公开(公告)号：US06661086B2

公开(公告)日：2003-12-09

申请号：US10146583

申请日：2002-05-15

申请人： Rudolf Zelsacher

发明人： Rudolf Zelsacher

IPC分类号： H01L2324

CPC分类号： H01L21/67144 ,  H01L23/481 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The invention relates to a three-dimensional circuit configuration in which semiconductor chips are configured one above the other and in which the semiconductor chips are electrically connected together. In this arrangement, conductive channels are produced between mutually opposite surfaces of the semiconductor chips by thermomigrating a conductive material.

公开(公告)号：US06642617B2

公开(公告)日：2003-11-04

申请号：US10241522

申请日：2002-09-12

申请人： Takahisa Kawai

发明人： Takahisa Kawai

IPC分类号： H01L2324

CPC分类号： H03H9/0542 ,  H01L23/647 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03H9/0547 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor device includes a SAW device chip. The SAW device chip is provided on a passive element chip in which a passive element circuit including a transmission line is formed on a semi-insulating compound substrate having one surface set to have a ground potential electrode. In the semiconductor device, even when the width of the transmission line is increased, a high characteristic impedance can be maintained by increasing the thickness of the substrate. This can reduce the resistance of the transmission line and can facilitate matching with the SAW device.