公开(公告)号：US20160381801A1

公开(公告)日：2016-12-29

申请号：US15112872

申请日：2015-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC: H05K1/18 ,  H05K3/32 ,  C09J5/00 ,  C09J201/00 ,  C09J9/02 ,  C09J11/04

CPC classification number: H05K1/181 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  C09J2203/326 ,  H01L2224/81203 ,  H01L2224/83101 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0203

Abstract: Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate.

Abstract translation: 确保电子部件与电路基板的布线中的间距减小的电路基板与电子部件的电极之间的导通，并防止电子部件的电极端子之间的短路。 连接体具有通过各向异性导电粘合剂连接到电路基板的电子部件; 各向异性导电粘合剂含有导电性粒子规则排列的粘合剂树脂层; 形成在电子部件上的连接电极之间的空间中的导电粒子之间的粒子间距离大于截留在形成于电路基板上的连接电极和基板电极之间的导电粒子之间的粒子间距离。

公开(公告)号：US20160007477A1

公开(公告)日：2016-01-07

申请号：US14769574

申请日：2014-03-06

Applicant: DIS CORPORATION

Inventor： Sunao Yoshihara ,  Haruhiko Katsuta ,  Yoshinori Katayama ,  Jun Shirakami ,  Akira Murakawa ,  Wataru Fujikawa ,  Yukie Saitou

IPC: H05K3/18 ,  C25D5/02 ,  H05K3/12 ,  H05K1/09 ,  H05K1/03 ,  C25D5/56 ,  C25D7/00

CPC classification number: H05K3/188 ,  C25D5/02 ,  C25D5/56 ,  C25D7/00 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/12 ,  H05K3/207 ,  H05K3/246 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/09218 ,  H05K2203/0108 ,  H05K2203/097

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

Abstract translation: 提供了一种形成导电超细纹图案的方法，其具有优异的图案横截面形状，其通过包括印刷工艺和电镀工艺的复合技术提供，此外，通过赋予层压体的每个界面优异的粘附性，包括 还提供了电镀芯图案，可优选用作高精度电路的导电超细图案及其制造方法。 该方法包括（1）在基板上涂布树脂组合物以形成接收层的步骤; （2）通过反胶印方法印刷含有电镀芯颗粒的油墨的步骤，以在接收层上形成电镀芯图案; 和（3）通过电解电镀法在步骤（2）中形成的镀覆芯图案上沉积金属的步骤。