Abstract:
A display module includes a first panel configured to implement an image, a second panel having barriers for implementing a three-dimensional image, the second panel covering the first panel, a resin layer filling a gap between the first and second panels, and a support unit formed adjacent to at least one end of the resin layer to maintain the gap, the support unit configured to support the second panel.
Abstract:
A semiconductor optical modulator that includes a first semiconductor optical waveguide having a laminated structure including a core layer, a first clad layer, a second clad layer, and a barrier layer, the first clad layer and the second clad layer being disposed below and above the core layer, the barrier layer being inserted between the second clad layer and the core layer; a second semiconductor optical waveguide having a laminated structure in which the second clad layer has a p-type semiconductor penetrating locally through a n-type semiconductor in a laminated direction in the laminated structure of the first semiconductor optical waveguide; a first electrode connected to the first clad layer of the first semiconductor optical waveguide; and a second electrode electrically connecting the second clad layer of the first semiconductor optical waveguide and the p-type semiconductor of the second clad layer of the second semiconductor optical waveguide.
Abstract:
An optical modulator comprises a substrate having an electro-optical effect, an optical waveguide formed in the substrate, a buffer layer provided above the optical waveguide, a semiconductor film provided above the buffer layer and having an aperture at a top of the optical waveguide, and an electrode provided above the buffer layer and electrically coupled to the semiconductor film.
Abstract:
An array substrate for a liquid crystal display device, includes: a gate line and a data line on a substrate, the data line crossing the gate line to define a pixel region; an insulating layer between the gate line and the data line; a switching element adjacent to a crossing of the gate line and the data line; a pixel electrode connected to the switching element, the pixel electrode disposed in the pixel region; and a first buffer pattern at a first side of one of the gate line and the date line and overlapped with the other one of the gate line and the date line, the first buffer pattern being disposed at the same layer as the one of the gate line and the date line.
Abstract:
A switchable film assembly having remote electrical connections comprises an active layer between first and second electrically conductive layers. The active layer has an optical transmission which changes upon projecting an electric field therethrough. An electrical connection connects the film to a power supply and can comprise a remote electrical connector region provided remote to the first and second electrically conductive layers, such upon connecting the film assembly to the power supply, an electrical field may be projected through at least a portion of the switchable film assembly thereby changing the optical transmission of the active layer.
Abstract:
A novel technique is provided, which can secure sufficient adhesion of an Si layer and a magneto-optical material layer while avoiding occurrence of cracks when fabricating an optical nonreciprocal element by bonding the Si layer on which a rib waveguide is formed, and the magneto-optical material layer. The method includes forming a waveguide on the Si layer of an SOI substrate which is a first substrate, forming a first thin-film buffer layer on the aforesaid waveguide, forming a second thin-film buffer layer on an magneto-optical material layer deposited on a second substrate by using a same material as that of the aforesaid first thin-film buffer layer, and bonding the aforesaid first thin-film buffer layer and the aforesaid second thin-film buffer layer in placement where a light propagating in the aforesaid waveguide can be caused to generate nonreciprocal phase change by the aforesaid magneto-optical material layer.
Abstract:
One exemplary embodiment of an electrochromic device comprises a tantalum-nitride ion-blocking layer formed between a transparent conductive layer and an electrochromic layer. Another exemplary embodiment of an electrochromic device comprises a tantalum-nitride ion-blocking layer formed between a transparent conductive layer and a counter electrode. Yet another exemplary embodiment of an electrochromic device comprises a type-2 ion-blocking layer formed on a transparent conductive layer as an ion diffusion barrier overlayer. Still another exemplary embodiment of an electrochromic device comprises a transparent conductive layer formed from tantalum nitride.
Abstract:
In a method of forming an array substrate for in-plane switching liquid crystal display device a first metal layer is formed on a substrate and then patterned using a first mask so as to form a gate line having a gate electrode and a common line having a plurality of common electrodes. A gate insulation layer is formed on the substrate to cover the patterned first metal layer. A semiconductor layer is formed on the gate insulation layer using a second mask, wherein the semiconductor layer includes an active layer of pure amorphous silicon and an ohmic contact layer of impurity-doped amorphous silicon. A second metal layer is formed on the gate insulation layer to cover the semiconductor layer and then patterned using a third mask to form a data line having a source electrode, a pixel connecting line having a plurality of pixel electrodes, and a drain electrode that is spaced apart from the source electrode. A channel is formed by etching a portion of the ohmic contact layer between the source and drain electrodes. An alignment layer is formed over the substrate to cover the patterned second metal layer. The substrate having the alignment layer and the source and drain electrode is then thermal-treated in a furnace to cure the alignment layer and to anneal a thin film transistor.
Abstract:
There is provided a semiconductor optical modulator capable of performing a stable operation and having an excellent voltage-current characteristic to an electric field while exhibiting the characteristic of a semiconductor optical modulator with an n-i-n structure. The semiconductor optical modulator includes a waveguide structure that is formed by sequentially growing an n-type InP clad layer (11), a semiconductor core layer (13) having an electro-optic effect, a p-InAlAs layer (15), and an n-type InP clad layer (16). An electron affinity of the p-InAlAs layer (15) is smaller than an electron affinity of the n-type InP clad layer (16). In the waveguide structure having such a configuration, a non-dope InP clad layer (12) and a non-dope InP clad layer (14) may be respectively provided between the n-type InP clad layer (11) and the semiconductor core layer (13), and between the semiconductor core layer (13) and the p-InAlAs layer (15).
Abstract:
The invention relates to an electro-optic modulator structure containing an additional set of bias electrodes buried within the device for applying bias to set the operating point. Thus the RF electrodes used to modulate incoming optical signals can be operated with zero DC bias, reducing electrode corrosion by galvanic and other effects that can be present in non-hermetic packages. The buried bias electrodes are also advantageous in controlling charge build-up with consequent improvement in drift characteristics. The bias electrode material is useful for routing bias signals inside the device, in particular to external terminals, as well as forming encapsulating layers to permit operation in non-hermetic environments, thereby lowering manufacturing costs. Embodiments using both X-cut and Z-cut lithium niobate (LiNbO3) are presented. For the latter, the bias electrodes can be split along their axis to avoid optical losses.