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公开(公告)号：US08148803B2
公开(公告)日：2012-04-03
申请号：US10077554
申请日：2002-02-15
IPC分类号： H01L23/495
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/49558 , H01L24/32 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模制）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。
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公开(公告)号：US07459773B2
公开(公告)日：2008-12-02
申请号：US11268095
申请日：2005-11-07
IPC分类号： H01L23/02
CPC分类号： H05K3/303 , H01L25/105 , H01L25/18 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/0002 , H01L2924/15311 , H01L2924/3011 , H05K2201/10515 , H05K2201/10734 , H05K2203/167 , Y02P70/613 , H01L2924/00
摘要： A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball grid arrays includes non-metal mateable alignment features. Each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays to from the vertically stacked memory package.
摘要翻译： 一种具有多个垂直堆叠的球栅阵列的存储器封装。 每个垂直堆叠的球栅阵列具有与其耦合的存储芯片。 此外，多个球栅阵列中的每一个包括非金属可对准的对准特征。 多个球栅阵列中的每一个耦合到多个球栅阵列中的另一个，以从垂直堆叠的存储器封装。
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公开(公告)号：US07423331B2
公开(公告)日：2008-09-09
申请号：US10932940
申请日：2004-09-02
申请人： Chad A Cobbley , Cary J Baerlocher
发明人： Chad A Cobbley , Cary J Baerlocher
IPC分类号： H01L23/497
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/49558 , H01L24/32 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模制）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。
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4.发明授权Semiconductor integrated circuit package having electrically disconnected solder balls for mounting 有权半导体集成电路封装，具有用于安装的电气断开的焊球公开(公告)号：US07276802B2
公开(公告)日：2007-10-02
申请号：US10123827
申请日：2002-04-15
申请人： Frank L. Hall , Cary J. Baerlocher
发明人： Frank L. Hall , Cary J. Baerlocher
CPC分类号： H01L24/73 , H01L21/563 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2224/0401 , H01L2224/05554 , H01L2224/0558 , H01L2224/05644 , H01L2224/114 , H01L2224/116 , H01L2224/13111 , H01L2224/13147 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45164 , H01L2224/48644 , H01L2224/73203 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/8319 , H01L2224/8385 , H01L2224/85138 , H01L2224/92125 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.
摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。
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公开(公告)号：US06953891B2
公开(公告)日：2005-10-11
申请号：US10663959
申请日：2003-09-16
IPC分类号： H01G4/00 , H01L21/48 , H01L23/055 , H01L23/28 , H01L27/146 , H05K5/06
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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公开(公告)号：US06365434B1
公开(公告)日：2002-04-02
申请号：US09605582
申请日：2000-06-28
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L2924/0002 , Y10T428/24273 , Y10T428/24777 , H01L2924/00
摘要： A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first edge, and an engaging surface with at least a portion of the engaging surface spaced apart from the first and second edges. The first edge of the support member is positioned proximate to a wall of a mold and an aligning member is moved relative to the wall of the mold to contact the engaging surface of the support member and bias the first edge of the support member against the wall of the mold. The microelectronic device is then encapsulated by disposing an encapsulating material in the mold adjacent to the microelectronic device. By biasing the first edge of the support member against the wall of the mold, the method can prevent encapsulating material from passing between the first edge of the support member and the wall of the mold, where the encapsulating material would otherwise form flash. Accordingly, a method and apparatus in accordance with an embodiment of the invention can reduce or eliminate flash adjacent to the first edge of the support member.
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公开(公告)号：US06329220B1
公开(公告)日：2001-12-11
申请号：US09448072
申请日：1999-11-23
IPC分类号： H01L2144
CPC分类号： H01L21/561 , H01L21/565 , H01L23/3107 , H01L24/32 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/30107 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K2201/10568 , H05K2201/10734 , H05K2201/10977 , H05K2201/2036 , Y02P70/613 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.
摘要翻译： 球栅阵列组件包括包封模具和包括模具附接到其上的基板的一部分的封装盖，包括基板的边缘。 通过盖子封装衬底边缘可以减少水分或其他污染物渗透到衬底中。 该盖包括延伸以接触球栅阵列组件所连接的电路板的肋。 使用这样的肋，在焊接期间保持电路板和基板之间的平坦度。
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公开(公告)号：US08716849B2
公开(公告)日：2014-05-06
申请号：US13438306
申请日：2012-04-03
IPC分类号： H01L23/495
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/49558 , H01L24/32 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. A stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模塑）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。
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公开(公告)号：US20120187552A1
公开(公告)日：2012-07-26
申请号：US13438306
申请日：2012-04-03
IPC分类号： H01L23/31
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/49558 , H01L24/32 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模制）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。
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公开(公告)号：US08115296B2
公开(公告)日：2012-02-14
申请号：US12579187
申请日：2009-10-14
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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