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11.
公开(公告)号:US20140117549A1
公开(公告)日:2014-05-01
申请号:US14010627
申请日:2013-08-27
IPC分类号: H01L21/768
CPC分类号: H01L21/76874 , C23C18/1651 , C23C18/1653 , C23C18/31 , C23C18/34 , C23C18/36 , C23C18/54 , C25D3/16 , C25D3/18 , C25D3/38 , C25D3/50 , C25D5/10 , C25D7/123 , C25D15/00 , H01L21/288 , H01L21/4875 , H01L21/76843 , H01L21/76873 , H01L21/76898 , H01L23/36 , H01L23/49811 , H01L23/53238 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要: A method of manufacturing a semiconductor device includes the steps of immersing a substrate in a solution containing metal ions to adhere a metal catalyst to a surface of the substrate, immersing the substrate with the metal catalyst adhered thereto in an electroless plating solution to electrolessly plate a layer on the substrate, immersing the substrate in an electroplating solution to electroplate a layer on the electrolessly plated layer using the electrolessly plated layer as a power feeding layer, and forming a metal layer of Cu or Ag on the electroplated layer. The electroplated layer is formed of a different material than the metal layer.
摘要翻译: 一种制造半导体器件的方法包括以下步骤:将衬底浸入含有金属离子的溶液中以将金属催化剂粘附到衬底的表面,将其上附着有金属催化剂的衬底浸入无电镀溶液中以无电镀 将基板浸渍在电镀液中,使用无电解镀层作为供电层对无电解镀层上的层进行电镀,在电镀层上形成Cu或Ag的金属层。 电镀层由与金属层不同的材料形成。
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公开(公告)号:US4002543A
公开(公告)日:1977-01-11
申请号:US575092
申请日:1975-05-06
摘要: The instant invention is directed to an aqueous bath for the electrodeposition of a bright iron-nickel alloy and to a process utilizing the same, the bath comprising iron ions, nickel ions, an iron complexing agent containing at least two complexing groups independently selected from the group consisting of carboxy and hydroxy provided at least one group is a carboxy group, and a reaction product of a polyamine and an alkylating or sulfonating agent, whereby there is achieved a marked improvement in the brightness of the electrodeposit as well as excellent leveling in both the high and low current density areas. Optionally, by the addition of acetylenic brighteners of a particular structural formula even further improved results may be obtained.
摘要翻译: 本发明涉及一种用于电沉积亮铁镍合金的水浴及其使用方法,所述浴包括铁离子,镍离子,铁络合剂,其含有至少两个独立地选自以下的络合基团: 提供至少一个基团的由羧基和羟基构成的基团是羧基,以及多胺和烷基化或磺化剂的反应产物,从而在电沉积物的亮度方面获得了明显的改善,并且在两者中都具有优异的流平性 高低电流密度区域。 任选地,通过加入特定结构式的炔属增亮剂,甚至可获得进一步改善的结果。
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公开(公告)号:US3814674A
公开(公告)日:1974-06-04
申请号:US8732270
申请日:1970-11-05
发明人: ADAMOWICZ N , KLEIN R , TREMMEL R , CLAUSS R
CPC分类号: C25D3/16
摘要: A PROCESS FOR THE ELECRTRODEPOSITION OF BRIGHT COBALT OR COBALT-NICKEL ALLOY ELECTROPLATES CONTAINING AT LEAST 50% COBALT IN WHICH THE AQUEOUS COBALT PLATING BATHS FROM WHICH THE ELECTROPLATES ARE DEPOSITED CONTAIN AT LEAST 0.05 MILLOMLES PER LITER OF A BRIGHTENER HAING THE FORMULA:
H-(O-CH(-R)-CH2)M-O-CH2-C*C-CH2-O-(CH2-CH(-R)-O)N-H
WHEREIN M IS A NUMBER FROM 1 TO 4, N IS A NUMBER FROM 0 TO 4, R IS HYDROGEN OR A CH2R, GROUP IN WHICH R'' IS A CHLORO, HYDROXY OR SULFONIC GROUP.-
公开(公告)号:US3795592A
公开(公告)日:1974-03-05
申请号:US3795592D
申请日:1973-02-28
摘要: AN AQUEOUS ACIDIC NICKEL ELECTROPLATING BATH COMPRISING A COUMARIN COMPOUND AND AN EFFECTIVE LEVELING AND BRIGHTENING AMOUNT OF A BATH SOLUBLE 1-PROPYNOXY SULFONATE COMPOUND EFFECTIVE TO CARRY THE DEGRADATION PRODUCT OF COUMARIN.
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公开(公告)号:US3449398A
公开(公告)日:1969-06-10
申请号:US3449398D
申请日:1966-07-07
申请人: M & T CHEMICALS INC
发明人: PASSAL FRANK
IPC分类号: C25D3/12 , C25D3/16 , C07C121/66 , C07C103/20 , C07C121/54
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公开(公告)号:US3306831A
公开(公告)日:1967-02-28
申请号:US31998263
申请日:1963-10-30
申请人: COWLES CHEM CO
发明人: COPE JR RICHARD P
CPC分类号: C25D3/16 , C07C69/007 , C07C69/675 , C07C69/70 , C25D3/38 , C25D3/562
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公开(公告)号:US3305462A
公开(公告)日:1967-02-21
申请号:US48476765
申请日:1965-09-02
申请人: OSTROW BARNET D , NOBEL FRED I
发明人: OSTROW BARNET D , NOBEL FRED I
IPC分类号: C25D3/16
CPC分类号: C25D3/16
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公开(公告)号:US3006822A
公开(公告)日:1961-10-31
申请号:US65770457
申请日:1957-05-08
发明人: GUENTHER TODT HANS
IPC分类号: C25D3/16
CPC分类号: C25D3/16
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公开(公告)号:US20110114498A1
公开(公告)日:2011-05-19
申请号:US12620746
申请日:2009-11-18
申请人: Robert A. Tremmel
发明人: Robert A. Tremmel
IPC分类号: C25D3/12
摘要: A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfate ions; b) a soluble salt of chloroacetic acid, acetic acid, glycol acid or proprionic acid; and d) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. It does not contain coumarin but produces desirable leveling characteristics. The bath requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.
摘要翻译: 一种用于在包含a)硫酸镍离子的基底上镀覆半光亮镍沉积物的镀镍浴; b)氯乙酸,乙酸,乙二醇酸或丙酸的可溶性盐; 和d)选自己炔二醇,丁炔二醇和上述组合中的至少一种二醇。 本文所述的半光亮镀镍浴在非常宽的电流密度范围内产生无硫半光沉积物。 它不含香豆素,但产生理想的流平特性。 该浴不需要醛来实现同时的厚度和电解电位(STEP),并且具有极低的应力和优异的延展性。
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公开(公告)号:US5164069A
公开(公告)日:1992-11-17
申请号:US609442
申请日:1990-11-05
申请人: Edward J. Cerwonka
发明人: Edward J. Cerwonka
IPC分类号: C25D3/16
CPC分类号: C25D3/16
摘要: An aqueous acid electroplating solution comprising nickel ions and one or more acetylenic compounds, specifically mono- and polyglyceryl ethers of acetylenic alcohols; acetylenic compounds useful in the electroplating solution; and processes using such solution and compounds. The invention is particularly useful for nickel plating an irregular surface such as a printed circuit board having through-holes.
摘要翻译: 一种含有镍离子和一种或多种炔属化合物的酸性电镀溶液,特别是炔属醇的单甘油和聚甘油醚; 用于电镀溶液的炔属化合物; 并使用这种溶液和化合物进行处理。 本发明对于诸如具有通孔的印刷电路板的不规则表面的镀镍特别有用。
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