公开(公告)号：US08711024B2

公开(公告)日：2014-04-29

申请号：US13002274

申请日：2009-06-22

Applicant: Marc Sabut ,  Hugo Gicquel ,  Fabien Reaute ,  François Van Zanten

Inventor： Marc Sabut ,  Hugo Gicquel ,  Fabien Reaute ,  François Van Zanten

IPC: H03M1/12

CPC classification number: H03F3/005

Abstract: A switched capacitor amplifier having an amplification unit adapted to amplify a differential signal; a first switched capacitor block including a first plurality of capacitors operable to sample a first differential input signal during a first sampling phase and to drive the amplification unit during a first drive phase; and a second switched capacitor block including a second plurality of capacitors operable to sample a second differential input signal during a second sampling phase and to drive the amplification unit during a second drive phase.

Abstract translation: 一种开关电容放大器，具有适于放大差分信号的放大单元; 第一开关电容器块，包括第一多个电容器，其可操作以在第一采样阶段期间对第一差分输入信号进行采样，并且在第一驱动阶段期间驱动所述放大单元; 以及包括第二多个电容器的第二开关电容器块，其可操作以在第二采样阶段期间对第二差分输入信号进行采样，并且在第二驱动阶段期间驱动放大单元。

公开(公告)号：US08704363B2

公开(公告)日：2014-04-22

申请号：US12910229

申请日：2010-10-22

Applicant: Yacine Felk ,  Alexis Farcy

Inventor： Yacine Felk ,  Alexis Farcy

IPC: H01L23/34

CPC classification number: H01L25/0657 ,  H01L23/38 ,  H01L35/32 ,  H01L35/34 ,  H01L2224/16225 ,  H01L2225/06517

Abstract: An interface plate capable of being mounted between first and second surface-mounted electronic chips. The plate includes a plurality of first, second, and third through openings, the first openings being filled with a conductive material and being arranged to be in front of pads of the first and second chips during the assembly, the second openings being filled with a second material, the third openings being filled with a third material, the second and third materials forming two complementary components of a thermoelectric couple.

Abstract translation: 一种能够安装在第一和第二表面安装电子芯片之间的接口板。 板包括多个第一，第二和第三通孔，第一开口填充有导电材料，并且在组装过程中布置成位于第一和第二芯片的垫的前面，第二开口填充有 第二材料，第三开口填充有第三材料，第二和第三材料形成热电偶的两个互补组分。

公开(公告)号：US08703528B2

公开(公告)日：2014-04-22

申请号：US13445199

申请日：2012-04-12

Applicant: Michel Marty ,  François Roy ,  Jens Prima

Inventor： Michel Marty ,  François Roy ,  Jens Prima

IPC: H01L21/00

CPC classification number: H01L27/1464 ,  H01L27/1463 ,  H01L27/14683 ,  H01L27/14687 ,  H01L27/14689

Abstract: A method for forming a back-side illuminated image sensor, including the steps of: a) forming, from the front surface, doped polysilicon regions, of a conductivity type opposite to that of the substrate, extending in depth orthogonally to the front surface and emerging into the first layer; b) thinning the substrate from its rear surface to reach the polysilicon regions, while keeping a strip of the first layer; c) depositing, on the rear surface of the thinned substrate, a doped amorphous silicon layer, of a conductivity type opposite to that of the substrate; and d) annealing at a temperature capable of transforming the amorphous silicon layer into a crystallized layer.

Abstract translation: 一种用于形成背面照明图像传感器的方法，包括以下步骤：a）从前表面形成与衬底相反的导电类型的掺杂多晶硅区域，其垂直于正面延伸， 进入第一层; b）使衬底从其后表面变薄到达多晶硅区域，同时保持第一层的条带; c）在所述薄化衬底的后表面上沉积与所述衬底相反的导电类型的掺杂非晶硅层; 和d）在能够将非晶硅层转变成结晶层的温度下退火。

公开(公告)号：US08693562B2

公开(公告)日：2014-04-08

申请号：US10845471

申请日：2004-05-13

Applicant: Jacques Meyer

Inventor： Jacques Meyer

IPC: H04L5/12

CPC classification number: H04L27/183 ,  H04L27/22

Abstract: A process receives a composite signal transmitted via a nonlinear data transmission channel, with the composite signal having a first signal UL and a second signal LL. The process includes the following: demodulating and decoding the first signal UL by using a first demodulation and decoding chain in order to regenerate first information of the first signal UL; recoding and shaping to produce a continuous time waveform; applying a nonlinearity function based on a set of coefficients updated according to an adaptive correlation calculation process to the continuous time waveform; subtracting the result of the nonlinearity function from the composite signal in order to generate a result E; and demodulating and decoding the result E by using a second demodulation and decoding chain in order to regenerate second information of the second signal LL.

Abstract translation: 处理接收经由非线性数据传输信道发送的复合信号，复合信号具有第一信号UL和第二信号LL。 该过程包括：通过使用第一解调和解码链来解调和解码第一信号UL，以便再生第一信号UL的第一信息; 记录和整形以产生连续的时间波形; 将基于根据自适应相关计算处理更新的系数集合的非线性函数应用于所述连续时间波形; 从复合信号中减去非线性函数的结果，以产生结果E; 并且通过使用第二解调和解码链对结果E进行解调和解码，以便再生第二信号LL的第二信息。

公开(公告)号：US08654446B2

公开(公告)日：2014-02-18

申请号：US12937971

申请日：2009-04-08

Applicant: Emmanuelle Vigier-Blanc ,  Guillaume Cassar

Inventor： Emmanuelle Vigier-Blanc ,  Guillaume Cassar

IPC: G02B3/00 ,  G02B9/00 ,  C03C27/00 ,  H01L21/322 ,  C23C14/00

CPC classification number: G02B3/0087 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optical element or module is designed to be placed in front of an optical sensor of a semiconductor component. At least one optically useful part of the element or module is provided through which the image to be captured is designed to pass. A method for obtaining such an optical element or module includes forming at least one through passage between a front and rear faces of the element or module. The front and rear faces are covered with a mask. Ion doping is introduced through the passage. As a result, the element or module has a refractive index that varies starting from a wall of the through passage and into the optically useful part. An image capture apparatus includes an optical imaging module having at least one such element or module.

Abstract translation: 光学元件或模块被设计成放置在半导体部件的光学传感器的前方。 提供元件或模块的至少一个光学上有用的部分，待捕获的图像通过该部分被设计成通过。 用于获得这种光学元件或模块的方法包括在元件或模块的前表面和后表面之间形成至少一个通孔。 前面和后面都有一个面罩。 通过通道引入离子掺杂。 结果，元件或模块具有从通道的壁开始变化到光学有用部分的折射率。 图像捕获装置包括具有至少一个这样的元件或模块的光学成像模块。

公开(公告)号：US08635460B2

公开(公告)日：2014-01-21

申请号：US11304236

申请日：2005-12-14

Applicant: Pierre-Yvan Liardet ,  Yannick Teglia

Inventor： Pierre-Yvan Liardet ,  Yannick Teglia

IPC: G06F11/30 ,  G06F12/14

CPC classification number: H04L9/002 ,  H04L2209/046 ,  H04L2209/08

Abstract: A method and a circuit for masking a digital word by application of a random bijection, including applying at least one first operation including selecting a non-disjoint subset of the word having its position and size depending on a first random quantity, and assigning to each bit of the subset, the state of the bit having a symmetrical position with respect to the middle of the subset, to obtain a masked digital quantity.

Abstract translation: 一种用于通过应用随机双射屏蔽数字字的方法和电路，包括应用至少一个第一操作，包括根据第一随机数选择具有其位置和大小的字的非不相交子集，并分配给每个 该比特的状态相对于子集的中间具有对称位置，以获得掩蔽的数字量。

公开(公告)号：US08581684B2

公开(公告)日：2013-11-12

申请号：US12020687

申请日：2008-01-28

Applicant: Aline Noiré ,  Benjamin Therond

Inventor： Aline Noiré ,  Benjamin Therond

IPC: H01F5/00

CPC classification number: H01F17/0013 ,  H01F27/34 ,  H01L23/5227 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An inductive element formed of planar windings in different conductive levels, the windings being formed in a number of levels smaller by one unit than the number of windings, two of the windings being interdigited in a same level.

Abstract translation: 由不同导电水平的平面绕组形成的电感元件，绕组以与绕组数相比减小一个单位的数量级形成，其中两个绕组被互相指向同一水平。

公开(公告)号：US08581412B2

公开(公告)日：2013-11-12

申请号：US12896558

申请日：2010-10-01

Applicant: Romain Pilard ,  Daniel Gloria ,  Frederic Gianesello ,  Cedric Durand

Inventor： Romain Pilard ,  Daniel Gloria ,  Frederic Gianesello ,  Cedric Durand

IPC: H01L23/48

CPC classification number: H01P3/121 ,  H01P1/207 ,  H01P5/107

Abstract: A semiconductor device includes a substrate. On at least one face of that substrate, integrated circuits are formed. At least one electromagnetic waveguide is also included, that waveguide including two metal plates that are placed on either side of at least one part of the thickness of the substrate and are located facing each other. Two longitudinal walls are placed facing each other and are formed by metal vias made in holes passing through the substrate in its thickness direction. The metal vias electrically connect the two metal plates.

Abstract translation: 半导体器件包括衬底。 在该基板的至少一个面上形成集成电路。 还包括至少一个电磁波导，该波导包括两个金属板，这两个金属板被放置在基板厚度的至少一部分的任一侧上并且彼此相对定位。 两个纵向壁彼此相对地放置并且由在其厚度方向上穿过基板的孔中形成的金属通孔形成。 金属通孔电连接两个金属板。

公开(公告)号：US08575761B2

公开(公告)日：2013-11-05

申请号：US13370374

申请日：2012-02-10

Applicant: Remy Chevallier

Inventor： Remy Chevallier

IPC: H01L23/522

CPC classification number: H01L23/5286 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An array of functional cells includes a subset of cells powered by at least one supply rail. That supply rail is formed of first segments located on a first metallization level and second segments located on a second metallization level with at least one conductor element extending between the first and second segments to electrically connect successive segments of the supply rail.

Abstract translation: 功能单元阵列包括由至少一个供电轨供电的单元的子集。 所述供应轨道由位于第一金属化水平的第一段和位于第二金属化水平上的第二段形成，其中至少一个导体元件在第一和第二段之间延伸以电连接供电轨的连续段。

公开(公告)号：US20130273440A1

公开(公告)日：2013-10-17

申请号：US13993634

申请日：2011-12-12

Applicant: Pascale Mazoyer ,  Aomar Halimaoui

Inventor： Pascale Mazoyer ,  Aomar Halimaoui

IPC: H01M8/16 ,  H05K5/02

CPC classification number: H01M8/16 ,  H01G11/52 ,  H01G11/78 ,  H01M8/1097 ,  H05K5/02 ,  Y02E60/13 ,  Y02E60/521 ,  Y02E60/527

Abstract: A housing includes a body with a first silicon element and a second porous silicon element, at least one first cavity provided in the porous silicon element, a first electrically conducting contact area electrically coupled to at least a portion of at least one internal wall of the at least one first cavity, and a second electrically conducting contact area electrically coupled to a different portion of the at least one internal wall of the second porous silicon element of the at least one first cavity, wherein the two contact areas are electrically isolated from each other.

Abstract translation: 壳体包括具有第一硅元件和第二多孔硅元件的主体，设置在多孔硅元件中的至少一个第一空腔，第一导电接触区域，电耦合到至少一个内壁的至少一部分 至少一个第一空腔和第二导电接触区域，其电耦合到所述至少一个第一空腔的所述第二多孔硅元件的所述至少一个内壁的不同部分，其中所述两个接触区域与所述至少一个第一空腔电绝缘 其他。