公开(公告)号：US07060563B2

公开(公告)日：2006-06-13

申请号：US10953553

申请日：2004-09-30

Applicant: Geum-Jong Bae ,  Nae-In Lee ,  Sang Su Kim ,  Ki Chul Kim ,  Jin-Hee Kim ,  In-Wook Cho ,  Sung-Ho Kim ,  Kwang-Wook Koh

Inventor： Geum-Jong Bae ,  Nae-In Lee ,  Sang Su Kim ,  Ki Chul Kim ,  Jin-Hee Kim ,  In-Wook Cho ,  Sung-Ho Kim ,  Kwang-Wook Koh

IPC: H01L21/8247

CPC classification number: H01L29/792 ,  H01L29/7923 ,  Y10S438/954

Abstract: A local SONOS structure having a two-piece gate and a self-aligned ONO structure includes: a substrate; an ONO structure on the substrate; a first gate layer on and aligned with the ONO structure; a gate insulator on the substrate aside the ONO structure; and a second gate layer on the first gate layer and on the gate insulator. The first and second gate layers are electrically connected together. Together, the ONO structure and first and second gate layers define at least a 1-bit local SONOS structure. A corresponding method of manufacture includes: providing a substrate; forming an ONO structure on the substrate; forming a first gate layer on and aligned with the ONO structure; forming a gate insulator on the substrate aside the ONO structure; forming a second gate layer on the first gate layer and on the gate insulator; and electrically connecting the first and second gate layers.

Abstract translation: 具有两件式门和自对准ONO结构的本地SONOS结构包括：衬底; 基底上的ONO结构; 在ONO结构上并与ONO结构对准的第一栅极层; 衬底上的栅极绝缘体旁边的ONO结构; 以及在第一栅极层上和栅极绝缘体上的第二栅极层。 第一和第二栅极层电连接在一起。 ONO结构和第一和第二栅极层一起定义至少1位本地SONOS结构。 相应的制造方法包括：提供衬底; 在基板上形成ONO结构; 在ONO结构上形成第一栅极层并与其结合; 在衬底上形成栅极绝缘体，除了ONO结构; 在第一栅极层和栅极绝缘体上形成第二栅极层; 并且电连接第一和第二栅极层。

公开(公告)号：US20060054965A1

公开(公告)日：2006-03-16

申请号：US11269624

申请日：2005-11-09

Applicant: Sung-ho Kim ,  Nae-in Lee ,  Kwang-wook Koh ,  Geum-jong Bae ,  Ki-chul Kim ,  Jin-hee Kim ,  In-wook Cho ,  Sang-su Kim

Inventor： Sung-ho Kim ,  Nae-in Lee ,  Kwang-wook Koh ,  Geum-jong Bae ,  Ki-chul Kim ,  Jin-hee Kim ,  In-wook Cho ,  Sang-su Kim

IPC: H01L29/788

CPC classification number: H01L27/11568 ,  G11C16/0416 ,  G11C16/0466 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/0207 ,  H01L27/115 ,  H01L27/11519 ,  H01L27/11521 ,  H01L27/11524 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/792

Abstract: Byte-operational nonvolatile semiconductor memory devices are capable of erasing stored data one byte at a time. A byte memory cell may include a memory cell array of 1-byte memory transistors. The 1-byte memory transistors may be arranged in one direction, each including a junction region and a channel region formed in an active region. A byte memory cell may include a byte select transistor. The select transistor may be disposed in the active region and including a junction region that is directly adjacent to a junction of each of the 1-byte memory transistors. The byte select transistor may be disposed over or under the 1-byte memory transistors perpendicular to the arranged direction of the 1-byte memory transistors.

公开(公告)号：US07495281B2

公开(公告)日：2009-02-24

申请号：US11488983

申请日：2006-07-19

Applicant: Seung-Jin Yang ,  Jeong-Uk Han ,  Kwang-Wook Koh ,  Jae-Hwang Kim ,  Sung-Chul Park ,  Ju-Ri Kim

Inventor： Seung-Jin Yang ,  Jeong-Uk Han ,  Kwang-Wook Koh ,  Jae-Hwang Kim ,  Sung-Chul Park ,  Ju-Ri Kim

IPC: H01L29/788

CPC classification number: H01L29/42328 ,  G11C16/0425 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/7883

Abstract: In a non-volatile memory device and methods of forming and operating the same, one memory transistor includes sidewall selection gates covering both sidewalls of a floating gate when the floating gate and a control gate are stacked. The sidewall selection gates are in a spacer form. Since the sidewall selection gates are in a spacer form on the sidewall of the floating gate, the degree of integration of cells can be improved. Additionally, since the side wall selection gates are disposed on both sidewalls of the floating gate, a voltage applied from a bit line and a common source line can be controlled and thus conventional writing/erasing errors can be prevented. Therefore, distribution of threshold voltage can be improved.

Abstract translation: 在非易失性存储器件及其形成和操作它的方法中，当浮置栅极和控制栅极堆叠时，一个存储器晶体管包括覆盖浮置栅极的两个侧壁的侧壁选择栅极。 侧壁选择门是间隔件形式。 由于侧壁选择栅极在浮动栅极的侧壁上是间隔物形式，所以可以提高电池的集成度。 此外，由于侧壁选择栅极设置在浮置栅极的两个侧壁上，所以可以控制从位线和公共源极线施加的电压，因此可以防止常规的写入/擦除错误。 因此，可以提高阈值电压的分布。

公开(公告)号：US20080315289A1

公开(公告)日：2008-12-25

申请号：US12199307

申请日：2008-08-27

Applicant: JAE HWANG KIM ,  SEUNG-BEOM YOON ,  KWANG-WOOK KOH ,  CHANG-HUN LEE ,  SUNG-HO KIM ,  SUNG-CHUL PARK ,  JU-RI KIM

Inventor： JAE HWANG KIM ,  SEUNG-BEOM YOON ,  KWANG-WOOK KOH ,  CHANG-HUN LEE ,  SUNG-HO KIM ,  SUNG-CHUL PARK ,  JU-RI KIM

IPC: H01L29/00

CPC classification number: H01L27/11521 ,  H01L27/115

Abstract: An EEPROM device includes a device isolation layer disposed at a predetermined region of a semiconductor substrate to define active regions, a pair of control gates crossing the device isolation layers and an active region, a pair of selection gates interposed between the control gates to cross the device isolation layers and the active region and a floating gate and an intergate dielectric pattern stacked sequentially between the control gates and the active region The EEPROM device further includes a gate insulation layer of a memory transistor interposed between the floating gate and the active region and a tunnel insulation layer thinner than the gate insulation layer of the memory transistor and a gate insulation layer of a selection transistor interposed between the selection gates and the active region. The tunnel insulation layer is aligned at one side adjacent to the floating gate.

Abstract translation: EEPROM器件包括设置在半导体衬底的预定区域以限定有源区的器件隔离层，与器件隔离层交叉的一对控制栅极和有源区，插入控制栅极之间的一对选择栅极， 器件隔离层和有源区以及顺序地堆叠在控制栅极和有源区之间的浮置栅极和隔间栅极电介质图案。EEPROM器件还包括插入浮置栅极和有源区域之间的存储晶体管的栅极绝缘层，以及 隧道绝缘层比存储晶体管的栅极绝缘层薄，并且选择晶体管的栅极绝缘层插入在选择栅极和有源区之间。 隧道绝缘层在与浮动栅极相邻的一侧对准。

公开(公告)号：US20060079045A1

公开(公告)日：2006-04-13

申请号：US11242209

申请日：2005-10-03

Applicant: Jae-Hwang Kim ,  Seung-Beom Yoon ,  Kwang-Wook Koh ,  Chang-Hun Lee ,  Sung-Ho Kim ,  Sung-Chul Park ,  Ju-Ri Kim

Inventor： Jae-Hwang Kim ,  Seung-Beom Yoon ,  Kwang-Wook Koh ,  Chang-Hun Lee ,  Sung-Ho Kim ,  Sung-Chul Park ,  Ju-Ri Kim

IPC: H01L21/8234 ,  H01L21/336

CPC classification number: H01L27/11521 ,  H01L27/115

Abstract: An EEPROM device includes a device isolation layer disposed at a predetermined region of a semiconductor substrate to define active regions, a pair of control gates crossing the device isolation layers and an active region, a pair of selection gates interposed between the control gates to cross the device isolation layers and the active region and a floating gate and an intergate dielectric pattern stacked sequentially between the control gates and the active region The EEPROM device further includes a gate insulation layer of a memory transistor interposed between the floating gate and the active region and a tunnel insulation layer thinner than the gate insulation layer of the memory transistor and a gate insulation layer of a selection transistor interposed between the selection gates and the active region. The tunnel insulation layer is aligned at one side adjacent to the floating gate.

公开(公告)号：US06998309B2

公开(公告)日：2006-02-14

申请号：US10786239

申请日：2004-02-24

Applicant: In-Wook Cho ,  Nae-In Lee ,  Kwang-Wook Koh ,  Geum-Jong Bae ,  Sang-Su Kim ,  Jin-Hee Kim ,  Sung-Ho Kim ,  Ki-Chul Kim

Inventor： In-Wook Cho ,  Nae-In Lee ,  Kwang-Wook Koh ,  Geum-Jong Bae ,  Sang-Su Kim ,  Jin-Hee Kim ,  Sung-Ho Kim ,  Ki-Chul Kim

IPC: H01L21/336

CPC classification number: H01L27/115 ,  H01L27/11568 ,  Y10S438/954

Abstract: A method of manufacturing a non-volatile semiconductor memory device begins by forming a dielectric layer pattern having an ONO composition on a substrate. A polysilicon layer is formed on the substrate including over the dielectric layer pattern. The polysilicon layer is patterned to form a split polysilicon layer pattern that exposes part of the dielectric layer pattern. The exposed dielectric layer is etched, and then impurities are implanted into portions of the substrate using the split polysilicon layer pattern as a mask to thereby form a source region having a vertical profile in the substrate.

Abstract translation: 制造非易失性半导体存储器件的方法是通过在衬底上形成具有ONO组成的电介质层图案而开始的。 在包括在电介质层图案上的衬底上形成多晶硅层。 图案化多晶硅层以形成暴露部分介电层图案的分裂多晶硅层图案。 暴露的电介质层被蚀刻，然后使用分离多晶硅层图案作为掩模将杂质注入到衬底的部分中，从而在衬底中形成具有垂直轮廓的源区。

公开(公告)号：US20050023604A1

公开(公告)日：2005-02-03

申请号：US10844783

申请日：2004-05-13

Applicant: Sang-Su Kim ,  Kwang-Wook Koh ,  Geum-Jong Bae ,  Ki-Chul Kim ,  Sung-Ho Kim ,  Jin-Hee Kim ,  In-Wook Cho

Inventor： Sang-Su Kim ,  Kwang-Wook Koh ,  Geum-Jong Bae ,  Ki-Chul Kim ,  Sung-Ho Kim ,  Jin-Hee Kim ,  In-Wook Cho

IPC: H01L21/8234 ,  H01L21/8246 ,  H01L21/8247 ,  H01L27/105 ,  H01L27/115 ,  H01L21/336 ,  H01L21/8238 ,  H01L29/76 ,  H01L29/788

CPC classification number: H01L27/11568 ,  H01L21/823462 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11526 ,  H01L27/11546

Abstract: The present invention discloses a semiconductor device having a floating trap type nonvolatile memory cell and a method for manufacturing the same. The method includes providing a semiconductor substrate having a nonvolatile memory region, a first region, and a second region. A triple layer composed of a tunnel oxide layer, a charge storing layer and a first deposited oxide layer on the semiconductor substrate is formed sequentially. The triple layer on the semiconductor substrate except the nonvolatile memory region is then removed. A second deposited oxide layer is formed on an entire surface of the semiconductor substrate including the first and second regions from which the triple layer is removed. The second deposited oxide layer on the second region is removed, and a first thermal oxide layer is formed on the entire surface of the semiconductor substrate including the second region from which the second deposited oxide layer is removed. The semiconductor device can be manufactured according to the present invention to have a reduced processing time and a reduced change of impurity doping profile. The thickness of a blocking oxide layer and a high voltage gate oxide layer can be controlled.

Abstract translation: 本发明公开了一种具有浮动阱式非易失性存储单元的半导体器件及其制造方法。 该方法包括提供具有非易失性存储区域，第一区域和第二区域的半导体衬底。 顺序地形成由半导体衬底上的隧道氧化物层，电荷存储层和第一沉积氧化物层组成的三层。 然后除去非易失性存储区域之外的半导体衬底上的三层。 第二沉积氧化物层形成在半导体衬底的包括去除三层的第一和第二区域的整个表面上。 去除第二区域上的第二沉积氧化物层，并且在包括除去第二沉积氧化物层的第二区域的半导体衬底的整个表面上形成第一热氧化物层。 可以根据本发明制造半导体器件以减少处理时间和降低杂质掺杂分布的变化。 可以控制阻挡氧化物层和高电压栅极氧化物层的厚度。