公开(公告)号：US20030190865A1

公开(公告)日：2003-10-09

申请号：US10425684

申请日：2003-04-28

Applicant: Applied Materials, Inc., a Delaware corporation

Inventor： Sasson Somekh

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B007/19 ,  B24B007/30

CPC classification number: B24B37/245 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12

Abstract: In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.

公开(公告)号：US20030087583A1

公开(公告)日：2003-05-08

申请号：US10290163

申请日：2002-11-08

Applicant: NIDEK CO., LTD.

Inventor： Ryoji Shibata

IPC: B24B049/00 ,  B24B051/00 ,  B24B005/00

CPC classification number: B24B49/00 ,  B24B9/148 ,  B24B47/225

Abstract: An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, includes; a lens rotation shaft which holds and rotates the lens, the shaft being rotatable about a first axis; a grooving grinding stone which forms a groove in an edge surface of the lens; a holder which rotatably holds the grooving grinding stone; inclination means for relatively inclining the holder with respect to the lens rotation shaft to change inclination of a rotation axis of the grooving grinding stone with respect to the first axis; and control means for obtaining desired inclination of the rotation axis of the grooving grinding stone correspondingly to a radius vector angle at each processing point of grooving locus, thereby controlling the inclination by the inclination means.

Abstract translation: 一种用于处理眼镜镜片周边的眼镜镜片处理装置，包括： 透镜旋转轴，其保持并旋转透镜，所述轴可绕第一轴线旋转; 在所述透镜的边缘表面形成凹槽的开槽磨石; 可旋转地保持开槽磨石的保持器; 倾斜装置，用于相对于透镜旋转轴相对地倾斜保持器，以改变切槽磨石相对于第一轴线的旋转轴线的倾斜度; 以及控制装置，用于相应于切槽轨迹的每个处理点处的半径向量角度获得所述切槽磨石的旋转轴线的期望倾斜度，从而通过倾斜装置控制倾斜度。

公开(公告)号：US20030045205A1

公开(公告)日：2003-03-06

申请号：US09941110

申请日：2001-08-28

Inventor： John D. Herb ,  Ned W. Teeny ,  Stephen C. Schultz

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/30 ,  B24B37/0053 ,  B24B49/10 ,  H01L21/67265 ,  H01L21/6838

Abstract: The invention is a carrier that determines if a wafer has been properly loaded. The carrier includes a body having a cavity covered by a membrane, thereby forming an initial plenum. One or more annular ribs may extend from the body to the membrane to divide the initial plenum into a plurality of plenums. A sensor is positioned within one of the plenums to detect the presence of the wafer. Pump(s) with pressure regulators may be used to pressurize the plenum(s). A first plenum may be pressurized sufficient to hold the wafer to the membrane by creating a partial vacuum between the membrane and the wafer. A second plenum may be pressurized sufficient to urge the membrane away from the sensor if the wafer is not properly loaded in the carrier. If the membrane is near the sensor, the wafer has been properly loaded into the carrier.

公开(公告)号：US20030003847A1

公开(公告)日：2003-01-02

申请号：US09894477

申请日：2001-06-28

Applicant: Corning Precision Lens, Inc.

Inventor： Allen Y. Yi ,  Tomasz A. Pol ,  Michael Hezlep

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/005 ,  B24B41/04 ,  B24B49/16

Abstract: A polishing system for polishing a surface of a substrate, such as the surface of an optical pin mold, to a desired surface finish and profile under the automated control of a computer during a polishing cycle. The polishing system includes a polishing spindle assembly that holds and rotates a polishing tool that is contacted under pressure with a surface of the mold pin. A torque sensor is associated with the polishing spindle assembly to sense a torque on the polishing tool during the polishing cycle. The polishing system further includes a feedback control system that dynamically adjusts the position of the polishing spindle assembly in response to the torque sensed by the torque sensor to maintain a substantially constant torque on the polishing tool during the polishing cycle.

公开(公告)号：US20030003846A1

公开(公告)日：2003-01-02

申请号：US10187643

申请日：2002-06-27

Inventor： Robert D. Tolles

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/24 ,  B24B37/26 ,  B24B37/32 ,  B24B53/017 ,  B24D3/32 ,  B24D3/344 ,  B24D9/08

Abstract: A material with a mesh of fibers and a binder material holding the fibers in the mesh can be used on a carrier head or a polishing pad. A polishing apparatus can include a pad cleaner with nozzles to direct jets of cleaning fluid onto the polishing pad and a brush to agitate a surface of the polishing pad.

Abstract translation: 可以在载体头或抛光垫上使用具有纤维网和将纤维保持在网中的粘合剂材料的材料。 抛光装置可以包括具有喷嘴以将清洁流体喷射到抛光垫上的喷嘴清洁器和刷子以搅动抛光垫的表面。

公开(公告)号：US20020168922A1

公开(公告)日：2002-11-14

申请号：US10135607

申请日：2002-04-30

Inventor： Paul D. Mortell ,  Chi Hoang ,  David M. McElrone ,  Gary P. Erpenbeck ,  Walter James Frandsen JR. ,  Charles Shafee Slemon

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B23Q17/0938 ,  B23B51/02 ,  B23B2251/14 ,  B23B2251/426 ,  B23Q3/15546 ,  B23Q17/2233 ,  B23Q17/24 ,  B24B3/24 ,  B24B3/247 ,  B24B3/26 ,  B24B3/28 ,  B24B41/005 ,  B24B49/12 ,  B24B51/00 ,  G05B19/00 ,  G05B19/182 ,  G05B2219/37559 ,  G05B2219/45159 ,  H05K3/0047

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract translation: 一种用于验证钻头的身份和几何形状的完全自动化的装置，重新磨削钻头的切削尖端并将定位环重新定位在钻头的柄部分之后，其切削尖端的再磨削 。 该装置包括具有一对盒托盘的壳体，一对研磨组件，一对光学组件，一对初级清洁组件，一对次要清洁组件，一对倒置组件，一对工作头组件， 碰撞组件和附接到其上的装载机组件。 工作头和装载机组件用于以选定的顺序在盒托盘和其他组件之间传送钻头，该顺序由可编程控制装置控制和协调。 控制装置电连接到每个组件，并且允许在至少两个钻头上同时进行切削尖端再磨削和定位环重新定位过程。

公开(公告)号：US20020155790A1

公开(公告)日：2002-10-24

申请号：US10115234

申请日：2002-04-04

Applicant: TOYODA KOKI KABUSHIKI KAISHA

Inventor： Masahiro Ido ,  Kikutoshi Okada

IPC: B24B051/00

CPC classification number: G05B19/184 ,  G05B19/401

Abstract: On a grinding machine, a workpiece having eccentric cylindrical portions is rotated around the work spindle axis so that the eccentric cylindrical portions effects a planetary motion. A grinding wheel is reciprocated toward and away from the work spindle axis in synchronism with the planetary motion and is also fed toward the work spindle axis to grind the eccentric cylindrical portion into a target cylindrical profile. Upon completion of a part of the grinding operation, the eccentric cylindrical portion under machining is indexed to a predetermined angular position. A diameter measuring device is moved from its rest position to a measuring position to measure the diameter of the eccentric cylindrical portion. Comparing the measured diameter with a target diameter to obtain a residual difference in diameter, the grinding machine further operates to perform a finish grinding according to the residual difference until the diameter reaches the target size, whereby the eccentric cylindrical portion can be finished precisely using a general purpose measuring device.

Abstract translation: 在研磨机上，具有偏心圆筒部的工件围绕工作主轴轴线旋转，使得偏心圆筒部分产生行星运动。 磨轮与行星运动同步地朝向和离开工作主轴轴线往复运动，并且还被馈送到工作主轴轴线以将偏心圆柱形部分磨削成目标圆柱形轮廓。 在完成一部分研磨操作之后，加工中的偏心圆柱部分被转位到预定的角位置。 直径测量装置从其静止位置移动到测量位置以测量偏心圆柱形部分的直径。 将测量的直径与目标直径进行比较以获得直径的残差，则研磨机进一步操作以根据残余差进行精磨，直到直径达到目标尺寸，由此偏心圆柱形部分可以使用 通用测量装置。

公开(公告)号：US20020155788A1

公开(公告)日：2002-10-24

申请号：US09838980

申请日：2001-04-19

Inventor： Thomas Frederick Allen Bibby JR. ,  John A. Adams

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12

Abstract: A method and apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-bore in a polish pad assembly, a light source, a fiber optic cable, a light sensor, and a computer. The light source provides light within a predetermined bandwidth, the fiber optic cable propagates the light through the through-bore opening to illuminate the surface as the pad assembly orbits, and the light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal by comparing the reflected spectral data with previously collected reference data. The comparison involves calculating an evaluation time based on the comparison, and calculating a difference time utilizing correlation to account for over polish/under polish. The endpoint is predicted utilizing the evaluation time and the difference time.

Abstract translation: 用于产生端点信号以控制半导体晶片表面上的薄膜抛光的方法和装置包括抛光垫组件，光源，光纤电缆，光传感器和计算机中的通孔。 光源在预定带宽内提供光，光纤电缆通过通孔开口传播光线，以便在焊盘组件轨道运动时照亮表面，光传感器通过光纤电缆接收来自表面的反射光，并产生 反射光谱数据。 计算机接收反射光谱数据并通过将反射的光谱数据与先前收集的参考数据进行比较来计算端点信号。 比较包括基于比较来计算评估时间，并且使用相关性计算差异时间以考虑过抛光/下抛光。 使用评估时间和差异时间预测终点。

公开(公告)号：US20020151251A1

公开(公告)日：2002-10-17

申请号：US10121143

申请日：2002-04-10

Inventor： Steven M. Zuniga

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/32 ,  B24B37/30 ,  B24B49/16

Abstract: A method of chemical mechanical polishing uses a carrier head having a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.

Abstract translation: 化学机械抛光的方法使用具有柔性膜的载体头，该柔性膜在具有可控尺寸的装载区域中对基底施加载荷。 载体头中的一个可加压室控制装载区域的尺寸，另一个室控制在装载区域中施加到基板的压力。

公开(公告)号：US20020142703A1

公开(公告)日：2002-10-03

申请号：US10108417

申请日：2002-03-29

Inventor： Toru Nishikawa ,  Takeshi Inao

IPC: B24B049/00 ,  B24B051/00 ,  B24B005/00

CPC classification number: B24B37/08 ,  B24B49/10

Abstract: A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Abstract translation: 提供了一种用于精确地检测上轮和下轮之间的相对位移并因此可靠地将工件抛光到所需厚度的抛光装置。 抛光装置包括用于按压至少一个工件的上轮，用于支撑工件的下轮，用于检测上轮和下轮之间的相对位移的非接触型位移检测装置，以及用于 提供位移检测基准位置。 非接触型位移检测装置与上轮连接以与其一起移动。 参考台设置在与位移检测装置相对的位置处，并且一体地连接到下轮。