摘要:
Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.
摘要:
A conductive antenna structure and method for making the same, wherein the method includes the following steps: (a) providing a plastic film substrate: (b) performing a rinsing coating material printing process to let the rinsing coating material position on the plastic film substrate and appear a predetermined antenna pattern; (c) performing an evaporating process for the plastic film substrate to provide a conductive layer thereon; (d) performing a rinsing process for the plastic film substrate to separate the rinsing coating material from the plastic film substrate and let the conductive layer position on the antenna pattern. Therefore, the conductive antenna structure made by the use of the above-mentioned method includes a plastic film substrate made of Polyethylene Terephthalate (PET) as well as a conductive antenna that is made of conductive material and is connected to the surface of the plastic film substrate, and has a predetermined first thickness.
摘要:
The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
摘要:
A polyimide film produced by forming a film from a raw material incorporated with a finely divided inorganic powder that forms minute projections on the film surface and subsequently subjecting the film to corona discharge treatment. According to this invention, it is possible to obtain a heat-resistant polyimide film having improved adhesive properties and uniform bond strength. The film does not cause blocking when wound into a roll.
摘要:
Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.
摘要:
A conductive member includes a substrate, conductive layers that are provided on both surfaces of the substrate, and contain a conductive fiber having an average minor axis length of 150 nm or less and a matrix, and intermediate layers that are provided between the substrate and the conductive layers, and contain a compound having a functional group capable of interacting with the conductive fiber, and, when surface resistance values of the two conductive layers are represented by A and B respectively, and an A value is equal to or greater than a B value, A/B is in a range of 1.0 to 1.2.
摘要:
The present invention relates to flexible substrates having on their surface a wetting contrast. The wetting contrast comprises adjacent areas of different hydrophilicity and/or oleophilicity. The present invention further relates to methods of production of such substrates and to methods of producing microelectronic components wherein electronically functional material is deposited onto said substrates.According to a first aspect of the present invention, a method of producing a flexible substrate having a wetting contrast is provided. The method includes the step of forming a first area comprising an inorganic material on a flexible substrate precursor to form a substrate wherein the inorganic material is at least partially exposed at the substrate surface and the first area constitutes a pattern on the precursor surface.
摘要:
The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
摘要:
A laminated plate formed of a base material and a high molecular plate laminated with each other without using adhesive agent and a part using the laminated plate, wherein the laminated plate is formed by laminatedly sticking the base plate to the high molecular plate after applying an activating treatment onto the opposed surfaces of the base plate and the high molecular plate, and the part is formed by using the laminated plate.
摘要:
A manufacturing method for printed circuit boards includes the steps of: a) inkjet printing a UV free radical curable inkjet ink on a substrate (2); b) UV curing the UV free radical curable inkjet ink on the inkjet printed substrate; and c) applying a thermal treatment on the UV cured inkjet printed substrate; wherein the UV free radical curable inkjet ink contains at least a colorant, a free radical photoinitiator; a difunctional monomer or oligomer and a polyfunctional monomer or oligomer; and 1 to 15 wt % of a silane compound according to Formula (I): wherein, the linking group L represents a —CH2— group or an aliphatic chain having 2 to 10 carbon atoms optionally substituted in the aliphatic chain by a nitrogen or an oxygen; R1 represents a methoxy group; R2 and R3 independently represent a methoxy group or a C1- to C4-alkyl group; and R4 represents a functional group selected from the group consisting of an epoxy group, an amine group, a carbamate group, a trimethoxy silane group and an ureido group.