-
公开(公告)号：US20190166417A1
公开(公告)日：2019-05-30
申请号：US15880446
申请日：2018-01-25
发明人： Jinghua Ye
摘要： The invention discloses a novel microphone structure and a flip-type electronic device, comprising: a first layer plate, an acoustic sensor and a circuit chip being connected to the first layer plate; a second layer plate, covered on the first layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through-holes located at two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effects of the technical schemes of the invention include: two acoustic through-holes are provided on the microphone acoustic cavity of the novel microphone structure, and the two acoustic through-holes are disposed on two opposing sides or two adjacent sides of the microphone acoustic cavity, such that sound received from inside corresponds to that received from outside when using the flip-type electronic device.
-
公开(公告)号：US20150195656A1
公开(公告)日：2015-07-09
申请号：US14308522
申请日：2014-06-18
发明人： Jinghua Ye
IPC分类号： H04R17/00
CPC分类号： H04R1/086 , H04R19/005 , H04R19/04
摘要： The invention relates to the technical field of voice processing equipment, more specifically, to a microphone. A new-type microphone structure comprises a first layer structure, a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals, which is arranged on the microphone acoustic cavity, and a dustproof component which covers the inside of the acoustic hole. The invention can prevent most of the dust particles and the moisture and the siphoning effect in actual use, which does not need to change the size of the existing microphone. It can be used in thin structures, and can prolong the service life of the microphone.
摘要翻译： 本发明涉及语音处理设备的技术领域，更具体地，涉及一种麦克风。 新型麦克风结构包括第一层结构，位于第一层结构上的第二层结构，由第一层结构和第二层结构形成的麦克风声腔，用于获取声音信号的至少一个声孔，其中 布置在麦克风声腔上，覆盖声孔内部的防尘部件。 本发明可以在实际使用中防止大部分灰尘颗粒，水分和虹吸效应，这不需要改变现有麦克风的尺寸。 可用于薄型结构，可延长麦克风的使用寿命。
-
公开(公告)号：US11849282B2
公开(公告)日：2023-12-19
申请号：US17665062
申请日：2022-02-04
发明人： Jinghua Ye
CPC分类号： H04R19/04 , G10L19/00 , H04R3/00 , H04R25/604 , H04R2201/003 , H04R2430/01
摘要： The invention relates to the technical field of microphones, in particular to an online trimmed MEMS microphone. The online trimmed MEMS microphone comprises an acoustic transducer for receiving an external ultrasonic signal and converting the ultrasonic signal into an electric signal; an ASIC (Application Specific Integrated Circuit) chip, coupled to the acoustic transducer, wherein the ASIC chip comprises: an amplifier unit for performing amplification on the electric signal and outputting an amplified signal; a decoding unit, connected to the amplifier unit, and configured to decode the amplified signal to obtain a decoded signal sequence; a matching unit, connected to the decoding unit, and configured to match the decoded signal sequence with a predetermined identification code to obtain a matched signal; a control unit, connected to the matching unit, and configured to generate one or more circuit adjusting parameters under the action of the matched signal.
-
公开(公告)号：US11197079B2
公开(公告)日：2021-12-07
申请号：US16942325
申请日：2020-07-29
发明人： Jinghua Ye
摘要： A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.
-
公开(公告)号：US11051093B2
公开(公告)日：2021-06-29
申请号：US16897123
申请日：2020-06-09
发明人： Jinghua Ye
摘要： The invention discloses a microphone structure with an improved substrate, comprising: a L-shaped substrate having an L-shaped normal cross section; an encapsulation shell, wherein the encapsulation shell and the L-shaped substrate form an acoustic cavity; the acoustic cavity is provided with: an acoustic transducer; an ASIC (Application Specific Integrated Circuit) chip, electrically connected to the acoustic transducer; and an acoustic through-hole disposed on the L-shaped substrate or the encapsulation shell. The present invention has the beneficial effects that, an L-shaped ceramic substrate is provided, a plurality of bonding pads are arranged on a vertical surface of the L-shaped substrate, so that electronic devices may be welded to the vertical surface of the L-shaped substrate, so that the problem of an excessive large area of the substrate being occupied by the electronic devices due to the presence of an excessive number of the electronic devices on the substrate may be avoided.
-
公开(公告)号：US11039254B2
公开(公告)日：2021-06-15
申请号：US16661326
申请日：2019-10-23
发明人： Jinghua Ye
摘要： The invention relates to the field of electronic technology, and more particularly, to a microphone structure. A MEMS (Micro-Electro-Mechanical System)-based bone conduction sensor comprises: a closed cavity within which a uniaxial or biaxial accelerometer sensor is arranged to be adjacent to bones of a human ear; an ASIC (application-specific integrated circuit) processing chip coupled to the uniaxial or biaxial accelerometer sensor, the ASIC processing chip being provided with an output end for a vibration signal. By adopting the above-mentioned technical solution, a bone conduction sensor with a closed cavity is provided in the present invention. Furthermore, a uniaxial or biaxial accelerometer sensor and an ASIC processing chip are arranged inside the closed cavity. In this way, the production costs are reduced, and interference of the sensor caused by ambient environment is reduced.
-
公开(公告)号：US20210136474A1
公开(公告)日：2021-05-06
申请号：US16897123
申请日：2020-06-09
发明人： Jinghua Ye
IPC分类号： H04R1/04
摘要： The invention discloses a microphone structure with an improved substrate, comprising: a L-shaped substrate having an L-shaped normal cross section; an encapsulation shell, wherein the encapsulation shell and the L-shaped substrate form an acoustic cavity; the acoustic cavity is provided with: an acoustic transducer; an ASIC (Application Specific Integrated Circuit) chip, electrically connected to the acoustic transducer; and an acoustic through-hole disposed on the L-shaped substrate or the encapsulation shell. The present invention has the beneficial effects that, an L-shaped ceramic substrate is provided, a plurality of bonding pads are arranged on a vertical surface of the L-shaped substrate, so that electronic devices may be welded to the vertical surface of the L-shaped substrate, so that the problem of an excessive large area of the substrate being occupied by the electronic devices due to the presence of an excessive number of the electronic devices on the substrate may be avoided.
-
公开(公告)号：US10547924B2
公开(公告)日：2020-01-28
申请号：US15880446
申请日：2018-01-25
发明人： Jinghua Ye
摘要： The invention discloses a novel microphone structure and a flip-type electronic device, comprising: a first layer plate, an acoustic sensor and a circuit chip being connected to the first layer plate; a second layer plate, covered on the first layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through-holes located at two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effects of the technical schemes of the invention include: two acoustic through-holes are provided on the microphone acoustic cavity of the novel microphone structure, and the two acoustic through-holes are disposed on two opposing sides or two adjacent sides of the microphone acoustic cavity, such that sound received from inside corresponds to that received from outside when using the flip-type electronic device.
-
公开(公告)号：US20190297405A1
公开(公告)日：2019-09-26
申请号：US15991787
申请日：2018-05-29
发明人： Jinghua Ye
摘要： The invention discloses a two-wire type microphone with ultrasonic identification, comprising: an acoustic transducer for capturing an acoustic signal; a signal processing chip, connected to a signal output terminal of the acoustic transducer, wherein the signal processing chip comprises a signal output terminal pin, a ground pin and an ultrasonic generator, wherein the ultrasonic generator is the configured for generating an ultrasonic signal, and a control terminal of the ultrasonic generator is connected to the signal processing chip. The beneficial effects of the present invention includes: the ultrasonic signal generated by the ultrasonic generator is utilized to match the ultrasonic signal with the encoding unit in the signal processing chip for identification, and a remote authentication by the client is useful for matching the electronic device with the microphone. Furthermore, the signal output terminal pin and the ground pin are introduced into the microphone in the prior art, and the signal output terminal pin is also used for a communication line and a power line, thereby further saving the cost.
-
公开(公告)号：US11700481B2
公开(公告)日：2023-07-11
申请号：US17665017
申请日：2022-02-04
发明人： Jinghua Ye
CPC分类号： H04R1/326 , H04R3/00 , H04R2201/003
摘要： The invention relates to a variable-directivity MEMS microphone. The microphone comprises an acoustic cavity. The following components are provided inside the acoustic cavity: a first acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a first acoustic conversion signal; a first pre-amplifier, connected to the first acoustic transducer, and configured for outputting a first electric signal; a second acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a second acoustic conversion signal; a second pre-amplifier, connected to the second acoustic transducer, and configured for outputting a second electric signal; and a signal processing chip, connected to the first pre-amplifier and the second pre-amplifier, and configured for generating a directional output signal by performing an arithmetic operation on the first electric signal and the second electric signal under the action of a switching control signal.
-
-
-
-
-
-
-
-
-
搜索结果
29 条记录 (耗时 0.022 秒)
