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公开(公告)号：US11569431B1
公开(公告)日：2023-01-31
申请号：US16989535
申请日：2020-08-10
摘要： A CMOS-compatible actuator platform for implementing phase, amplitude, and frequency modulation in silicon nitride photonic integrated circuits via piezo-optomechanical coupling using tightly mechanically coupled aluminum nitride actuators is disclosed. The platform, which may be fabricated in a CMOS foundry, enables scalable active photonic integrated circuits for visible wavelengths, and the piezoelectric actuation functions without performance degradation down to cryogenic operating temperatures. A number of devices are possible, including ring modulator devices, phase shifter devices, Mach-Zehnder interferometer devices, directional coupler devices (including tunable directional coupler devices), and acousto-optic modulator and frequency shifter devices, each of which can employ the same AlN actuator platform. As all of these devices can be built on the same AlN actuator platform, numerous optical functions can be implemented on a single die.
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公开(公告)号：US20230028329A1
公开(公告)日：2023-01-26
申请号：US17938567
申请日：2022-10-06
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
IPC分类号： H01L41/083 , A61B8/00 , H01L27/20 , H01L41/338
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.
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公开(公告)号：US20230024822A1
公开(公告)日：2023-01-26
申请号：US17859429
申请日：2022-07-07
申请人： Sara Ahmed , Mohamadreza Khalili , Athanassios Thomas Pagagiannakis , Gopal Vishwakarma , Samer Dessouky
发明人： Sara Ahmed , Mohamadreza Khalili , Athanassios Thomas Pagagiannakis , Gopal Vishwakarma , Samer Dessouky
IPC分类号： G01G19/03 , G01G19/52 , G01G3/13 , H01L41/083 , H01L41/113 , H02N2/18
摘要： Aspects of self-powered weigh-in-motion systems and methods that utilize piezoelectric components for sensing load as well as powering data acquisition and analysis components. In one example, the weigh-in-motion system includes a number of piezoelectric stacks, each stack including a number of piezoelectric elements. Each stack includes one or more top or upper piezoelectric element that provides vehicle sensing data. Each stack also includes a set of piezoelectric elements used for energy harvesting. The sensing piezoelectric elements are connected to a data input of a microcontroller for vehicle classification, while the energy harvesting piezoelectric elements are connected to a power input of the microcontroller.
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公开(公告)号：US20230019706A1
公开(公告)日：2023-01-19
申请号：US17946825
申请日：2022-09-16
申请人： FUJIFILM Corporation
发明人： Teruo ASHIKAWA , Kazuo HIRAGUCHI , Yusuke KAGAWA , Tetsu MIYOSHI
IPC分类号： H04R17/00 , H01L41/047 , H01L41/053 , H01L41/083
摘要： Provided are a laminated piezoelectric element and an electroacoustic transducer capable of obtaining high piezoelectric characteristics and easily ensuring an electric contact to an electrode layer. A plurality of layers of piezoelectric films, each of which is formed by laminating a first protective layer, a first electrode layer, a piezoelectric layer, a second electrode layer, and a second protective layer in this order, are laminated. Each of the piezoelectric layers is polarized in a thickness direction. In each of the piezoelectric films, the first electrode is disposed on an upstream side in a polarization direction of the piezoelectric layer, and the second electrode is disposed on a downstream side. Each of the plurality of piezoelectric films has a cemented portion which is cemented to an adjacent piezoelectric film and a protruding portion which is not cemented to the adjacent piezoelectric film and in which at least the first electrode layer and the first protective layer or the second electrode layer and the second protective layer protrude from the cemented portion toward the outside in a plane direction. At the protruding portion of each of the piezoelectric films, at least one of a first contact, to which the first electrode layers of the piezoelectric films are electrically connected to each other, or a second contact, to which the second electrode layers of the piezoelectric films are electrically connected to each other, is formed.
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公开(公告)号：US20230019436A1
公开(公告)日：2023-01-19
申请号：US17787326
申请日：2020-12-18
申请人： THALES
IPC分类号： H01L41/083 , B81B3/00 , H01L41/18 , G02B26/10 , G02B26/08
摘要： An optoelectronic component includes an optical transducer made of III-V semiconductor material and an optical scanning microelectromechanical system comprising a mirror. The optical transducer and the optical scanning microelectromechanical system are produced on a common wafer comprising at least a first layer made of silicon or silicon nitride with a thickness of less than one micron and wherein at least the mirror and its holding springs are produced. In a first variant, the mobile parts of the optical scanning microelectromechanical system are produced in various layers of silicon. In a second variant, the mobile parts of the optical scanning microelectromechanical system are produced in the layer of III-V semiconductor material.
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公开(公告)号：US11538981B2
公开(公告)日：2022-12-27
申请号：US16911437
申请日：2020-06-25
发明人： Kenichi Kurokawa , Yukio Kitahara , Kazuo Tanaka
IPC分类号： H01L41/083 , H01L41/09 , H01L41/18 , H01L41/257 , H03H9/13 , H03H9/21 , H03H9/125 , H03H9/24
摘要： A vibration element includes: a base; a first arm continuous with the base; a second arm that is continuous with the base and is adjacent to the first arm; a first electrode disposed on the first arm, the second arm, and the base; a first piezoelectric layer that has a first polarity and that is disposed on the first electrode on the first arm; a second piezoelectric layer that has a second polarity different from the first polarity and that is disposed on the first electrode on the second arm; an insulating layer disposed on the first electrode on the base; and a second electrode disposed on the first piezoelectric layer, the second piezoelectric layer, and the insulating layer.
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公开(公告)号：US20220384707A1
公开(公告)日：2022-12-01
申请号：US17883739
申请日：2022-08-09
IPC分类号： H01L41/083 , H01L41/047
摘要： In a piezoelectric device, when viewed in a direction perpendicular to one main surface, an outer shape of a recess is a polygonal shape or a circular shape. When n represents a number of sides of the polygonal shape, r represents a radius of a circumscribed circle of an imaginary regular polygon including n sides with a length identical to a length of a shortest of the sides, and d represents a maximum thickness of a membrane portion, which is located above the recess, of a multilayer portion, r≤197.7dn−0.6698 when 3≤n≤7, and r≤52.69d when 8≤n or when the outer shape of the recess is a circular shape.
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公开(公告)号：US11508901B2
公开(公告)日：2022-11-22
申请号：US16785902
申请日：2020-02-10
发明人： Hirozumi Ogawa
IPC分类号： G01P15/08 , H01L21/00 , H01L41/187 , H01L41/047 , H01L41/083 , H01L41/09 , H01L41/113 , H01L41/273
摘要： A piezoelectric component that has a piezoelectric element including a piezoelectric ceramic layer and a sintered metal layer on at least a first main surface of the piezoelectric ceramic layer and containing a non-precious metal, and a protective layer containing an elastic body covering first and second opposed main surfaces of the piezoelectric element. The piezoelectric ceramic layer contains 90 mol % or more of a perovskite compound that contains niobium, an alkali metal, and oxygen. A thickness of the piezoelectric element is 100 μm or less.
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公开(公告)号：US11495730B2
公开(公告)日：2022-11-08
申请号：US16701048
申请日：2019-12-02
发明人： Edouard Dacruz , Flavien Daloz , Jason Barrett
IPC分类号： H01L41/083 , H01L41/338 , A61B8/00 , H01L27/20
摘要： Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.
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公开(公告)号：US11490991B2
公开(公告)日：2022-11-08
申请号：US15922362
申请日：2018-03-15
IPC分类号： H01L41/04 , A61C1/07 , A61C17/20 , B06B1/02 , B06B1/06 , B06B3/00 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/32 , H01L41/047 , H01L41/083
摘要： A medical, particularly a dental or dental surgical, ultrasonic treatment device for generating ultrasonic vibrations and transmitting the ultrasonic vibration to a tool, which can be connected to the ultrasonic treatment device, the medical ultrasonic treatment device having: an ultrasonic vibration generator with a plurality of piezoelectric elements to which an electric voltage can be applied, and a circuit board to supply the plurality of piezoelectric elements with the electric voltage. Furthermore, a method for manufacturing a corresponding medical ultrasonic treatment device is described.
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