Abstract:
An image sensor may include a first substrate having circuitry including wires and a silicon layer formed on and/or over the first substrate to selectively contact the wires. The image sensor may include photodiodes bonded to the first substrate while contacting the silicon layer and electrically connected to the wires. Each unit pixel may be implemented having complicated circuitry without a reduction in photosensitivity. Additional on-chip circuitry may also be implanted in the design.
Abstract:
A method for manufacturing structures of a CMOS image sensor. The method comprises the steps of depositing a gate insulating layer and a conductive layer on a semiconductor substrate; depositing an ion implantation barrier layer on the conductive layer; patterning the deposited gate insulating layer, conductive layer and ion implantation barrier layer to form a patterned, composite gate insulating layer, gate electrode and ion implantation barrier structure; forming a second photosensitive layer pattern to define a photodiode region; and implanting low-concentration dopant ions into the substrate using the second photosensitive layer pattern as an ion implantation mask to form a low-concentration dopant region within the photodiode region.
Abstract:
A CMOS image sensor and method for fabricating the same, wherein the CMOS image sensor has minimized dark current at the boundary area between a photodiode and an isolation layer. The present invention includes a first-conductivity-type doping area formed in the device isolation area of the substrate, the first-conductivity-type doping area surrounding the isolation area and a dielectric layer formed between the isolation layer and the first-conductivity-type doping area, wherein the first-conductivity-type doping area and the dielectric layer are located between the isolation layer and a second-conductivity-type diffusion area.
Abstract:
An apparatus for catching byproducts in semiconductor device processing equipment is disposed in an exhaust line between a process chamber and a vacuum pump. The apparatus includes a cylindrical trap housing member, an upper cover and a lower cover covering the upper part and lower part of the trap housing, respectively, a heater disposed under the upper cover, first and second cooling plates disposed in the trap housing, a post spacing the cooling plates, apart and a cooling system for cooling respective portions of the apparatus. The cooling system includes a delivery pipe for supplying refrigerant, a discharge pipe for discharging the refrigerant from the apparatus, first cooling piping extending through each cooling plate and connected to the delivery and discharge pipes, and second cooling piping extending helically along the outer circumferential surface of the trap housing.
Abstract:
A mobile image forming apparatus is provided that comprises a casing, a support frame to surround a printing medium roll from which a printing medium is supplied and to guide the printing medium, an image forming unit to form an image on the printing medium guided by the support frame and a printing medium receiving portion disposed between the casing and the support frame to receive therein the printing medium on which the image is formed by the image forming unit. The mobile image forming apparatus may further comprise a roll support core disposed in the support frame to rotatably support the printing medium roll.
Abstract:
An image forming apparatus is provided and includes a platen roller and a thermal printing head. The thermal printing head is elastically biased toward the platen roller and rotates about a pivot of the platen roller for moving between first and second positions to faces first and second surfaces of a medium. A transfer portion has driving and driven rollers which are rotatably engageable with each other to transfer the media. A guiding unit reduces a difference of media transfer force of the transfer portion when the thermal printing head is respectively located in the first and second positions.
Abstract:
A CMOS image sensor and a manufacturing method are disclosed. The gates of the transistors are formed in the active region of the unit pixel, and a diffusion region for the photo diode is defined by an ion implantation of impurities to the semiconductor substrate. The patterns of the photoresist that are the masking layer against ion implantation are formed on the semiconductor substrate in such a manner that they have the boundary portion of the isolation layer so as not to make the boundary of the defined photo diode contact with the boundary of the isolation layer. Damages by an ion implantation of impurities at the boundary portion between the diffusion region for the photo diode and the isolation layer are prevented, which reduces dark current of the COMS image sensor.
Abstract:
An automatic transmission consisting of a planetary gear unit comprising in combination an input shaft (1), an input gear (2), a key planet gear (3), an output gear (4), an output shaft (5), a bearing planet gear (6), a rotating frame (7), a rotor (8), wherein the planet shaft is the rotor (8) having a certain inertia moment, so its revolving is equivalent to the precession of a gyroscope due to an external force wherein the precession-production external force is the load acting on the output shaft (5). Hence the revolutionary speed of the rotor (8) varies depending upon changes in the output load and the same holds true for the rotational speed of the output shaft (5), which makes the speed ratio spontaneously vary with changes in the outpot load. Accordingly, the transmission of the present invention operates at speed ratios spontaneously varying with changes in load, without any controlling operation.
Abstract:
CMOS image sensor and method for fabricating the same, the CMOS image sensor including a second conductive type semiconductor substrate having an active region and a device isolation region defined therein, wherein the active region has a photodiode region and a transistor region defined therein, a device isolating film in the semiconductor substrate of the device isolation region, a first conductive type impurity region in the semiconductor substrate of the photodiode region, the first conductive type impurity region being spaced a distance from the device isolation film, and a second conductive type first impurity region in the semiconductor substrate between the first conductive type impurity region and the device isolation film, thereby reducing generation of a darkcurrent at an interface between the photodiode region and a field region.
Abstract:
A CMOS image sensor includes a first conductive type semiconductor substrate having an active region and a device isolation region, a device isolation film formed in the device isolation region of the semiconductor substrate, a second conductive type diffusion region formed in the active region of the semiconductor substrate, and an ion implantation prevention layer formed in the vicinity of the device isolation film, including a boundary portion between the device isolation film and the second conductive type diffusion region.