Radio frequency IC tag
    21.
    发明授权
    Radio frequency IC tag 失效
    射频IC标签

    公开(公告)号:US08231059B2

    公开(公告)日:2012-07-31

    申请号:US12575932

    申请日:2009-10-08

    申请人: Isao Sakama

    发明人: Isao Sakama

    摘要: A micro-strip antenna includes two conductors. One of the conductors is a radiation electrode including a first radiation electrode including an IC chip and a slit and a U-shaped second radiation electrode. The antenna further includes an opening and a cutout formed by the first and second radiation electrodes and a radiation electrode.

    摘要翻译: 微带天线包括两根导线。 其中一个导体是包括包括IC芯片和狭缝的第一辐射电极和U形第二辐射电极的辐射电极。 天线还包括由第一和第二辐射电极和辐射电极形成的开口和切口。

    IC tag and inlet for IC tag
    22.
    发明授权
    IC tag and inlet for IC tag 有权
    IC标签和IC标签入口

    公开(公告)号:US07954722B2

    公开(公告)日:2011-06-07

    申请号:US11740446

    申请日:2007-04-26

    申请人: Isao Sakama

    发明人: Isao Sakama

    IPC分类号: G06K19/06

    摘要: An IC tag mounting at least two IC chips operating in different frequency bands. The IC tag having a first inlet including a first antenna having a relatively long operation wavelength and a first IC chip mounted on the first antenna, and a second inlet including a second antenna having an operation wavelength shorter than the first antenna and disposed crossing at a predetermined angle over a line of the first antenna without positioning both opposite ends of the second antenna upon the first antenna and a second IC chip mounted on the second antenna. The second antenna has a matching circuit for impedance matching between the second antenna and the second IC chip. The matching circuit is a slit formed in the second antenna and positioned upon terminals of the second IC chip. Thus, the second antenna is made compact using the first antenna as an auxiliary antenna.

    摘要翻译: 安装至少两个在不同频带工作的IC芯片的IC标签。 所述IC标签具有第一入口,所述第一入口包括具有相对长的工作波长的第一天线和安装在所述第一天线上的第一IC芯片,以及第二入口,所述第二入口包括具有比所述第一天线短的工作波长的第二天线, 在第一天线的一条线上的预定角度,而不在第一天线上定位第二天线的两个相对端,以及安装在第二天线上的第二IC芯片。 第二天线具有用于第二天线和第二IC芯片之间的阻抗匹配的匹配电路。 匹配电路是形成在第二天线中并位于第二IC芯片的端子上的狭缝。 因此,使用第一天线作为辅助天线使第二天线紧凑。

    ASSEMBLING STRUCTURE OF RADIO IC TAG
    23.
    发明申请
    ASSEMBLING STRUCTURE OF RADIO IC TAG 审中-公开
    组装无线IC标签的结构

    公开(公告)号:US20100123010A1

    公开(公告)日:2010-05-20

    申请号:US12608194

    申请日:2009-10-29

    申请人: Isao SAKAMA

    发明人: Isao SAKAMA

    IPC分类号: G06K19/07

    摘要: In an assembling structure of a radio IC tag, the radio IC tag includes an IC chip for recording information therein and a first antenna connected to the IC chip for wirelessly transmitting or receiving information. The first antenna has a first gap for performing impedance matching. A conductive second antenna having a second gap is arranged over the IC chip, the first gap, and the first antenna.

    摘要翻译: 在无线电IC标签的组装结构中,无线IC标签包括用于在其中记录信息的IC芯片和连接到用于无线发送或接收信息的IC芯片的第一天线。 第一天线具有用于执行阻抗匹配的第一间隙。 具有第二间隙的导电第二天线布置在IC芯片,第一间隙和第一天线上。

    IC tag and method for fabricating the same
    24.
    发明授权
    IC tag and method for fabricating the same 有权
    IC标签及其制造方法

    公开(公告)号:US07701350B2

    公开(公告)日:2010-04-20

    申请号:US11741012

    申请日:2007-04-27

    IPC分类号: G08B13/14

    摘要: The RFID tag is composed of the first antenna of metal film layer on which the IC chip is mounted and at least one second antenna of metal film layer on which the IC chip is not mounted The metal film layer is formed on the base, and the metal film layer is formed on the base. The metal film layer partially overlaps the metal film layer with the base interposed between them, so that the first antenna and the second antenna are capacitively coupled to each other.

    摘要翻译: RFID标签由安装有IC芯片的金属膜层的第一天线和未安装IC芯片的金属膜层的至少一个第二天线组成。金属膜层形成在基底上, 金属膜层形成在基底上。 金属膜层与介于它们之间的基底部分地重叠金属膜层,使得第一天线和第二天线彼此电容耦合。

    RFID THREAD, SHEET WITH RFID THREAD, AND PRINTING MACHINE FOR SHEET WITH RFID THREAD
    25.
    发明申请
    RFID THREAD, SHEET WITH RFID THREAD, AND PRINTING MACHINE FOR SHEET WITH RFID THREAD 失效
    RFID螺纹,带RFID螺纹的片材,以及带有RFID螺纹的印刷机

    公开(公告)号:US20090303010A1

    公开(公告)日:2009-12-10

    申请号:US12392158

    申请日:2009-02-25

    申请人: Isao SAKAMA

    发明人: Isao SAKAMA

    IPC分类号: G06K7/00

    CPC分类号: G06K19/07749

    摘要: An RFID thread which is mounted on a sheet and whose predetermined information can be read wirelessly from outside, the TFID thread includes: an IC chip recording the predetermined information; a first antenna consisting of an electrically continuous conductor which has a length corresponding to a size of the sheet and on which one or a plurality of the IC chips are mounted; and a base film made of resin for supporting the first antenna.

    摘要翻译: TFID线程安装在片材上并且可以从外部无线地读取预定信息的RFID线程包括:记录预定信息的IC芯片; 由电连续导体组成的第一天线,其长度对应于片材的尺寸,并且其上安装有一个或多个IC芯片; 以及由用于支撑第一天线的树脂制成的基膜。

    Radio frequency identification tag and manufacturing method thereof
    26.
    发明授权
    Radio frequency identification tag and manufacturing method thereof 失效
    射频识别标签及其制造方法

    公开(公告)号:US07592914B2

    公开(公告)日:2009-09-22

    申请号:US11324358

    申请日:2006-01-04

    IPC分类号: G08B13/14

    摘要: A tablet PTP package contains a multiplicity of tablets by a resin PVC and a metal sheet such as an aluminum sheet. An elongate space pattern is formed in a part of the aluminum sheet on the lower surface of the package to form an island area constituting an antenna. A small radio IC inlet including an IC chip mounted on a small antenna is arranged on the reverse surface (upper surface of the package) of the portion of the aluminum sheet corresponding to the island area. The small radio IC inlet and the second antenna formed by the island area are electrostatically coupled to each other with the resin PVC as a dielectric member, and thus a RFID (radio frequency identification) tag is configured.

    摘要翻译: 片剂PTP包装通过树脂PVC和金属片如铝片包含许多片剂。 在包装的下表面上的铝片的一部分中形成细长的空间图案,以形成构成天线的岛状区域。 包括安装在小天线上的IC芯片的小型无线IC入口布置在对应于岛区的铝片部分的背面(封装的上表面)上。 由岛状区域形成的小无线电IC入口和第二天线通过树脂PVC作为电介质构件彼此静电耦合,从而配置RFID(射频识别)标签。

    IC tag-bearing wiring board and method of fabricating the same
    27.
    发明授权
    IC tag-bearing wiring board and method of fabricating the same 失效
    IC标签承载线路板及其制造方法

    公开(公告)号:US07586446B2

    公开(公告)日:2009-09-08

    申请号:US11061149

    申请日:2005-02-18

    IPC分类号: H01Q1/24

    摘要: To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. An IC chip is placed in the recess so that the IC chip does not protrude from the front side surface, a first major surface 1a and a second major surface of the printed wiring board. Antenna elements of an antenna are formed on the front side surface on the opposite sides, respectively, of the IC chip, and the antenna is connected to the IC chip. The antenna is a dipole antenna of a length equal to half the wavelength of radio waves to be radiated by the antenna.

    摘要翻译: 为了在不牺牲无线IC标签的传输距离的情况下提高电子部件封装效率,在印刷电路板的正面侧形成有凹部。 将IC芯片放置在凹部中,使得IC芯片不从印刷线路板的前侧表面,第一主表面1a和第二主表面突出。 天线的天线元件分别形成在IC芯片的相对侧的前侧表面上,并且天线连接到IC芯片。 天线是长度等于由天线辐射的无线电波的波长的一半的偶极子天线。

    SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
    28.
    发明申请
    SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME 失效
    半导体装置及其制造方法

    公开(公告)号:US20090159881A1

    公开(公告)日:2009-06-25

    申请号:US12187601

    申请日:2008-08-07

    IPC分类号: H01L23/544 H01L21/26

    CPC分类号: H01L22/34 H01L2924/3011

    摘要: The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip 10 within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip 10 which is fabricated on the wafer by the mask shift method and mask combination method.

    摘要翻译: 本发明是一种制造半导体装置的方法,该半导体装置包括大量制造在晶片上并具有多个信息块的芯片。 在该方法中,通过固定图案方式,在作为晶片的分割区域的镜头内的每个芯片10的芯片鉴别块中写入唯一的信息位。 此外,通过掩模移位方法写入唯一给予晶片内的每个镜头的信息位。 此外,通过掩模移位方法和掩模组合方法,在晶片上制造的芯片10的晶片鉴别块中写入唯一给每个晶片的信息位。

    Antenna apparatus
    29.
    发明授权
    Antenna apparatus 失效
    天线装置

    公开(公告)号:US07535364B2

    公开(公告)日:2009-05-19

    申请号:US11299671

    申请日:2005-12-13

    IPC分类号: G08B13/14

    摘要: An antenna apparatus which ensures a wide reading area on a reader antenna and a reading operability of information recorded in a small-sized radio frequency IC tag is provided. The apparatus includes an auxiliary antenna of λ/2 long disposed near to a radiating antenna of λ/2 long and including plural conductive elements in an array. When the IC tag approaches the auxiliary antenna, a subsidiary tuning circuit is formed between it and an inlet antenna of IC tag, so making tuning complementary to each other. The inlet antenna having an antenna length shorter than the tuning frequency can receive energy from the auxiliary antenna efficiently and is excited integrally with the auxiliary antenna to thereby spread a reading area by apparatus and increase the communication distance.

    摘要翻译: 提供了一种确保读取器天线上的宽读取区域和记录在小型射频IC标签中的信息的读取可操作性的天线装置。 该装置包括λ/ 2长的辅助天线,其设置在λ/ 2长的辐射天线附近并且包括阵列中的多个导电元件。 当IC标签接近辅助天线时,在其与IC标签的入口天线之间形成辅助调谐电路,使得调谐互补。 具有比调谐频率短的天线长度的入口天线可以有效地从辅助天线接收能量,并且与辅助天线一体地激励,从而通过设备扩展读取区域并增加通信距离。

    Radio frequency integrated circuit tag and method of using the RFIC tag
    30.
    发明授权
    Radio frequency integrated circuit tag and method of using the RFIC tag 失效
    射频集成电路标签和使用RFIC标签的方法

    公开(公告)号:US07508347B2

    公开(公告)日:2009-03-24

    申请号:US11741003

    申请日:2007-04-27

    IPC分类号: H01Q1/38

    摘要: An RFIC tag includes an IC chip and a thin metal plate. The IC chip is mounted approximately in the center of a slit part on the thin metal plate. The thin metal plate has connecting parts at both longitudinal-direction ends fixed on a metal member by soldering, and the undersurface of the slit part, which has an L-shaped slit thereon, is lifted a predetermined height from the surface of the metal member. The total length (L2+L1+L2) is ¼ or shorter than the communication wavelength λ.

    摘要翻译: RFIC标签包括IC芯片和薄金属板。 IC芯片大致安装在薄金属板上的狭缝部分的中心。 薄金属板通过焊接在两个长度方向的端部具有固定在金属构件上的连接部,并且在其上具有L形狭缝的狭缝部的下表面从金属构件的表面提升预定的高度 。 总长度(L2 + L1 + L2)为通信波长λ的1/4或更短。