摘要:
A structure formed on a semiconductor wafer is examined by obtaining a first diffraction signal measured using a metrology device. A second diffraction signal is generated using a machine learning system, where the machine learning system receives as an input one or more parameters that characterize a profile of the structure to generate the second diffraction signal. The first and second diffraction signals are compared. When the first and second diffraction signals match within a matching criterion, a feature of the structure is determined based on the one or more parameters or the profile used by the machine learning system to generate the second diffraction signal.
摘要:
A method is provided for predicting leakage current in a semiconductor die with a plurality of devices. A limited leakage macro is incorporated on the semiconductor die. The limited leakage macro is initially tested to measure a leakage current before testing devices outside the limited leakage macro. The measured leakage current is compared to a threshold value for the leakage current. If the leakage current exceeds the threshold value, probe testing is terminated. If, however, the leakage current does not exceed the threshold value, testing continues for devices outside of the limited leakage macro.
摘要:
A wafer level testing method for RFID tags is disclosed. The method comprises: providing a semiconductor wafer having a plurality of RFID tag chips, wherein each of the RFID tag chips includes at least one detachable inductance and an embedded capacitance to form a resonant circuit; exposing the RFID tag chips to microwave energy, wherein the RFID tag chips send a plurality of wireless signals after a wireless power conversion; receiving the wireless signals and calculating a power level thereof; and comparing the power level to a predetermined power level to obtain the wafer yield.
摘要:
The present invention provides a driver, including: data lines disposed in parallel with each other; gate lines disposed in parallel with each other and at right angles to the data lines so as to be electrically insulated from the data lines; odd-numbered pixel cell connected to the odd-numbered data line from the head one, and the odd-numbered gate line from the head one; even-numbered pixel cell connected to the even-numbered data line from the head one, and the even-numbered gate line from the head one; driving means for driving the odd-numbered gate lines and the even-numbered gate lines independently of each other; inputting means for inputting a signal having a predetermined potential to each of the odd-numbered gate lines and the even-numbered gate lines; and comparing means for comparing potentials of the each adjacent odd-numbered data line and even-numbered data line with each other, and outputting a comparison result.
摘要:
Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vd, the enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.
摘要:
Disconnection defects, short-circuit defects and the like in wiring patterns of submicron sizes within TEGs (a square of 1 to 2.5 mm for each) numerously arranged in a large chip (a square of 20 to 25 mm) can be inspected with respect to all the TEGs, with good operability, high reliability and high efficiency. A conductor probe for applying voltage to the wiring patterns by mechanical contact is composed of synchronous type conductor probe that synchronizes with movement of a sample stage (16), and fixed type conductor probe means (21) that is relatively fixed to an FIB generator (10). Positions of probe tips are superimposed to an SIM image and displayed on a display unit (19).
摘要:
Disclosed is a novel method and apparatus for acquiring multiple capacitively sensed measurements from a circuit under test. Multiple digital sources are respectively connected to stimulate multiple respective first ends of multiple respective nets of interest. Respective second ends of the multiple respective nets of interest are capacitively sensed. The respective capacitively coupled signals are digitally sampled and shift correlated with respective expected digital signatures. If a high level of correlation is found for a given net, the net is electrically intact; otherwise, the net is characterized by either an open or some other fault that prevents it from meeting specification.
摘要:
A board for testing DVD (Digital Versatile Disc) ROM (Read Only Memory) chip-set and associated circuit for generating radio frequency signals with phase difference are provided. The circuit includes signal potential dividers, high pass filters, and a phase shifter. The circuit receives a digital input signal, which has a predetermined frequency, generated by a chip test device. The radio frequency signals with phase difference for testing the analog circuit block of DVD ROM chipset are generated according to the received digital input signal. Therefor, the high temperature operating life test for optical disc drive chips can be achieved.
摘要:
A testing system evaluates one or more integrated circuit chips using RF communication. The system includes an interrogator unit with a radio communication range, and an IC chip adapted with RF circuitry positioned remotely from the interrogator unit, but within the radio communication range. The interrogator unit transmits a power signal to energize the IC chip during test procedures, and interrogating information for evaluating the operation of the IC chip. Test results are transmitted by the IC chip back to the interrogator unit for examination to determine whether the IC chip has a defect. In this manner, one or more IC chips can be evaluated simultaneously without physically contacting each individual chip.
摘要:
A testing system evaluates one or more integrated circuit chips using RF communication. The system includes an interrogator unit with a radio communication range, and an IC chip adapted with RF circuitry positioned remotely from the interrogator unit, but within the radio communication range. The interrogator unit transmits a power signal to energize the IC chip during test procedures, and interrogating information for evaluating the operation of the IC chip. Test results are transmitted by the IC chip back to the interrogator unit for examination to determine whether the IC chip has a defect. In this manner, one or more IC chips can be evaluated simultaneously without physically contacting each individual chip.