公开(公告)号：US20190356033A1

公开(公告)日：2019-11-21

申请号：US16014036

申请日：2018-06-21

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Henning Braunisch ,  Johanna M. Swan

IPC: H01P3/16 ,  H01L23/66

Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.

公开(公告)号：US20190207314A1

公开(公告)日：2019-07-04

申请号：US16305716

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Adewale K Oladeinde ,  Telesphor Kamgaing

IPC: H01Q9/04 ,  H01Q21/22 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q1/52 ,  H01Q21/24

CPC classification number: H01Q9/045 ,  H01Q1/521 ,  H01Q5/378 ,  H01Q9/0407 ,  H01Q9/0435 ,  H01Q21/0025 ,  H01Q21/065 ,  H01Q21/22 ,  H01Q21/24 ,  H01Q25/001

Abstract: Methods and devices disclosed herein relate to a patch antenna. The patch antenna can include a patch having a conductive sheet including at least one edge. The patch can include a first polarization direction and a second polarization direction. A first antenna feed can be coupled to the patch. The first antenna feed can be positioned to transmit or receive a first signal along the first polarization direction. A second antenna feed can be coupled to the patch. The second antenna feed can be positioned to transmit or receive a second signal along the second polarization direction. At least one antenna aperture can be isolated from an edge of the patch and disposed along an aperture path. An orientation of the aperture path can bisect the first polarization direction and the second polarization direction. In one example, the antenna aperture can be located between the first antenna feed and the second antenna feed.

公开(公告)号：US20190103932A1

公开(公告)日：2019-04-04

申请号：US15721868

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Erich N. Ewy

IPC: H04J14/02 ,  G02B6/12 ,  H01S5/024 ,  H04B10/50 ,  H04B10/572

CPC classification number: H04J14/02 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12033 ,  H01S5/02415 ,  H04B10/506 ,  H04B10/572 ,  H04B10/90

Abstract: Embodiments include a wavelength selective communication system for use in vehicles. In an embodiment, the communication system may include a primary dielectric waveguide having a first cross-sectional area. In an embodiment, a coupling arm dielectric waveguide may be communicatively coupled to the primary dielectric waveguide. In an embodiment, the coupling arm has a second cross-sectional area that is smaller than or equal to the cross-sectional area of the first cross-sectional area. According to an embodiment, the coupling arm is communicatively coupled to the primary dielectric waveguide by a waveguide connector.

公开(公告)号：US20190089409A1

公开(公告)日：2019-03-21

申请号：US16196367

申请日：2018-11-20

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Henning Braunisch ,  Hyung-Jin Lee ,  Richard Dischler

IPC: H04B3/52 ,  H04B3/56 ,  H04B1/52

Abstract: Embodiments may relate to a transceiver chip. The transceiver chip may include a substrate that has a first transceiver component and a second transceiver component positioned therein. The transceiver chip may further include a well material that is positioned between the first transceiver component and the second transceiver component. The well material may mitigate cross-talk between the first transceiver component and the second transceiver component. Other embodiments may be described or claimed.

公开(公告)号：US20190013924A1

公开(公告)日：2019-01-10

申请号：US16127800

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04W72/04 ,  H04B1/44

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US10128177B2

公开(公告)日：2018-11-13

申请号：US14433369

申请日：2014-05-06

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Torrey W. Frank

IPC: H01L21/00 ,  H01L23/498 ,  G06F1/16 ,  H01L21/288 ,  H01L23/522 ,  H01L23/66 ,  H01L23/14 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.

公开(公告)号：US10079668B2

公开(公告)日：2018-09-18

申请号：US15388204

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04B1/44 ,  H04W72/04

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US10033093B2

公开(公告)日：2018-07-24

申请号：US14141830

申请日：2013-12-27

Applicant: INTEL CORPORATION

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sarah K. Haney

IPC: H01Q1/38 ,  H01Q1/22

Abstract: A method including disposing a transmission line or an antenna on dielectric material; and removing a portion of the dielectric material from a region adjoining the transmission line or the antenna where the electromagnetic radiation from the transmission line or the antenna is predetermined to be greater than another portion of the dielectric material. An apparatus including a package substrate including a transmission line coupled to an antenna, the transmission line and the antenna disposed on a dielectric layer including an organic dielectric material having a first dielectric constant and a second material having a dielectric constant less than the first dielectric constant, wherein the second dielectric material adjoins a portion of the transmission line or the antenna.

公开(公告)号：US10032052B2

公开(公告)日：2018-07-24

申请号：US15586820

申请日：2017-05-04

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Feras Eid ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: G06K19/06 ,  G06K7/10 ,  H03H9/30 ,  G06K19/067

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.

公开(公告)号：US20180183522A1

公开(公告)日：2018-06-28

申请号：US15388564

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Emanuel Cohen ,  Sasha N. Oster ,  Telesphor Kamgaing

IPC: H04B10/2525 ,  H04B10/2575 ,  H04L25/03 ,  H04J14/00

CPC classification number: H04L25/03834 ,  H04B10/90 ,  H04L25/03343

Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.