公开(公告)号：US10905362B2

公开(公告)日：2021-02-02

申请号：US16407054

申请日：2019-05-08

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Olivier Le Neel ,  Suman Cherian ,  Calvin Leung

IPC: G01N27/327 ,  A61B5/1473 ,  A61B5/145 ,  A61B5/1468

Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.

公开(公告)号：US20200168582A1

公开(公告)日：2020-05-28

申请号：US16692720

申请日：2019-11-22

Applicant: STMicroelectronics Pte Ltd ,  STMicroelectronics (Grenoble 2) SAS

Inventor： David GANI ,  Jean-Michel RIVIERE

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/48 ,  H01L23/528

Abstract: An electronic device includes a support substrate to which a first electronic chip and a second electronic chip are mounted in a position situated on top of one another. First electrical connection elements are interposed between the first electronic chip and the support substrate. Second electrical connection elements are interposed between the second electronic chip and the support substrate and are situated at a distance from a periphery of the first electronic chip. Third electrical connection elements are interposed between the first electronic chip and the second electronic chip.

公开(公告)号：US10529652B2

公开(公告)日：2020-01-07

申请号：US16380591

申请日：2019-04-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/00 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

公开(公告)号：US10429509B2

公开(公告)日：2019-10-01

申请号：US14674650

申请日：2015-03-31

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Jerome Teysseyre

IPC: G01V8/00 ,  G01S17/02 ,  H01L25/16 ,  G01S7/481 ,  H01L31/173

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US10403661B2

公开(公告)日：2019-09-03

申请号：US15619649

申请日：2017-06-12

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel Grebet ,  Wee Chin Judy Lim

IPC: H01L27/146 ,  H01L31/0203

Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.

公开(公告)号：US20190257804A1

公开(公告)日：2019-08-22

申请号：US15901721

申请日：2018-02-21

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS S.R.L.

Inventor： Malek BRAHEM ,  Hatem MAJERI ,  Olivier LE NEEL ,  Ravi SHANKAR ,  Enrico Rosario ALESSI ,  Pasquale BIANCOLILLO

IPC: G01N33/00 ,  G01N27/02 ,  G01N27/12

Abstract: The present disclosure is directed to a gas sensor device that detects gases with large molecules (e.g., a gas with a molecular weight between 150 g/mol and 450 g/mol), such as siloxanes. The gas sensor device includes a thin film gas sensor and a bulk film gas sensor. The thin film gas sensor and the bulk film gas sensor each include a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. The SMO film of the thin film gas sensor is an thin film (e.g., between 90 nanometers and 110 nanometers thick), and the SMO film of the bulk film gas sensor is an thick film (e.g., between 5 micrometers and 20 micrometers thick). The gas sensor device detects gases with large molecules based on a variation between resistances of the SMO thin film and the SMO thick film.

公开(公告)号：US10381504B2

公开(公告)日：2019-08-13

申请号：US15969908

申请日：2018-05-03

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/0232 ,  H01L31/18 ,  H03K17/94 ,  H03K17/96 ,  H01L31/167 ,  G01S17/02 ,  G01S7/481 ,  H01L25/16 ,  G01V8/12 ,  H01L21/56

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

公开(公告)号：US10347786B2

公开(公告)日：2019-07-09

申请号：US15880090

申请日：2018-01-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Cheng-Lay Ang

IPC: H01G9/20 ,  G01S17/08 ,  G01S7/481 ,  H01L31/12 ,  H01S5/022 ,  H01S5/183 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/173 ,  H01L31/0203 ,  H01L31/0236 ,  H01L31/0475

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20190195818A1

公开(公告)日：2019-06-27

申请号：US16217631

申请日：2018-12-12

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Malek BRAHEM ,  Hatem Majeri ,  Olivier Le Neel ,  Ravi Shankar

IPC: G01N27/12 ,  G01N33/00

CPC classification number: G01N27/123 ,  G01N33/0031 ,  G01N33/0047 ,  G01N33/0065 ,  G01N33/0075

Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.

公开(公告)号：US20190081022A1

公开(公告)日：2019-03-14

申请号：US16189010

申请日：2018-11-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian ZHOU

IPC: H01L25/065 ,  H01L21/50 ,  H01L23/10 ,  H01L23/31 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L21/50 ,  H01L23/10 ,  H01L23/3121 ,  H01L25/50

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.