement value of the surface sheet resistance becomes equal to a prescribed value, whereby the controllability of the impurity concentration can be increased.

    摘要翻译: 旨在提供一种等离子体掺杂方法和装置,该等离子体掺杂方法和装置在引入样品的表面层中的杂质的浓度的可控性方面是优异的。 将规定的气体从作为排气装置的涡轮分子泵3排出而从气体供给装置2引入真空容器1。 真空容器1中的压力通过压力调节阀4保持在规定值。13.56MHz的高频电力从高频电源5供给到靠近电介质窗7设置的线圈8, 与样品电极6相对,从而在真空容器1中产生感应耦合等离子体。提供了用于向样品电极6提供高频电力的高频电源10。 每当处理规定数量的样品时,将虚拟样品进行等离子体掺杂,然后进行加热。 控制处理样品的条件使得表面薄层电阻的测量值等于规定值,从而可以提高杂质浓度的可控性。

    Method and Apparatus for Plasma Processing
    19.
    发明申请
    Method and Apparatus for Plasma Processing 失效
    等离子体处理方法和装置

    公开(公告)号:US20090068769A1

    公开(公告)日:2009-03-12

    申请号:US11887821

    申请日:2006-04-04

    IPC分类号: H01L21/66 G21K5/00

    摘要: An object of the invention is to provide a method and an apparatus for plasma processing which can accurately monitor an ion current applied to the surface of a sample.Predetermined gas is exhausted via an exhaust port 11 by a turbo-molecular pump 3 while introducing the gas within the vacuum chamber 1 from a gas supply device 2, and the pressure within the vacuum chamber 1 is kept at a predetermined value by a pressure regulating valve 4. A high-frequency power supply 5 for a plasma source supplies a high-frequency power to a coil 8 provided near a dielectric window 7 to generate inductively coupled plasma within the vacuum chamber 1. A high-frequency power supply 10 for the sample electrode for supplying the high-frequency power to the sample electrode 6 is provided. A matching circuit 13 for the sample electrode and a high-frequency sensor 14 are provided between the sample electrode high-frequency power supply and the sample electrode 6. An ion current applied to the surface of a sample can be accurately monitored buy using the high-frequency sensor 14 and an arithmetic device 15.

    摘要翻译: 本发明的目的是提供一种等离子体处理的方法和装置,其可以精确地监测施加在样品表面上的离子电流。 通过涡轮分子泵3通过排气口11排出预定气体,同时从气体供给装置2将真空室1内的气体导入,并通过压力调节将真空室1内的压力保持在规定值 用于等离子体源的高频电源5向设置在电介质窗口7附近的线圈8提供高频电力,以在真空室1内产生电感耦合等离子体。一高频电源10用于 提供了用于向样品电极6提供高频电力的样品电极。 在样品电极高频电源和样品电极6之间设置用于采样电极和高频传感器14的匹配电路13。可以使用高电平来准确地监测施加到样品表面的离子电流 频率传感器14和运算装置15。

    Method for introducing impurities
    20.
    发明授权
    Method for introducing impurities 失效
    引入杂质的方法

    公开(公告)号:US07456085B2

    公开(公告)日:2008-11-25

    申请号:US10597716

    申请日:2005-02-04

    IPC分类号: H01L21/26 H01L21/42

    CPC分类号: H01L21/2236

    摘要: To provide an impurity introducing method which can repeatedly carry out such a process that plasma irradiation for realization of amorphous and plasma doping were combined, in such a situation that steps are simple and through-put is high, without destroying an apparatus.At the time of switching over plasmas which are used in plasma irradiation for realization of amorphous and plasma doping, electric discharge is stopped, and an initial condition of a matching point of a high frequency power supply and a peripheral circuit is reset so as to adapt to plasma which is used in each step, or at the time of switching, a load, which is applied to the high frequency power supply etc., is reduced by increasing pressure and decreasing a bias voltage.

    摘要翻译: 为了提供可以重复进行等离子体放电以实现非晶态和等离子体掺杂的方法,在步骤简单且易于投入的情况下,不会破坏装置的方法。 在用于等离子体等离子体掺杂的等离子体照射中使用的等离子体切换时,停止放电,并且复位高频电源和外围电路的匹配点的初始状态,以适应 对于每个步骤中使用的等离子体,或者在切换时,通过增加压力和降低偏置电压来减小施加到高频电源等的负载。