公开(公告)号：US20180067074A1

公开(公告)日：2018-03-08

申请号：US15812731

申请日：2017-11-14

Applicant: STMicroelectronics Pte Ltd

Inventor： Jerome Teysseyre ,  Yonggang Jin ,  Suman Cherian

IPC: G01N27/406 ,  G01N27/407 ,  H05K1/18

CPC classification number: G01N27/4065 ,  G01N27/4062 ,  G01N27/4071 ,  G01N27/4077 ,  H05K1/185 ,  H05K2201/09118 ,  H05K2201/10151

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

公开(公告)号：US20160047774A1

公开(公告)日：2016-02-18

申请号：US14462432

申请日：2014-08-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Jerome Teysseyre ,  Yonggang Jin ,  Suman Cherian

IPC: G01N27/406 ,  H05K3/42 ,  H05K13/04 ,  G01N27/407

CPC classification number: G01N27/4065 ,  G01N27/4062 ,  G01N27/4071 ,  G01N27/4077 ,  H05K1/185 ,  H05K2201/09118 ,  H05K2201/10151

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

Abstract translation: 紧凑的微电子气体传感器模块包括以这样的方式形成的电触头，使得它们不消耗集成电路芯片上的不动产。 使用这种设计，可以进一步小型化包装。 气体传感器与定制设计的专用集成电路（ASIC）封装在一起，该集成电路提供用于处理传感器信号以识别被测样品内的气体种类的电路。 在一个示例中，通过提供暴露于电解气体感测化合物的柱形式的附加金属表面积，同时减小整体封装尺寸，增强了传感器的输出信号强度。 在一些示例中，在形成有气体传感器的基板的下侧上形成底侧触点。 传感器电极可以直接或间接地通过通孔电耦合到ASIC。

公开(公告)号：US11513220B2

公开(公告)日：2022-11-29

申请号：US16562189

申请日：2019-09-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Jerome Teysseyre

IPC: G01S17/04 ,  H01L25/16 ,  G01S7/481 ,  H01L31/173

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US11231386B2

公开(公告)日：2022-01-25

申请号：US15812731

申请日：2017-11-14

Applicant: STMicroelectronics Pte Ltd

Inventor： Jerome Teysseyre ,  Yonggang Jin ,  Suman Cherian

IPC: G01N27/406 ,  G01N27/407 ,  H05K1/18

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

公开(公告)号：US10429509B2

公开(公告)日：2019-10-01

申请号：US14674650

申请日：2015-03-31

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Jerome Teysseyre

IPC: G01V8/00 ,  G01S17/02 ,  H01L25/16 ,  G01S7/481 ,  H01L31/173

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US20160293559A1

公开(公告)日：2016-10-06

申请号：US14674891

申请日：2015-03-31

Applicant: STMicroelectronics Pte Ltd

Inventor： Yun Liu ,  Jerome Teysseyre ,  Yonggang Jin

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L21/78 ,  H01L23/3178 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11

Abstract: One or more embodiments are directed to semiconductor packages that include a pillar and bump structures. The semiconductor packages include a die that has recess at a perimeter of the semiconductor die. The semiconductor package includes an encapsulation layer that is located over the semiconductor die filling the recess and surrounding side surfaces of the pillars. The package may be formed on a wafer with a plurality of die and may be singulated into a plurality of packages.

Abstract translation: 一个或多个实施例涉及包括柱和凸块结构的半导体封装。 半导体封装包括在半导体管芯的周边具有凹部的管芯。 半导体封装包括封装层，该封装层位于半导体管芯上方，该封装层填充凹槽并且围绕柱的周围侧表面。 封装可以形成在具有多个管芯的晶片上，并且可以被单个化成多个封装。

公开(公告)号：US08860207B2

公开(公告)日：2014-10-14

申请号：US14177146

申请日：2014-02-10

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics Grenoble 2 SAS

Inventor： Yonggang Jin ,  Romain Coffy ,  Jerome Teysseyre

IPC: H01L23/34 ,  H01L21/00 ,  H01R43/16 ,  H01L23/498 ,  H01L23/36 ,  H01L23/31 ,  H01L21/768

CPC classification number: H01L23/498 ,  H01L21/561 ,  H01L21/76283 ,  H01L21/76802 ,  H01L21/76838 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49174 ,  Y10T29/49204 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A fan-out wafer level package is provided with a semiconductor die embedded in a reconstituted wafer. A redistribution layer is positioned over the semiconductor die, and includes a land grid array on a face of the package. A copper heat spreader is formed in the redistribution layer over the die in a same layer as a plurality of electrical traces configured to couple circuit pads of the semiconductor die to respective contact lands of the land grid array. In operation, the heat spreader improves efficiency of heat transfer from the die to the circuit board.

公开(公告)号：US11988743B2

公开(公告)日：2024-05-21

申请号：US18055138

申请日：2022-11-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Jerome Teysseyre

IPC: G01S17/04 ,  G01S7/481 ,  H01L25/16 ,  H01L31/173

CPC classification number: G01S17/04 ,  G01S7/4813 ,  H01L25/167 ,  H01L31/173 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92227 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US10128207B2

公开(公告)日：2018-11-13

申请号：US14674891

申请日：2015-03-31

Applicant: STMicroelectronics Pte Ltd

Inventor： Yun Liu ,  Jerome Teysseyre ,  Yonggang Jin

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/31 ,  H01L21/78

Abstract: One or more embodiments are directed to semiconductor packages that include a pillar and bump structures. The semiconductor packages include a die that has recess at a perimeter of the semiconductor die. The semiconductor package includes an encapsulation layer that is located over the semiconductor die filling the recess and surrounding side surfaces of the pillars. The package may be formed on a wafer with a plurality of die and may be singulated into a plurality of packages.

公开(公告)号：US09851328B2

公开(公告)日：2017-12-26

申请号：US14462432

申请日：2014-08-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Jerome Teysseyre ,  Yonggang Jin ,  Suman Cherian

IPC: G01N27/28 ,  G01N27/403 ,  G01N27/413 ,  G01N27/406 ,  G01N27/407 ,  H05K1/18

CPC classification number: G01N27/4065 ,  G01N27/4062 ,  G01N27/4071 ,  G01N27/4077 ,  H05K1/185 ,  H05K2201/09118 ,  H05K2201/10151

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.