Non-volatile memory device and method of fabricating the same
    21.
    发明授权
    Non-volatile memory device and method of fabricating the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US07473961B2

    公开(公告)日:2009-01-06

    申请号:US11183614

    申请日:2005-07-18

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: A non-volatile memory device having improved electrical characteristics and a method of fabricating the non-volatile memory device are provided. The non-volatile memory device includes a gate electrode, which is formed on a semiconductor substrate on which source and drain regions are formed, a trapping structure, which is interposed between the semiconductor substrate and the gate electrode and comprises an electron tunneling layer and a charge trapping layer, and an electron back-tunneling prevention layer, which is interposed between the gate electrode and the charge trapping layer, prevents electrons in the gate electrode from back-tunneling through the charge trapping layer, and is formed of a metal having a higher work function than the gate electrode.

    Abstract translation: 提供了具有改善的电特性的非易失性存储器件以及制造该非易失性存储器件的方法。 非易失性存储器件包括形成在其上形成有源极和漏极区域的半导体衬底上的栅电极,该栅极电极介于半导体衬底和栅电极之间,并且包括电子隧穿层和 电荷捕获层和插入在栅电极和电荷捕获层之间的电子反向穿隧防止层防止栅电极中的电子通过电荷捕获层反向隧穿,并且由具有 工作功能比栅电极高。

    Non-volatile memory device with buried control gate and method of fabricating the same
    22.
    发明授权
    Non-volatile memory device with buried control gate and method of fabricating the same 失效
    具有埋地控制栅极的非易失性存储器件及其制造方法

    公开(公告)号:US07420243B2

    公开(公告)日:2008-09-02

    申请号:US11248691

    申请日:2005-10-12

    CPC classification number: H01L29/42352 H01L21/28282 H01L29/7923 Y10S438/954

    Abstract: In a non-volatile memory device with a buried control gate, the effective channel length of the control gate is increased to restrain punchthrough, and a region for storing charge is increased for attaining favorably large capacity. A method of fabricating the memory device includes forming the control gate within a trench formed in a semiconductor substrate, and forming charge storing regions in the semiconductor substrate on both sides of the control gate in a self-aligning manner, thereby allowing for multi-level cell operation.

    Abstract translation: 在具有埋地控制栅极的非易失性存储器件中,增加控制栅极的有效沟道长度以限制穿通,并且增加用于存储电荷的区域以获得有利的大容量。 一种制造存储器件的方法包括:在形成于半导体衬底中的沟槽内形成控制栅极,并以自对准的方式在控制栅极两侧的半导体衬底中形成电荷存储区域,从而允许多级 电池操作。

    Method of fabricating non-volatile flash memory device having at least two different channel concentrations
    23.
    发明申请
    Method of fabricating non-volatile flash memory device having at least two different channel concentrations 失效
    制造具有至少两个不同通道浓度的非易失性闪速存储器件的方法

    公开(公告)号:US20080108197A1

    公开(公告)日:2008-05-08

    申请号:US12007097

    申请日:2008-01-07

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.

    Abstract translation: 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。

    Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same
    24.
    发明授权
    Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same 失效
    具有至少两种不同通道浓度的非挥发性闪存器件及其制造方法

    公开(公告)号:US07320920B2

    公开(公告)日:2008-01-22

    申请号:US11097281

    申请日:2005-04-04

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.

    Abstract translation: 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。

    Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same
    25.
    发明申请
    Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same 失效
    具有浮动阱型非易失性存储单元的半导体器件及其制造方法

    公开(公告)号:US20060208303A1

    公开(公告)日:2006-09-21

    申请号:US11378505

    申请日:2006-03-17

    Abstract: The present invention discloses a semiconductor device having a floating trap type nonvolatile memory cell and a method for manufacturing the same. The method includes providing a semiconductor substrate having a nonvolatile memory region, a first region, and a second region. A triple layer composed of a tunnel oxide layer, a charge storing layer and a first deposited oxide layer on the semiconductor substrate is formed sequentially. The triple layer on the semiconductor substrate except the nonvolatile memory region is then removed. A second deposited oxide layer is formed on an entire surface of the semiconductor substrate including the first and second regions from which the triple layer is removed. The second deposited oxide layer on the second region is removed, and a first thermal oxide layer is formed on the entire surface of the semiconductor substrate including the second region from which the second deposited oxide layer is removed. The semiconductor device can be manufactured according to the present invention to have a reduced processing time and a reduced change of impurity doping profile. The thickness of a blocking oxide layer and a high voltage gate oxide layer can be controlled.

    Abstract translation: 本发明公开了一种具有浮动阱式非易失性存储单元的半导体器件及其制造方法。 该方法包括提供具有非易失性存储区域,第一区域和第二区域的半导体衬底。 顺序地形成由半导体衬底上的隧道氧化物层,电荷存储层和第一沉积氧化物层组成的三层。 然后除去非易失性存储区域之外的半导体衬底上的三层。 第二沉积氧化物层形成在半导体衬底的包括去除三层的第一和第二区域的整个表面上。 去除第二区域上的第二沉积氧化物层,并且在包括除去第二沉积氧化物层的第二区域的半导体衬底的整个表面上形成第一热氧化物层。 可以根据本发明制造半导体器件以减少处理时间和降低杂质掺杂分布的变化。 可以控制阻挡氧化物层和高电压栅极氧化物层的厚度。

    Local SONOS-type structure having two-piece gate and self-aligned ONO and method for manufacturing the same
    26.
    发明授权
    Local SONOS-type structure having two-piece gate and self-aligned ONO and method for manufacturing the same 失效
    具有两片门和自对准ONO的本地SONOS型结构及其制造方法

    公开(公告)号:US07060563B2

    公开(公告)日:2006-06-13

    申请号:US10953553

    申请日:2004-09-30

    CPC classification number: H01L29/792 H01L29/7923 Y10S438/954

    Abstract: A local SONOS structure having a two-piece gate and a self-aligned ONO structure includes: a substrate; an ONO structure on the substrate; a first gate layer on and aligned with the ONO structure; a gate insulator on the substrate aside the ONO structure; and a second gate layer on the first gate layer and on the gate insulator. The first and second gate layers are electrically connected together. Together, the ONO structure and first and second gate layers define at least a 1-bit local SONOS structure. A corresponding method of manufacture includes: providing a substrate; forming an ONO structure on the substrate; forming a first gate layer on and aligned with the ONO structure; forming a gate insulator on the substrate aside the ONO structure; forming a second gate layer on the first gate layer and on the gate insulator; and electrically connecting the first and second gate layers.

    Abstract translation: 具有两件式门和自对准ONO结构的本地SONOS结构包括:衬底; 基底上的ONO结构; 在ONO结构上并与ONO结构对准的第一栅极层; 衬底上的栅极绝缘体旁边的ONO结构; 以及在第一栅极层上和栅极绝缘体上的第二栅极层。 第一和第二栅极层电连接在一起。 ONO结构和第一和第二栅极层一起定义至少1位本地SONOS结构。 相应的制造方法包括:提供衬底; 在基板上形成ONO结构; 在ONO结构上形成第一栅极层并与其结合; 在衬底上形成栅极绝缘体,除了ONO结构; 在第一栅极层和栅极绝缘体上形成第二栅极层; 并且电连接第一和第二栅极层。

    Non-volatile memory device and method of fabricating the same

    公开(公告)号:US20060027854A1

    公开(公告)日:2006-02-09

    申请号:US11200491

    申请日:2005-08-09

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: A non-volatile memory device having an asymmetric channel structure is provided. The non-volatile memory device includes a semiconductor substrate, a source region and a drain region which are formed in the semiconductor substrate and doped with n-type impurities, a trapping structure which includes a tunneling layer, which is disposed on a predetermined region of the semiconductor substrate and through which charge carriers are tunneled, and a charge trapping layer, which is formed on the tunneling layer and traps the tunneled charge carriers, a gate insulating layer which is formed on the trapping structure and the exposed semiconductor substrate, a gate electrode which is formed on the gate insulating layer, and a channel region which is formed between the source region and the drain region and includes a first channel region formed on a lower part of the trapping structure and a second channel region formed on a lower part of the gate insulating layer, the threshold voltage of the first channel region being lower than that of the second channel region.

    Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same
    29.
    发明申请
    Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same 失效
    具有至少两种不同通道浓度的非挥发性闪存器件及其制造方法

    公开(公告)号:US20060011965A1

    公开(公告)日:2006-01-19

    申请号:US11097281

    申请日:2005-04-04

    CPC classification number: H01L29/66833 H01L21/28282 H01L29/792

    Abstract: In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.

    Abstract translation: 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。

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