Abstract:
A level-shifter circuit is adapted for shift an input voltage into an output voltage that is variable between a negative voltage value up to a preset positive voltage level. The shifter circuit includes a first circuit adapted to shift the input voltage into the preset positive voltage level, a second circuit adapted to transfer the preset voltage level to a third circuit connected to a preset negative voltage value. The third circuit is connected to a further voltage at a positive or nil level and is adapted to supply an output voltage to the preset negative level or to the positive or nil level.
Abstract:
A sense amplifier for nonvolatile memory cells includes a reference cell, a first load, connected to the reference cell, and a second load, connectable to a nonvolatile memory cell, both the first load and the second load having controllable resistance; a control circuit of the first load and of the second load supplies the first load and the second load with a control voltage irrespective of an operating voltage between a first conduction terminal and a second conduction terminal of the first load.
Abstract:
A sensing circuit for a memory cell includes a first bias current generator connected between a first voltage reference and a first inner circuit node, and a second reference current generator connected to the first voltage reference. A comparator having a first input terminal is connected to a comparison circuit node that is connected to the second reference current generator, a second input terminal is connected to a circuit node that is connected to the first inner circuit node, and an output terminal forms an output terminal of the sensing circuit. A cascode-configured bias circuit is connected between the inner circuit node and a matching circuit node. The cascode-configured bias circuit is also connected to a second voltage reference. A current/voltage conversion stage is connected to the matching circuit node, to the comparison circuit node, and to a third voltage reference.
Abstract:
An application-specific embeddable flash memory having three content-specific I/O ports and delivering a peak read throughput of 1.2 GB/s. The memory is combined with a special automatic programming gate voltage ramp generator circuit having a programming rate of 1 Mbyte/s for non-volatile storage of code, data, and embedded FPGA bit stream configurations. The test chip uses a NOR-type 0.18 μm flash embedded technology with 1.8V power supply, two poly, six metal and memory cell size of 0.35 μm2.
Abstract:
An electrically-modifiable, non-volatile, semiconductor memory comprising a plurality of user memory locations which can be addressed individually from outside the memory in order to read and to modify the data held therein is characterized in that, for each user memory location, there is a corresponding pair of physical memory locations in the memory, which assume, alternatively, the functions of an active memory location and of a non-active memory location, the active memory location containing a previously-written datum and the non-active memory location being available for the writing of a new datum to replace the previously-written datum, so that, upon a request to replace the previous datum with the new datum, the previous datum is kept in the memory until the new datum has been written.
Abstract:
A sensing circuit for sensing a memory cell, the sensing circuit having a first circuit branch electrically connectable to the memory cell to receive a memory cell current, the first circuit branch having at least one first transistor that, when the first circuit branch is connected to the memory cell, is coupled thereto substantially in a cascode configuration. A bias current generator is operatively associated with the first transistor for forcing a bias current to flow therethrough.
Abstract:
A reading circuit having an array branch connected via an array bit line to an array memory cell, the content of which is to be read; a reference branch connected via a reference bit line to a current generator stage supplying a reference current; a current/voltage converter stage connected to the array branch and to the reference branch, and supplying at an array node and at a reference node respectively an array potential and a reference potential, which are correlated to the currents flowing respectively in the array branch and in the reference branch; a comparator stage connected to the array node and the reference node for comparing the array and reference potentials; a sample and hold stage arranged between the array node and the comparator stage and selectively operable to sample and hold the array potential; and a switching off stage for switching off the array branch.
Abstract:
The device comprises a current mirror circuit having a first and a second node connected, respectively, to a constant current source and to a drain terminal of a memory cell to be programmed. A voltage generating circuit is connected to the first node to bias it at a constant reference voltage (VR); an operational amplifier has an inverting input connected to the first node, a non-inverting input connected to the second node, and an output connected to the control terminal of the memory cell. Thereby, the drain terminal of the memory cell is biased at the constant reference voltage, having a value sufficient for programming, and the operational amplifier and the memory cell form a negative feedback loop that supplies, on the control terminal of the memory cell, a ramp voltage (VPCX) that causes writing of the memory cell. The ramp voltage increases with the same speed as the threshold voltage and can thus be used to know when the desired threshold value is reached, and thus when programming must be stopped. The presence of a bias transistor between the second node and the memory cell enables use of the same circuit also during reading.
Abstract:
For each memory cell to be programmed, the present threshold value of the cell is determined; the desired threshold value is acquired; the analog distance between the present threshold value and the desired threshold value is calculated; and a programming pulse is then generated, the duration of which is proportional to the analog distance calculated. The programming and reading cycle is repeated until the desired threshold is reached. By this means a time saving is obtained, owing to the reduction of the number of intermediate reading steps. The method permits programming in parallel and simultaneously of a plurality of cells of a memory array which is connected to a single word line and to different bit lines, each with a programming pulse the duration of which is proportional to the analog distance calculated for the same cell. The programming process is thus very fast, owing to parallel application of the programming and the saving in the intermediate reading cycles.
Abstract:
An analog read circuit includes an output transistor connected to a memory cell to be read, and an operational amplifier having a non-inverting input connected to the drain terminal of the memory cell, an inverting input connected to a reference terminal, and an output, forming the output of the reading circuit and connected to the gate terminal of the output transistor. Bias transistors maintain the memory cell and the output transistor in the linear region, and the operational amplifier and the output transistor form a negative feedback loop so that the output voltage V.sub.O of the read circuit is linerly dependent upon the threshold voltage the memory cell. The reading circuit has high precision and high reading speed.