公开(公告)号：US20170227575A1

公开(公告)日：2017-08-10

申请号：US15093765

申请日：2016-04-08

Applicant: SensorTek technology Corp.

Inventor： Hsin-Hung Huang ,  Wei-Yang Ou ,  Hung-Sen Chen

IPC: G01P21/00 ,  G01C25/00 ,  G01C19/5783 ,  G01P15/08 ,  G01P15/125

CPC classification number: G01P21/00 ,  B81C99/0045 ,  G01C19/5783 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0831

Abstract: A method of detecting whether a microelectromechanical system (MEMS) device is hermetic includes applying at least three voltage differences between a movable part and a sensor electrode of the MEMS device to measure at least three effective capacitances, calculating a capacitance-to-voltage curve and an offset voltage of the MEMS device according to the at least three effective capacitances; and determining whether the offset voltage is within a predetermined range to determine whether MEMS device is hermetic.

公开(公告)号：US09915679B2

公开(公告)日：2018-03-13

申请号：US15093765

申请日：2016-04-08

Applicant: SensorTek technology Corp.

Inventor： Hsin-Hung Huang ,  Wei-Yang Ou ,  Hung-Sen Chen

IPC: G01P15/12 ,  B81C99/00 ,  G01P21/00 ,  G01C19/5783 ,  G01C25/00 ,  G01P15/08 ,  G01P15/125

CPC classification number: G01P21/00 ,  B81C99/0045 ,  G01C19/5783 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0831

Abstract: A method of detecting whether a microelectromechanical system (MEMS) device is hermetic includes applying at least three voltage differences between a movable part and a sensor electrode of the MEMS device to measure at least three effective capacitances, calculating a capacitance-to-voltage curve and an offset voltage of the MEMS device according to the at least three effective capacitances; and determining whether the offset voltage is within a predetermined range to determine whether MEMS device is hermetic.

公开(公告)号：US20180201496A1

公开(公告)日：2018-07-19

申请号：US15871083

申请日：2018-01-15

Applicant: SensorTek technology Corp.

Inventor： Hsin-Hung Huang ,  Wei-Yang Ou

IPC: B81B3/00 ,  B81C1/00 ,  C23C16/02

CPC classification number: B81B3/0005 ,  B81C1/00984 ,  B81C2201/112 ,  C23C16/0245

Abstract: A manufacturing method for a Micro-Electro-Mechanical Systems (MEMS) structure includes implementing a surface modification process, to form a transformation layer on the surfaces of the MEMS structure; implementing an anti-stiction coating clean process, to clean the transformation layer on the surfaces towards a particular direction; and implementing an anti-stiction coating process, to coat a monolayer on the surfaces of the MEMS structure.

公开(公告)号：US10183856B2

公开(公告)日：2019-01-22

申请号：US15871083

申请日：2018-01-15

Applicant: SensorTek technology Corp.

Inventor： Hsin-Hung Huang ,  Wei-Yang Ou

IPC: B81B3/00 ,  C23C16/02 ,  B81C1/00

Abstract: A manufacturing method for a Micro-Electro-Mechanical Systems (MEMS) structure includes implementing a surface modification process, to form a transformation layer on the surfaces of the MEMS structure; implementing an anti-stiction coating pre-clean process, to clean the transformation layer on the surfaces towards a particular direction; and implementing an anti-stiction coating process, to coat a monolayer on the surfaces of the MEMS structure.