摘要:
A multi-band RF monoblock filter including at least three RF signal filters defined in the monoblock of dielectric material by resonators defined in part by through-holes extending through the block. In one embodiment, two of the RF signal filters are in a co-linear and side-by-side relationship and the third filter is in a parallel and side-by side relationship with one of the two other RF signal filters. A pattern of conductive material defines two end and one interior RF signal input/output on the block top surface. The end RF signal input/outputs are located at opposite ends of the block and the central RF signal input/output is located between the two co-linear and side-by-side RF filters. An RF signal is transmitted through the one end RF signal input/output, the two parallel and side-by-side RF signal filters, and the central RF signal input/output and also through the other end RF signal input/output, one of the co-linear and side-by-side RF filters, and the central RF signal input/output.
摘要:
A filter package includes a substrate, a plurality of resonators each coupled to the substrate, and a metal circuit pattern patterned on the substrate, and the plurality of resonators each include a body made of a dielectric material, in which a through hole is formed in one direction, and a conductive film attached to an end surface coupled to the substrate among both end surfaces of the body, and attached to a wall of the through hole.
摘要:
Disclosed are embodiments of ceramic radiofrequency filters advantageous as RF components. The ceramic filters can include a ceramic stepped impedance resonator, wherein the inner diameter of the ceramic stepped impedance resonator can vary from one end to another end. The inner diameter can be, for example, tapered, sectioned, or stair-stepped in order to provide different impedances in the ceramic resonator.
摘要:
A filtering device includes at least one dielectric resonant element, which includes a dielectric block, an outer conductor, and an inner conductor, a terminal disposed in a through hole of the dielectric resonant element from a front surface, a plate-shaped circuit element electrically coupled with the at least one dielectric resonant element via the terminal, and a substrate on which the at last one dielectric resonant element and the plate-shaped circuit element are mounted. The outer conductor is disposed so as to cover the back surface besides the peripheral surface of the dielectric block. The first end surface of the dielectric block includes a first electrode-free portion that electrically isolates the inner conductor from the outer conductor, and a second electrode-free portion that electrically isolates the inner conductor from the outer conductor.
摘要:
An embodiment of the present invention provides a method of applying patterned metallization to a ceramic block comprising applying a photodefinable ink to said ceramic block; drying said ink; exposing said photodefinable ink to UV radiation through a predefined mask according to the thickness of the film to form a pattern; developing said pattern in a developer solution thereby forming a patterned ceramic block; and rinsing, drying and firing said patterned ceramic block.
摘要:
A duplex filter includes a block of dielectric material with top, bottom, and side surfaces and first and second spaced-apart sets of through-holes. A pair of outside walls and a center wall extend outwardly from the top surface. A pattern of metallized areas is defined on the top surface of the block including first and second electrodes that extend on the pair of outside walls respectively and third and fourth electrode antennae that extend on the center wall. The block may be two separate blocks coupled together to form an interior layer of metallization separating the first and second sets of through-holes and the center wall separates respective transmit and receive portions of the pattern of metallized areas.
摘要:
A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.
摘要:
An electrical filter includes a circuit board with an insulative substrate of alternating wide and narrow portions between input and output ends. Capacitors received in through-holes in the wide portions are electrically coupled to signal traces on a signal surface and ground traces on a ground surface of the circuit board. Conductive coils about narrow portions may form inductors, electrically coupled between the signal traces and an input and/or output. The circuit board, capacitors and inductors may be positioned in a first enclosure, (e.g., tube), with sealed electrical connections to an exterior. The first enclosure may be positioned in a second enclosure (e.g., tube). The filter may also include a high frequency dissipation filter section employing a metal powder filter, with metal powder and epoxy. Non-magnetic and/or superconducting materials may be employed.
摘要:
A dielectric device includes a dielectric substrate and a resonator unit. The resonator unit includes first and second holes. The first hole opens on a first surface of the dielectric substrate and extends toward a second surface opposite to the first surface. A first internal conductor is provided inside the first hole. The second hole opens on a third surface of the dielectric substrate, extends toward a fourth surface opposite to the third surface, and is connected to the first hole. A second internal conductor is provided inside the second hole with one end connected to an external conductor film on the third surface and the other end connected to the first internal conductor. The first hole has a recess opposed to a junction with the second hole. The first internal conductor in the recess is opposed to the external conductor film on the fourth surface across the dielectric substrate.
摘要:
A delay filter module comprising at least one dielectric monoblock ceramic bandpass filter and a circuit for compensating/equalizing the signal delay produced by the delay filter. In one embodiment, the circuit is defined by a hybrid coupler defining at least two ports coupled to a dielectric ceramic reactive termination block defining at least a pair of reactive termination resonators and coupling capacitors. The delay can be adjusted by tuning the dielectric monoblock bandpass filter and/or the reactive termination resonators and/or the coupling capacitors defined by the dielectric ceramic reactive termination block.