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286 条记录 (耗时 0.021 秒)

    Method of manufacturing a heat sink assembly with overmolded carbon matrix
    11.
    发明授权
    Method of manufacturing a heat sink assembly with overmolded carbon matrix 失效
    制造具有包覆成型碳基体的散热器组件的方法

    公开(公告)号：US06680015B2

    公开(公告)日：2004-01-20

    申请号：US09774521

    申请日：2001-01-31

    申请人： Kevin A. McCullough

    发明人： Kevin A. McCullough

    IPC分类号： B29C4514

    CPC分类号： H01L23/373 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T428/30 ,  Y10T428/31678 ,  H01L2924/00

    摘要： A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductive polymer composition that is filled with thermally conductive filler material. The molded heat sink is freely convecting through the part which makes it more efficient and has an optimal thermal configuration.

    摘要翻译： 提供了一种网状模制散热器，其包括导热主体和与主体一体地连接并从主体散发的多个导热翅片。 通过用填充有导热填充材料的导热聚合物组合物包覆成型碳 - 碳基体芯板来形成散热片。 模制散热器通过部件自由对流，使其更有效，并具有最佳的热构型。

    Method of molding a low spin golf ball comprising silicone material
    12.
    发明授权
    Method of molding a low spin golf ball comprising silicone material 失效
    包含有机硅材料的低自旋高尔夫球的成型方法

    公开(公告)号：US06676876B2

    公开(公告)日：2004-01-13

    申请号：US09740317

    申请日：2000-12-18

    申请人： Michael J. Sullivan ,  R. Dennis Nesbitt ,  Mark L. Binette

    发明人： Michael J. Sullivan ,  R. Dennis Nesbitt ,  Mark L. Binette

    IPC分类号： B29C4514

    CPC分类号： A63B37/0003 ,  A63B37/0031 ,  A63B37/0033 ,  A63B37/0034 ,  A63B37/0045 ,  A63B37/0065 ,  A63B37/0076 ,  A63B37/008 ,  C08L23/025 ,  C08L23/08 ,  C08L23/0876 ,  C08L2205/02 ,  C08L2666/04

    摘要： The present invention is directed to a golf ball comprising a soft core and a hard cover to produce a golf ball having a reduced spin rate. The present invention is also directed to an improved golf ball comprising at least one interior layer and/or a core comprising a silicone material. It is preferred to also utilize a multi-layer cover in conjunction with the silicone materials. The golf ball of the present invention may also utilize an enlarged diameter which serves to further reduce spin rate. The resulting golf ball exhibits properties of reduced spin without sacrificing durability, playability and resilience.

    摘要翻译： 本发明涉及一种包括软芯和硬质盖的高尔夫球，以产生具有降低的旋转速率的高尔夫球。 本发明还涉及一种改进的高尔夫球，其包括至少一个内层和/或包含硅树脂材料的芯。 优选地还与硅树脂材料一起使用多层覆盖物。 本发明的高尔夫球也可以利用扩大的直径，其用于进一步降低旋转速率。 所得到的高尔夫球具有降低的旋转性能，而不牺牲耐久性，可玩性和弹性。

    Method of manufacturing a U-shaped heat sink assembly
    14.
    发明授权
    Method of manufacturing a U-shaped heat sink assembly 失效

    公开(公告)号：US06649108B2

    公开(公告)日：2003-11-18

    申请号：US10010600

    申请日：2001-12-07

    申请人： Kevin A. McCullough ,  E. Mikhail Sagal

    发明人： Kevin A. McCullough ,  E. Mikhail Sagal

    IPC分类号： B29C4514

    CPC分类号： H01L23/467 ,  F28F3/02 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a net-shape moldable U-shaped heat sink assembly includes injection molding a thermally conductive polymer composite material. The method includes forming a heat sink assembly base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of the base member and a left upstanding wall extends from a second side of the base member to form a substantially U-shaped heat sink assembly. To enhance thermal conductivity, fins members may be integrally formed into the base member, right wall and/or left wall during the molding of the heat sink assembly. Also, a flexible metallic substrate or hinges may be embedded within the U-shaped heat sink assembly to permit positioning of the right wall and left wall relative to the base member for custom configuration of the heat sink assembly.

    Roller and method of producing the same
    15.
    发明授权
    Roller and method of producing the same 有权
    辊及其制造方法

    公开(公告)号：US06645415B2

    公开(公告)日：2003-11-11

    申请号：US09828141

    申请日：2001-04-09

    申请人： Shigeru Takatsu

    发明人： Shigeru Takatsu

    IPC分类号： B29C4514

    CPC分类号： F16C27/066 ,  B29C45/14311 ,  B29C45/14491 ,  B29C2045/14319 ,  B29L2031/32 ,  F16C13/006 ,  F16C13/02 ,  F16C19/06 ,  F16C33/586 ,  F16C35/067

    摘要： A roller. Grooves are recessed on an outer peripheral surface of an outer race in a bearing. A part of a synthetic resin tire is integrally adhered to the outer race of the bearing and is inserted and bonded within at least one of the grooves on the outer peripheral surface of the outer race in the bearing, so that firm adhesion or bonding can be obtained. Accordingly, such an adhered fitting body is prevented from being peeled off from the outer race of the bearing and the tire and the outer race of the bearing are prevented from separately detaching even when the bearing is exposed to a heavy load or rotates at a high speed.

    摘要翻译： 辊子。 凹槽凹入在轴承的外圈的外周表面上。 合成树脂轮胎的一部分与轴承的外圈一体地粘接在轴承的外圈的外周面上的至少一个槽内，从而可以牢固地粘合或粘接 获得。 因此，即使在轴承暴露于重负荷或高转速时也能够防止这样的粘接配合体从轴承的外圈剥离，并且防止轴承的外圈脱离 速度。

    Apparatus for reduced flash encapsulation of microelectronic devices
    16.
    发明授权
    Apparatus for reduced flash encapsulation of microelectronic devices 失效
    用于减少微电子器件的闪存封装的装置

    公开(公告)号：US06644949B2

    公开(公告)日：2003-11-11

    申请号：US09904240

    申请日：2001-07-11

    申请人： Brad D. Rumsey ,  Todd O. Bolken ,  Cary J. Baerlocher

    发明人： Brad D. Rumsey ,  Todd O. Bolken ,  Cary J. Baerlocher

    IPC分类号： B29C4514

    CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T428/24273 ,  Y10T428/24777 ,  H01L2924/00

    摘要： A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first edge, and an engaging surface with at least a portion of the engaging surface spaced apart from the first and second edges. The first edge of the support member is positioned proximate to a wall of a mold and an aligning member is moved relative to the wall of the mold to contact the engaging surface of the support member and bias the first edge of the support member against the wall of the mold. The microelectronic device is then encapsulated by disposing an encapsulating material in the mold adjacent to the microelectronic device. By biasing the first edge of the support member against the wall of the mold, the method can prevent encapsulating material from passing between the first edge of the support member and the wall of the mold, where the encapsulating material would otherwise form flash. Accordingly, a method and apparatus in accordance with an embodiment of the invention can reduce or eliminate flash adjacent to the first edge of the support member.

    摘要翻译： 一种用于封装微电子器件的方法和装置。 在一个实施例中，微电子器件与具有第一边缘，与第一边缘相对的第二边缘的支撑构件以及与第一和第二边缘间隔开的接合表面的至少一部分的接合表面接合。 支撑构件的第一边缘定位成靠近模具的壁并且对准构件相对于模具的壁移动以接触支撑构件的接合表面并将支撑构件的第一边缘抵靠壁 的模具。 然后通过将密封材料设置在与微电子器件相邻的模具中来封装微电子器件。 通过将支撑构件的第一边缘偏置在模具的壁上，该方法可以防止包封材料通过支撑构件的第一边缘和模具的壁之间，其中封装材料将形成闪光。 因此，根据本发明的实施例的方法和装置可以减少或消除与支撑构件的第一边缘相邻的闪光。

    Method of making a jointed linkage support system
    18.
    发明授权
    Method of making a jointed linkage support system 失效
    制造连接支撑系统的方法

    公开(公告)号：US06607684B1

    公开(公告)日：2003-08-19

    申请号：US09665031

    申请日：2000-09-19

    申请人： James S. W. Lee ,  Chiu-Keung Kwan

    发明人： James S. W. Lee ,  Chiu-Keung Kwan

    IPC分类号： B29C4514

    CPC分类号： A63H3/46 ,  B29C45/0017 ,  B29C45/14467 ,  B29C65/665 ,  B29C2045/002 ,  B29L2031/5218 ,  Y10T403/32631

    摘要： A jointed linkage support system is provided with joints that allow movement and bending in many directions and degrees of freedom. A chain-like linkage system made up of a series of joints is molded in a single step from materials having different melting temperatures in a series of alternating communicating mold cavities. The jointed linkage support system emerges from the mold fully assembled. An electrical switch may be provided within.one of the joints between sleeves and rods whereby movement of the rod relative to the sleeve actuates the switch.

    摘要翻译： 连接连杆支撑系统设置有允许在许多方向和自由度上移动和弯曲的接头。 在一系列交替连通的模腔中，由具有不同熔融温度的材料在一个步骤中模制由一系列接头构成的链状连接系统。 连接支撑系统从模具完全组装起来。 可以在套筒和杆之间的接头之一内提供电开关，由此杆相对于套筒的移动致动开关。

    Production method of golf ball
    20.
    发明授权
    Production method of golf ball 失效
    高尔夫球的制作方法

    公开(公告)号：US06605243B1

    公开(公告)日：2003-08-12

    申请号：US09511266

    申请日：2000-02-23

    申请人： Yutaka Masutani

    发明人： Yutaka Masutani

    IPC分类号： B29C4514

    CPC分类号： A63B37/0097 ,  A63B37/0003 ,  B29C45/14073 ,  B29C45/14819 ,  B29L2031/545

    摘要： A method for producing a golf ball including a spherical elastic inner layer having a large number of projections with a round shape or a polygonal shape when viewed two-dimensionally on the outer surface with a predetermined space, and a thermoplastic resin outer layer covering the inner layer. The method employs a mold including an upper mold and a lower mold with a spherical cavity formed in the inside and a parting surface provided at a position corresponding to an equator of the spherical cavity, with pole sections of the upper mold and the lower mold each provided with a plurality of columnar support pins elongating into the cavity reciprocally movably. In the method, the inner layer is supported at the cavity center portion of the mold by the support pins from above and below at the outer surface space position, and an external layer resin is injected into the space between the inner layer and the cavity wall surface so as to integrally form the inner and outer layers.

    摘要翻译： 一种高尔夫球的制造方法，其特征在于，具有在外表面上以规定间隔二维地观察具有圆形或多边形状的多个突起的球形弹性内层的高尔夫球，以及覆盖所述内侧的热塑性树脂外层 层。 该方法采用包括上模具和下模具的模具，其内部形成有球形腔，并且设置在与球形腔的赤道对应的位置处的分型面，上模具和下模具的极部分各自 设置有多个可往复运动地延伸到空腔中的柱状支撑销。 在该方法中，内层通过支撑销在外表面空间位置从上方和下方支撑在模具的腔中心部分，并且外层树脂注入到内层和空腔壁之间的空间中 以便整体地形成内层和外层。