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    Semiconductor device using a group III nitride-based semiconductor
    11.
    发明授权
    Semiconductor device using a group III nitride-based semiconductor 有权
    使用III族氮化物基半导体的半导体器件

    公开(公告)号：US08674407B2

    公开(公告)日：2014-03-18

    申请号：US12919640

    申请日：2009-03-12

    申请人： Yuji Ando ,  Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Tatsuo Nakayama ,  Hironobu Miyamoto

    发明人： Yuji Ando ,  Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Tatsuo Nakayama ,  Hironobu Miyamoto

    IPC分类号： H01L29/66

    CPC分类号： H01L29/7783 ,  H01L29/2003 ,  H01L29/4236 ,  H01L29/518 ,  H01L29/7785

    摘要： The present invention provides a semiconductor device having such a structure formed by sequentially laminating a lower barrier layer composed of lattice-relaxed AlxGa1-xN (0≦x≦1), a channel layer composed of InyGa1-yN (0≦y≦1) with compressive strain and a contact layer composed of AlzGa1-zN (0≦z≦1), wherein a two-dimensional electron gas is produced in the vicinity of an interface of said InyGa1-yN channel layer with said AlzGa1-zN contact layer; a gate electrode is formed so as to be embedded in the recessed portion with intervention of an insulating film, which recessed portion is formed by removing a part of said AlzGa1-zN contact layer by etching it away until said InyGa1-yN channel layer is exposed; and, ohmic electrodes are formed on the AlzGa1-zN contact layer. Thus, the semiconductor device has superior uniformity and reproducibility of the threshold voltage while maintaining a low gate leakage current, and is also applicable to the enhancement mode type.

    摘要翻译： 本发明提供一种具有这样的结构的半导体器件，该半导体器件通过依次层叠由晶格弛豫的Al x Ga 1-x N（0 @ x @ 1）构成的下阻挡层，由InyGa1-yN（0 @ y @ 1） 具有压应变和由Al z Ga 1-z N（0 @ z @ 1）组成的接触层，其中在所述In y Ga 1-y N沟道层与所述Al z Ga 1-z N接触层的界面附近产生二维电子气; 通过介入绝缘膜形成嵌入在凹陷部分中的栅电极，该凹陷部分通过蚀刻除去所述AlzGa1-zN接触层的一部分而形成，直到所述In y Ga 1-y N沟道层暴露 ; 并且在AlzGa1-zN接触层上形成欧姆电极。 因此，半导体器件在保持低栅极漏电流的同时具有优异的阈值电压的均匀性和再现性，并且也适用于增强型。

    BIPOLAR TRANSISTOR
    12.
    发明申请
    BIPOLAR TRANSISTOR 有权
    双极晶体管

    公开(公告)号：US20110241075A1

    公开(公告)日：2011-10-06

    申请号：US13124872

    申请日：2009-10-16

    申请人： Yuji Ando ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yasuhiro Okamoto ,  Takashi Inoue ,  Kazuki Ota

    发明人： Yuji Ando ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yasuhiro Okamoto ,  Takashi Inoue ,  Kazuki Ota

    IPC分类号： H01L29/737

    CPC分类号： H01L29/7371 ,  H01L29/045 ,  H01L29/2003

    摘要： A bipolar transistor includes: a substrate; a collector and a base layer with a p-conductive-type, an emitter layer with an n-conductive-type. The collector layer is formed above the substrate and includes a first nitride semiconductor. The base layer with the p-conductive-type is formed on the collector layer and includes a second nit ride semiconductor. The emitter layer with the n-conductive-type is formed on the base layer and includes a third nitride semiconductor. The collector layer, the base layer and the emitter layer are formed so that crystal growing directions with respect to a surface of the substrate are in parallel to a [0001] direction of the substrate. The first nitride semiconductor includes: InycAlxcGa1-xc-ycN (0≦xc≦1, 0≦yc≦1, 0

    摘要翻译： 双极晶体管包括：基板; 具有p导电型的集电极和基极层，具有n导电型的发射极层。 集电极层形成在衬底上方并且包括第一氮化物半导体。 具有p型导电型的基底层形成在集电极层上，并且包括第二耐磨半导体。 具有n导电型的发射极层形成在基极层上并且包括第三氮化物半导体。 形成集电体层，基极层和发射极层，使得相对于基板的表面的晶体生长方向与基板的[0001]方向平行。 第一氮化物半导体包括：InycAlxcGa1-xc-ycN（0＆nlE; xc＆nlE; 1,0＆amp; nlE; yc＆nlE; 1,0

    SEMICONDUCTOR DEVICE
    13.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20140084300A1

    公开(公告)日：2014-03-27

    申请号：US14117763

    申请日：2012-05-15

    申请人： Yasuhiro Okamoto ,  Yuji Ando ,  Tatsuo Nakayama ,  Takashi Inoue ,  Kazuki Ota

    发明人： Yasuhiro Okamoto ,  Yuji Ando ,  Tatsuo Nakayama ,  Takashi Inoue ,  Kazuki Ota

    IPC分类号： H01L29/778 ,  H01L29/20

    CPC分类号： H01L29/7787 ,  H01L29/2003 ,  H01L29/201 ,  H01L29/205 ,  H01L29/4236 ,  H01L29/517 ,  H01L29/66462 ,  H01L29/7783 ,  H01L29/7786

    摘要： A field effect transistor includes a substrate and a semiconductor layer provided on the substrate, wherein the semiconductor layer includes a lower barrier layer provided on the substrate, Ga-face grown, lattice relaxed, and having a composition In1-zAlzN (0≦z≦1), a channel layer having a composition of: AlxGa1-xN (0≦x≦1) or InyGa1-yN (0≦y≦1). Or GaN provided on and lattice-matched to the lower barrier layer, a source electrode and a drain electrode having ohmic contact to an upper part of the semiconductor layers, disposed spaced to each other, and a gate electrode arranged via a gate insulating film in a region lying between the source electrode and the drain electrode.

    摘要翻译： 场效应晶体管包括衬底和设置在衬底上的半导体层，其中半导体层包括设置在衬底上的下阻挡层，生长Ga面，晶格弛豫并具有组成In 1-z Al z N（0＆nl; z＆nl E; 1），具有以下组成的沟道层：Al x Ga 1-x N（0＆amp; nlE; x＆nlE; 1）或In y Ga 1-y N（0＆nlE; y＆nlE; 1）。 或提供在栅极绝缘膜上并与栅极绝缘膜配置的栅电极，栅极配置在栅极绝缘膜上，栅电极配置在栅极绝缘膜上， 位于源电极和漏电极之间的区域。

    SEMICONDUCTOR DEVICE
    14.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20110006346A1

    公开(公告)日：2011-01-13

    申请号：US12919640

    申请日：2009-03-12

    申请人： Yuji Ando ,  Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Tatsuo Nakayama ,  Hironobu Miyamoto

    发明人： Yuji Ando ,  Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Tatsuo Nakayama ,  Hironobu Miyamoto

    IPC分类号： H01L29/737

    CPC分类号： H01L29/7783 ,  H01L29/2003 ,  H01L29/4236 ,  H01L29/518 ,  H01L29/7785

    摘要： The present invention provides a semiconductor device that has high electron mobility while reducing a gate leakage current, and superior uniformity and reproducibility of the threshold voltage, and is also applicable to the enhancement mode type. The semiconductor device according to the present invention is a semiconductor device having such a structure formed by sequentially laminating a lower barrier layer composed of lattice-relaxed AlxGa1-xN (0≦x≦1), a channel layer composed of InyGa1-yN (0≦y≦1) with compressive strain and a contact layer composed of AlzGa1-zN (0≦z≦1), wherein a two-dimensional electron gas is produced in the vicinity of an interface of said InyGa1-yN channel layer with said AlzGa1-zN contact layer; a gate electrode is formed so as to be embedded in the recessed portion with intervention of an insulating film, which recessed portion is formed by removing a part of said AlzGa1-zN contact layer by etching it away until said InyGa1-yN channel layer is exposed; and, ohmic electrodes are formed on the AlzGa1-zN contact layer. Thus, there is provided a semiconductor device that has superior uniformity and reproducibility of the threshold voltage while maintaining a low gate leakage current and high electron mobility, and thereby, is capable of operation in enhancement mode.

    摘要翻译： 本发明提供了一种在降低栅极漏电流的同时具有高电子迁移率并具有优异的阈值电压的均匀性和再现性的半导体器件，并且也适用于增强型。 根据本发明的半导体器件是具有这样的结构的半导体器件，该半导体器件通过顺序地层叠由晶格弛豫的Al x Ga 1-x N（0＆lt; n 1; x＆n 1; 1）构成的下阻挡层，由InyGa1-yN（0＆ ; y＆nlE; 1）具有压应变和由AlzGa1-zN（0＆amp; nlE; z＆nlE; 1）组成的接触层，其中在所述In y Ga 1-y N沟道层的界面附近产生二维电子气体与所述AlzGa1 -zN接触层 通过介入绝缘膜形成嵌入在凹陷部分中的栅电极，该凹陷部分通过蚀刻除去所述AlzGa1-zN接触层的一部分而形成，直到所述In y Ga 1-y N沟道层暴露 ; 并且在AlzGa1-zN接触层上形成欧姆电极。 因此，提供了具有优异的阈值电压的均匀性和再现性的半导体器件，同时保持低栅极漏电流和高电子迁移率，从而能够在增强模式下操作。

    FIELD EFFECT TRANSISTOR
    15.
    发明申请
    FIELD EFFECT TRANSISTOR 审中-公开
    场效应晶体管

    公开(公告)号：US20090267114A1

    公开(公告)日：2009-10-29

    申请号：US12295104

    申请日：2007-03-23

    申请人： Tatsuo Nakayama ,  Yuji Ando ,  Hironobu Miyamoto ,  Yasuhiro Okamoto ,  Takashi Inoue ,  Kazuki Ota ,  Yasuhiro Murase ,  Naotaka Kuroda

    发明人： Tatsuo Nakayama ,  Yuji Ando ,  Hironobu Miyamoto ,  Yasuhiro Okamoto ,  Takashi Inoue ,  Kazuki Ota ,  Yasuhiro Murase ,  Naotaka Kuroda

    IPC分类号： H01L29/772 ,  H01L29/205

    CPC分类号： H01L29/7787 ,  H01L29/2003 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/8128

    摘要： A field effect transistor 100 includes a group III-V nitride semiconductor layer structure containing a hetero junction, a source electrode 105 and a drain electrode 106 formed on the group III-V nitride semiconductor layer structure to be spaced apart from each other; a gate electrode 110 arranged between the source electrode 105 and the drain electrode 106, and an insulating layer 107 provided over, and in contact with, the group III-V nitride semiconductor layer structure in a region between the gate electrode 110 and the drain electrode 106 or in a region between the source electrode 105 and the gate electrode 110. A portion of the gate electrode 110 is buried in the group III-V nitride semiconductor layer structure, and a side edge of the gate electrode in an interface of the group III-V nitride semiconductor layer and the insulating layer 107 is spaced apart from the gate electrode 110.

    摘要翻译： 场效应晶体管100包括在III-V族氮化物半导体层结构上彼此间隔开的含有异质结的III-V族氮化物半导体层结构，源电极105和漏电极106。 布置在源电极105和漏电极106之间的栅电极110以及在栅电极110和漏电极之间的区域中设置在III-V族氮化物半导体层结构上并与III-V族氮化物半导体层结构接触的绝缘层107 106或源极电极105和栅电极110之间的区域中。栅电极110的一部分被掩埋在III-V族氮化物半导体层结构中，并且栅极电极在该组的界面中的侧边缘 III-V族氮化物半导体层和绝缘层107与栅电极110间隔开。

    Semiconductor device, field-effect transistor, and electronic device
    17.
    发明授权
    Semiconductor device, field-effect transistor, and electronic device 有权
    半导体器件，场效应晶体管和电子器件

    公开(公告)号：US08659055B2

    公开(公告)日：2014-02-25

    申请号：US13497557

    申请日：2010-06-16

    申请人： Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yuji Ando

    发明人： Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yuji Ando

    IPC分类号： H01L29/66 ,  H01L21/336

    CPC分类号： H01L29/7813 ,  H01L29/1054 ,  H01L29/2003 ,  H01L29/201 ,  H01L29/205 ,  H01L29/267 ,  H01L29/41741 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/66734

    摘要： Provided is a semiconductor device capable of suppressing an occurrence of a punch-through phenomenon.A semiconductor device includes a substrate 1, a first n-type semiconductor layer 2, a p-type semiconductor layer 3, a second n-type semiconductor layer 4, a drain electrode 13, a source electrode 11, a gate electrode 12, and a gate insulation film 21, wherein the first n-type semiconductor layer 2, the p-type semiconductor layer 3, and the second n-type semiconductor layer 4 are laminated on the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 2. The source electrode 11 is in ohmic-contact with the second n-type semiconductor layer 4. An opening portion to be filled or a notched portion that extends from an upper surface of the second n-type semiconductor layer 4 to an upper part of the first n-type semiconductor layer 2 is formed at a part of the p-type semiconductor layer 3 and a part of the second n-type semiconductor layer 4. The gate electrode 12 is in contact with an upper surface of the first n-type semiconductor layer 2, side surfaces of the p-type semiconductor layer 3, and side surfaces of the second n-type semiconductor layer 4 at inner surfaces of the opening portion to be filled or a surface of the notched portion via the gate insulation film 21. The p-type semiconductor layer 3 has a positive polarization charge at a first n-type semiconductor layer 2 side in a state where a voltage is applied to none of the electrodes.

    摘要翻译： 提供能够抑制穿通现象发生的半导体装置。 半导体器件包括衬底1，第一n型半导体层2，p型半导体层3，第二n型半导体层4，漏极13，源电极11，栅电极12和 栅极绝缘膜21，其中第一n型半导体层2，p型半导体层3和第二n型半导体层4依次层压在基板1上。 漏电极13与第一n型半导体层2欧姆接触。源电极11与第二n型半导体层4欧姆接触。要填充的开口部分或延伸的缺口部分 从第二n型半导体层4的上表面到第一n型半导体层2的上部形成在p型半导体层3的一部分上，第二n型半导体层的一部分 栅电极12与第一n型半导体层2的上表面，p型半导体层3的侧表面和第二n型半导体层4的内表面的侧表面接触 待填充的开口部分或经由栅极绝缘膜21的切口部分的表面。在施加电压的状态下，p型半导体层3在第一n型半导体层2侧具有正极化电荷 没有电极。

    Group nitride bipolar transistor
    18.
    发明授权
    Group nitride bipolar transistor 有权
    组氮化物双极晶体管

    公开(公告)号：US08395237B2

    公开(公告)日：2013-03-12

    申请号：US13124872

    申请日：2009-10-16

    申请人： Yuji Ando ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yasuhiro Okamoto ,  Takashi Inoue ,  Kazuki Ota

    发明人： Yuji Ando ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yasuhiro Okamoto ,  Takashi Inoue ,  Kazuki Ota

    IPC分类号： H01L29/66 ,  H01L29/737

    CPC分类号： H01L29/7371 ,  H01L29/045 ,  H01L29/2003

    摘要： A bipolar transistor includes: a substrate; a collector and a base layer with a p-conductive-type, an emitter layer with an n-conductive-type. The collector layer is formed above the substrate and includes a first nitride semiconductor. The base layer with the p-conductive-type is formed on the collector layer and includes a second nit ride semiconductor. The emitter layer with the n-conductive-type is formed on the base layer and includes a third nitride semiconductor. The collector layer, the base layer and the emitter layer are formed so that crystal growing directions with respect to a surface of the substrate are in parallel to a [0001] direction of the substrate. The first nitride semiconductor includes: InycAlxcGa1-xc-ycN (0≦xc≦1, 0≦yc≦1, 0

    摘要翻译： 双极晶体管包括：基板; 具有p导电型的集电极和基极层，具有n导电型的发射极层。 集电极层形成在衬底上方并且包括第一氮化物半导体。 具有p型导电型的基底层形成在集电极层上，并且包括第二耐磨半导体。 具有n导电型的发射极层形成在基极层上并且包括第三氮化物半导体。 形成集电体层，基极层和发射极层，使得相对于基板的表面的晶体生长方向与基板的[0001]方向平行。 第一氮化物半导体包括：InycAlxcGa1-xc-ycN（0＆nlE; xc＆nlE; 1,0＆amp; nlE; yc＆nlE; 1,0

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
    20.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 失效
    半导体器件及其制造方法

    公开(公告)号：US20100327318A1

    公开(公告)日：2010-12-30

    申请号：US12735817

    申请日：2009-03-23

    申请人： Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yuji Ando

    发明人： Yasuhiro Okamoto ,  Kazuki Ota ,  Takashi Inoue ,  Hironobu Miyamoto ,  Tatsuo Nakayama ,  Yuji Ando

    IPC分类号： H01L29/205 ,  H01L29/78 ,  H01L21/336

    CPC分类号： H01L29/7813 ,  H01L29/2003 ,  H01L29/201 ,  H01L29/205 ,  H01L29/66734

    摘要： A semiconductor device capable of suppressing the occurrence of a punch-through phenomenon is provided. A first n-type conductive layer (2′) is formed on a substrate (1′). A p-type conductive layer (3′) is formed thereon. A second n-type conductive layer (4′) is formed thereon. On the under surface of the substrate (1′), there is a drain electrode (13′) connected to the first n-type conductive layer (2′). On the upper surface of the substrate (1′), there is a source electrode (11′) in ohmic contact with the second n-type conductive layer (4′), and a gate electrode (12′) in contact with the first n-type conductive layer (2′), p-type conductive layer (3′), the second n-type conductive layer (4′) through an insulation film (21′). The gate electrode (12′) and the source electrode (11′) are alternately arranged. The p-type conductive layer (3′) includes In.

    摘要翻译： 提供能够抑制穿通现象发生的半导体器件。 在基板（1'）上形成第一n型导电层（2'）。 在其上形成p型导电层（3'）。 在其上形成第二n型导电层（4'）。 在基板（1'）的下表面上，连接有第一n型导电层（2'）的漏电极（13'）。 在基板（1'）的上表面上存在与第二n型导电层（4'）欧姆接触的源电极（11'）和与第一n型导电层（4'）接触的栅电极（12'） n型导电层（2'），p型导电层（3'），通过绝缘膜（21'）的第二n型导电层（4'）。 栅电极（12'）和源电极（11'）交替排列。 p型导电层（3'）包括In。