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    Optical sensor module and packaging method thereof
    21.
    发明授权
    Optical sensor module and packaging method thereof 有权

    公开(公告)号：US12013284B2

    公开(公告)日：2024-06-18

    申请号：US18067066

    申请日：2022-12-16

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Yu-Min Lin ,  Feng-Jung Hsu

    IPC: G01J1/02 ,  G01J1/04

    CPC classification number: G01J1/0271 ,  G01J1/0459 ,  G01J2001/0276 ,  G01J1/0474

    Abstract: An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.

    Operation method of proximity sensor
    23.
    发明授权
    Operation method of proximity sensor 有权

    公开(公告)号：US11882637B2

    公开(公告)日：2024-01-23

    申请号：US17587035

    申请日：2022-01-28

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Meng-Yong Lin ,  Ming-Huang Liu ,  Jer-Hau Hsu ,  Cheng-Feng Liu

    IPC: H05B47/11 ,  H05B47/17 ,  H05B47/165 ,  H05B47/155

    CPC classification number: H05B47/11 ,  H05B47/155 ,  H05B47/165 ,  H05B47/17

    Abstract: An operation method of a proximity sensor comprises: controlling a light-emitting element by a processing circuit. Such control includes a plurality of light source on and light source off operations. An optical sensor receives light and outputs a sensing signal corresponding to the intensity of the light. The processing circuit computes the sensing signal to produce a sensing result. The plurality of light source on and light source off operations includes a group having two light sources on operations and two light sources off operations. The two light sources on operations in the group or the two light sources off operations in the group are performed consecutively. In this way, the ambient light components of the light source on and off operations may cancel out each other to reduce the ambient light components contained in the sensing results.

    LIGHT SENSOR AND CONTROL METHOD THEREOF
    24.
    发明公开
    LIGHT SENSOR AND CONTROL METHOD THEREOF 审中-公开

    公开(公告)号：US20240004033A1

    公开(公告)日：2024-01-04

    申请号：US18100734

    申请日：2023-01-24

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Han-Chung Hsu ,  Feng-Jung Hsu

    IPC: G01S7/48 ,  G01S17/08 ,  G01S7/481

    CPC classification number: G01S7/4802 ,  G01S7/4815 ,  G01S17/08

    Abstract: A light sensor and a control method thereof are revealed. The light sensor comprises a first light-emitting element, a second light-emitting element and a light-sensing element. The first light-emitting element is used to generate a first emitting signal. The first emitting signal has an optical wavelength within a first wavelength range. The second light-emitting element is used to generate a second emitting signal. The wavelength of the second emitting signal has an optical wavelength within a second wavelength range. The first wavelength range is different from the second wavelength range. Thereby, a control circuit sequentially controls the first light-emitting element and the second light emitting-element to emit the first emitting signal and the second emitting signal. When the first emitting signal and the second emitting signal are reflected by an object and received by the light-sensing element, the control circuit may determine the type of the object based on the signal sensed by the light-sensing element.

    LIGHT SENSING DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF
    27.
    发明申请
    LIGHT SENSING DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF 有权

    公开(公告)号：US20220140172A1

    公开(公告)日：2022-05-05

    申请号：US17212362

    申请日：2021-03-25

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： WEN-CHIEH TSOU ,  YI-HUA CHANG

    IPC: H01L31/12 ,  H01L27/146 ,  H01L33/62 ,  H01L23/552

    Abstract: A light sensing packaging structure and a packaging method thereof is provided, wherein the light sensing packaging structure comprises a substrate provided with a through-hole between a light-emitting element and a light-sensing element; and a cover body covered the substrate. The cover body comprises a shielding part and an extended part. The shielding part is mounted between the light-emitting element and the light-sensing element, and provided with a metal bonding layer on a surface towards the substrate. The extended part is provided with a metal side wall connected to the metal bonding layer. The through-hole is covered with a conductive glue, and the metal junction contacts the conductive glue. Hereby, the present application may reduce the size of the light sensing device, provide a stable packaging, reduce the packaging cost and improve the reliability of the light sensing product.

    LIGHT SENSOR CIRCUIT
    29.
    发明申请
    LIGHT SENSOR CIRCUIT 有权

    公开(公告)号：US20210250035A1

    公开(公告)日：2021-08-12

    申请号：US17014253

    申请日：2020-09-08

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： JER-HAU HSU ,  MING-HUANG LIU ,  KIAN-FU WONG

    IPC: H03M1/12 ,  G01J1/44

    Abstract: A light sensor circuit, which comprising a photodiode and a voltage follower. By setting the voltage follower to reduce the influence from the junction capacitance of the photodiode, a required time of a repeat integration module will not be influenced by the photodiode to efficiently keep the performance and the accuracy of the analog to digital converting device when the light sensor circuit is used to the analog to digital converting device in repeat operation.

    Manufacturing method of micro-electro-mechanical systems device
    30.
    发明授权
    Manufacturing method of micro-electro-mechanical systems device 有权

    公开(公告)号：US10183856B2

    公开(公告)日：2019-01-22

    申请号：US15871083

    申请日：2018-01-15

    Applicant: SensorTek technology Corp.

    Inventor： Hsin-Hung Huang ,  Wei-Yang Ou

    IPC: B81B3/00 ,  C23C16/02 ,  B81C1/00

    Abstract: A manufacturing method for a Micro-Electro-Mechanical Systems (MEMS) structure includes implementing a surface modification process, to form a transformation layer on the surfaces of the MEMS structure; implementing an anti-stiction coating pre-clean process, to clean the transformation layer on the surfaces towards a particular direction; and implementing an anti-stiction coating process, to coat a monolayer on the surfaces of the MEMS structure.

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