公开(公告)号：US06750551B1

公开(公告)日：2004-06-15

申请号：US09473305

申请日：1999-12-28

Applicant: Kristopher Frutschy ,  Charles A. Gealer ,  Carlos A. Gonzalez

Inventor： Kristopher Frutschy ,  Charles A. Gealer ,  Carlos A. Gonzalez

IPC: H01L2348

CPC classification number: F16L41/08 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A surface mount-type microelectronic component assembly which does not physically attach the microelectronic component to its carrier substrate. Electrical contact is achieved between the microelectronic component and the carrier with solder balls attached to either the microelectronic component or the carrier substrate. A force is exerted on the assembly to achieve sufficient electrical contact between the microelectronic component and the carrier substrate.

Abstract translation: 表面安装型微电子部件组件，其不将微电子部件物理地附接到其载体基板。 在微电子部件和载体之间实现电接触，焊球与微电子部件或载体基板连接。 在组件上施加力以在微电子部件和载体基板之间实现足够的电接触。

公开(公告)号：US06586684B2

公开(公告)日：2003-07-01

申请号：US09896409

申请日：2001-06-29

Applicant: Kristopher Frutschy ,  Glenn E. Stewart ,  Farzaneh Yahyaei-Moayyed ,  Geoffery L. Reid

Inventor： Kristopher Frutschy ,  Glenn E. Stewart ,  Farzaneh Yahyaei-Moayyed ,  Geoffery L. Reid

IPC: H05K116

CPC classification number: H05K1/0263 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y10T29/4913

Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

Abstract translation: 电子组件包括用于向集成电路（IC）封装（308）提供电流的一个或多个导电钳位件（302,304，图3）。 导电夹具连接到印刷电路板（PC）（312），该印刷电路板（312）通过一个夹具将电流提供给IC封装，并且通过另一个夹具接收来自IC封装的返回电流。 每个夹具接触PC板表面上的接触焊盘（330），并接触IC封装顶表面上的另一接触焊盘（334）。 封装内的通孔（338,339）和导电平面（340,342）然后将电流传送到连接到封装的IC（例如，IC 306）。 在另一个实施例中，夹具（904，图9）将导电结构（902）保持在PC板接触焊盘（908）和IC封装接触焊盘（914）之间的适当位置，电流主要承载在导电结构 ，而不是超过钳位。