摘要:
Communication over a computer network with a node having a first port with a point-to-point link connection to a second node having a second port. The first port transmits to the second port a reliable link layer (RLL) packet over the link. The RLL packet comprises a first RLL header and a first data packet, the first RLL header preceding the first data packet, the first RLL header comprising an RLL start-of-frame (SOF) character and an RLL packet sequence number (PSN). If the first port receives an RLL acknowledgment control packet from the link, it acknowledges receipt of the first data packet, and the first port does not retain the first data packet in the buffer. If the first port does not receive the RLL acknowledgment packet from the link, acknowledging receipt of the first data packet, the first port re-transmits from the buffer the first data packet.
摘要:
An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.
摘要:
An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.
摘要:
A program product for a message processing system in which messages are transmitted from source nodes to destination nodes. A transmission flow control technique is disclosed in which the source node optimistically sends control information and a data portion of a message, and wherein a destination node discards the data portion of the message if it is unable to accommodate it. The destination node, however, retains enough of the control information to identify the message to the source node, and when the destination node is subsequently able to accommodate the data portion, the destination node issues a request to the source node to retransmit the data portion of the message. Discarding of one message is followed by discards of sequential messages, until the destination node is able to accommodate the data portions of messages. The flow control technique disclosed herein is used, for example, in an environment where buffers are posted to accommodate messages at the destination node, and is particularly suited for conditions arising in multi-tasking systems where the destination node is generally assumed to be prepared to accommodate data, however, if not prepared, is likely not prepared for long periods of time.
摘要:
A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements.
摘要:
An apparatus and related method is provided for connecting fiber optic cables to devices. In one embodiment, the apparatus comprises an optical fiber connector enabled to receive a cable containing one or a bundle of optical fibers. An actuation sleeve with extendable features is disposed on opposing sides of the connector. The apparatus also includes an actuation sheath engageable with the connector with sleeve(s) and cable(s). The actuation sheath has a plurality of side members connected to one another by a handle area such that the handle area can be used to engage and disengage the actuation sheath with cable and connector as a single unit from the device.
摘要:
A control topology for distributed scheduling has a two-dimensional fanout broadcast network, which may include logical partitioning. Logically, a switch is in the center and line cards are in a two-dimensional grid. There are multiple broadcast networks along rows and columns. Each line card broadcasts to all the other line cards in its row and column. Then, each line card aggregates requests in its row and forwards the aggregated data to all the other line cards in its column.
摘要:
An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.