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24 条记录 (耗时 0.02 秒)

    AUDIO JACK FOR PORTABLE COMPUTING DEVICE
    21.
    发明申请
    AUDIO JACK FOR PORTABLE COMPUTING DEVICE 有权
    用于便携式计算设备的音频插孔

    公开(公告)号：US20130330978A1

    公开(公告)日：2013-12-12

    申请号：US13492694

    申请日：2012-06-08

    申请人： Charles A. SCHWALBACH ,  Brandon S. SMITH

    发明人： Charles A. SCHWALBACH ,  Brandon S. SMITH

    IPC分类号： H01R24/68 ,  B23P17/04

    CPC分类号： G06F1/1688 ,  G06F1/1684 ,  H01R13/22 ,  H01R13/629 ,  H01R24/58 ,  H01R24/68 ,  H05K7/02

    摘要： The present application describes various embodiments regarding an apparatus and method for providing an audio jack for a portable computing device. More specifically a method and apparatus are disclosed for mounting the audio jack to machined audio jack mounts extending from an interior sidewall of the portable computing device housing. The machined mounts allow the audio jack to be suspended above an inner surface of the portable computing device so that the audio jack does not interfere with audio output or aesthetics of a speaker grill drilled into the portable computing device housing.

    摘要翻译： 本申请描述了关于为便携式计算设备提供音频插孔的设备和方法的各种实施例。 更具体地，公开了用于将音频插座安装到从便携式计算设备外壳的内侧壁延伸的加工音频插座安装件的方法和装置。 加工的安装件允许音频插孔悬挂在便携式计算设备的内表面上方，使得音频插孔不干扰钻入便携式计算设备外壳中的扬声器格栅的音频输出或美观。

    FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES
    22.
    发明申请
    FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES 有权
    电子设备中的紧固件和双厚度热阶段

    公开(公告)号：US20130329368A1

    公开(公告)日：2013-12-12

    申请号：US13614996

    申请日：2012-09-13

    申请人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    发明人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/04

    CPC分类号： G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203

    摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

    摘要翻译： 所公开的实施例提供了促进电子设备中的热传递的系统。 该系统包括被配置为将热量从电子设备中的发热部件导出的热管。 该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。 热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。 最后，该系统包括一组紧固件，其被配置为将热平台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。