Abstract:
Some embodiments relate to cutting element assemblies including a superabrasive cutting element that may be axially compressed to enhance the damage tolerance thereof, enclosed in an enclosure that exposes the superabrasive cutting element therethrough, enclosed in an enclosure that restricts rotation of the superabrasive cutting element, or combinations of the foregoing. Additionally, some embodiments relate to cutting element assemblies in which a superabrasive cutting element is mechanically fastened to a base, such as a substrate or directly to a bit body of a rotary drill bit. Some embodiments also relate to cutting element assemblies including one or more superabrasive cutting elements that are rotatable about a longitudinal axis of the cutting element assembly, that may be axially compressed to enhance the damage tolerance thereof, that may be enclosed in an enclosure that exposes the superabrasive cutting element therethrough, or combinations thereof.
Abstract:
The disclosure provides a super abrasive element containing a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores and a contact surface, a base adjacent the contact surface of the TSP body; and an infiltrant material infiltrated in the base and in the pores of the TSP body at the contact surface. The disclosure additionally provides earth-boring drill bits and other devices containing such super abrasive elements. The disclosure further provides methods and mold assemblies for forming such super abrasive elements via infiltration and hot press methods.
Abstract:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
Abstract:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
Abstract:
In an embodiment, a method of characterizing a polycrystalline diamond element is disclosed. The method includes providing the polycrystalline diamond element, and measuring at least one magnetic characteristic of the polycrystalline diamond element.
Abstract:
In an embodiment, a polycrystalline diamond compact (“PDC”) comprises a cemented carbide substrate including a first cemented carbide portion and a second cemented carbide portion bonded to the first cemented carbide portion and exhibiting an erosion resistance that is greater than the first cemented carbide portion. The PDC further comprises a polycrystalline diamond (“PCD”) table bonded to the first cemented carbide portion. The PCD table includes a plurality of bonded diamond grains exhibiting diamond-to-diamond bonding therebetween, with the plurality of bonded diamond grains defining a plurality of interstitial regions.
Abstract:
In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table bonded to the substrate. The table includes bonded diamond grains defining interstitial regions. The table includes an upper surface, a back surface bonded to the substrate, and at least one lateral surface extending therebetween. The table includes a first region extending inwardly from the upper surface and the lateral surface. The first region exhibits a first interstitial region concentration and includes at least one interstitial constituent disposed therein, which may be present in at least a residual amount and includes at least one metal carbonate and/or at least one metal oxide. The table includes a second bonding region adjacent to the substrate that extends inwardly from the back surface. The second bonding region exhibits a second interstitial region concentration that is greater than the first interstitial region concentration and includes a metallic infiltrant therein.
Abstract:
In an embodiment, a method of fabricating a polycrystalline diamond compact (“PDC”) includes forming a polycrystalline diamond (“PCD”) table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature (“HPHT”) process. The PCD table includes bonded diamond grains defining interstitial regions, with the metal-solvent catalyst disposed therein. The method includes at least partially leaching the PCD table to remove at least a portion of the metal-solvent catalyst therefrom. The method includes subjecting the at least partially leached PCD table and a substrate to a second HPHT process under diamond-stable temperature-pressure conditions to partially infiltrate the at least partially leached PCD table with an infiltrant. A maximum temperature (T), a total process time (t), and a maximum pressure (P) of the second HPHT process are chosen so that β is about 2° Celsius·hours/gigapascals (“° C.·h/GPa”) to about 325° C.·h/GPa, with β represented as β=T·t/P.
Abstract:
In an embodiment, a polycrystalline diamond compact (“PDC”) comprises a cemented carbide substrate including a first cemented carbide portion and a second cemented carbide portion bonded to the first cemented carbide portion and exhibiting an erosion resistance that is greater than the first cemented carbide portion. The PDC further comprises a polycrystalline diamond (“PCD”) table bonded to the first cemented carbide portion. The PCD table includes a plurality of bonded diamond grains exhibiting diamond-to-diamond bonding therebetween, with the plurality of bonded diamond grains defining a plurality of interstitial regions.
Abstract:
Embodiments of the invention relate to polycrystalline diamond (“PCD”) exhibiting enhanced diamond-to-diamond bonding. In an embodiment, PCD includes a plurality of diamond grains defining a plurality of interstitial regions. A metal-solvent catalyst occupies at least a portion of the plurality of interstitial regions. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oersteads or more and a specific magnetic saturation of about 15 Gauss·cm3/grams or less. Other embodiments are directed to polycrystalline diamond compacts (“PDCs”) employing such PCD, methods of forming PCD and PDCs, and various applications for such PCD and PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.