公开(公告)号：US20250113300A1

公开(公告)日：2025-04-03

申请号：US18726313

申请日：2023-03-20

Applicant: MEDIATEK INC.

Inventor： Chien-Chun CHENG ,  Wei-De WU ,  Yi-Ju LIAO ,  Cheng-Hsun LI

IPC: H04W52/02 ,  H04W74/0833

Abstract: Various solutions for wake-up signal (WUS) transmission based on timing information with respect to user equipment and network apparatus in mobile communications are described. An apparatus may receive a system information and a timing information for waking up a non-anchor cell from an anchor cell. The apparatus may transmit a WUS based on the system information and the timing information to wake up the non-anchor cell. The anchor cell comprises a cell where the apparatus is capable of receiving the system information and the timing information and performing a timing and frequency synchronization. The non-anchor cell comprises a cell where the apparatus cannot receive the system information and the timing information.

公开(公告)号：US20250106743A1

公开(公告)日：2025-03-27

申请号：US18894027

申请日：2024-09-24

Applicant: MEDIATEK INC.

Inventor： Jia-Hao Wu ,  Tzyuan Shiu ,  Da-Wei Wang ,  Lu-Chi Lin ,  Mu-Chi Fang ,  Wen-Yang Chou ,  Tsung-Sheng Tang ,  Chung-Pi Lee

IPC: H04W48/16 ,  H04W56/00 ,  H04W84/04

Abstract: An out-of-service recovery search method includes establishing a frequency list including at least one searchable frequency, searching a suitable cell of a network according to the frequency list when the user terminal is in an out-of-service state, determining at least one first skip condition of the user terminal, performing a full-band power scan mechanism for scanning received signal strength indication (RSSIs) of user terminal supported frequency bands when the at least one first skip condition of the user terminal is absent and no suitable cell of the network is searched within the searchable frequency of the frequency list, skipping the full-band power scan mechanism when the at least one first skip condition of the user terminal is present and no suitable cell of the network is searched within the searchable frequency, and performing an RSSI sniffer for scanning a signal power of each frequency of the searchable frequency.

公开(公告)号：US20250085751A1

公开(公告)日：2025-03-13

申请号：US18788086

申请日：2024-07-29

Applicant: MEDIATEK INC.

Inventor： Yu-Chia Chang ,  Chien-Chih Huang ,  Ta-Chang Liao ,  Chia-Feng Yeh ,  Ching-Lin Hsiao ,  Wei-Te Wu

IPC: G06F1/20 ,  G06F1/3234

Abstract: A thermal power budget optimization method includes acquiring sensor log information from a plurality of sensors of a heating device, generating a virtual surface temperature of the heating device according to the sensor log information, setting a target surface temperature of the heating device, and dynamically adjusting a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time.

公开(公告)号：US20250080115A1

公开(公告)日：2025-03-06

申请号：US18952224

申请日：2024-11-19

Applicant: MEDIATEK INC.

Inventor： Bo-Ren LUNG ,  Jen-Hang YANG

IPC: H03K19/00 ,  H03K19/0185

Abstract: An integrated circuit device includes a plurality of selecting modules, wherein each of the plurality of selecting modules is configured to receive a first input signal, a second input signal, a first selecting signal and a second selecting signal, and select the first input signal or the second input signal to generate an output signal according to a first selecting signal and a second selecting signal; and a selecting signal providing module, configured to provide the first selecting signal and the second selecting signal.

公开(公告)号：US20250079360A1

公开(公告)日：2025-03-06

申请号：US18797902

申请日：2024-08-08

Applicant: MEDIATEK INC.

Inventor： Cheng Lin HUANG ,  Ting-Li YANG

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes an interconnect structure, a passivation layer and a conductive bump structure. The interconnect structure includes a conductive pad located at a top of the interconnect structure. The passivation layer is disposed on the interconnect structure. The conductive bump structure is disposed on and embedded into the passivation layer and the conductive pad. In a first direction, a first interface between the passivation layer and the conductive pad is located beside and misaligned with a second interface between the conductive bump structure and the conductive pad.

公开(公告)号：US12237401B2

公开(公告)日：2025-02-25

申请号：US17821195

申请日：2022-08-22

Applicant: MEDIATEK Inc.

Inventor： Cheng-Tien Wan ,  Yao-Tsung Huang ,  Yun-San Huang ,  Ming-Cheng Lee ,  Wei-Che Huang

IPC: H01L29/66 ,  H01L21/8234 ,  H01L21/8238 ,  H01L21/84 ,  H01L27/088 ,  H01L27/12 ,  H01L29/417 ,  H01L29/78

Abstract: A semiconductor chip includes a substrate and a transistor. The transistor is formed on the substrate and includes an insulation layer and a fin. The fin includes a base portion and a protrusion connected with the base portion, wherein the protrusion is projected with respect to an upper surface of the base portion and has a recess recessed with respect to the upper surface.

公开(公告)号：US20250063333A1

公开(公告)日：2025-02-20

申请号：US18710979

申请日：2023-01-10

Applicant: MEDIATEK INC.

Inventor： Guan-Yu LIN ,  Chia-Hao YU ,  Lung-Sheng TSAI ,  Nathan Edward TENNY

IPC: H04W8/00 ,  H04W8/24 ,  H04W88/04

Abstract: A synergetic communication method for discovery procedure between relay node and source user equipment (UE) is proposed. The network node may generate the resource configuration for discovery procedure and allocate the resource configuration for discovery procedure to a UE. The UE may transmit the resource configuration for discovery procedure to at least one relay node. Thus, the relay node is able to obtain the resource configuration for discovery procedure from the UE.

公开(公告)号：US20250061005A1

公开(公告)日：2025-02-20

申请号：US18805816

申请日：2024-08-15

Applicant: MEDIATEK INC.

Inventor： Chung-Yang CHEN ,  Cheng-Che CHEN ,  Chung-Hao HO ,  Yi-Wei HO ,  Yen-Po CHIEN ,  Yen-Ting PAN

IPC: G06F9/50

Abstract: A method for dynamic adaptive threading is provided. The method comprises receiving a query request for a recommended number of threads from an application. The method comprises determining the recommended number of threads according to a resource status of a system-on-a-chip (SoC) platform. The method comprises transmitting the recommended number of threads to the application.

公开(公告)号：US12230622B2

公开(公告)日：2025-02-18

申请号：US17938965

申请日：2022-09-07

Applicant: MEDIATEK INC.

Inventor： Ya-Lun Yang ,  Wen-Chou Wu ,  Che-Hung Kuo

IPC: H05K1/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/18 ,  H05K1/18 ,  H01L23/00

Abstract: An electronic device includes a main printed circuit board (PCB) assembly comprising a bottom PCB and a semiconductor package mounted on an upper surface of the bottom PCB. The semiconductor package includes a substrate and a semiconductor die mounted on a top surface of the substrate. The semiconductor die and the top surface of the substrate are encapsulated by a molding compound. A top PCB is mounted on the semiconductor package through first connecting elements.

公开(公告)号：US20250056208A1

公开(公告)日：2025-02-13

申请号：US18794016

申请日：2024-08-05

Applicant: MEDIATEK INC.

Inventor： Hsuan-Li Lin ,  Tsang-Wei Yu

IPC: H04W8/22 ,  H04W56/00

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The method may be performed by a UE. In certain configurations, the UE transmits, to a base station, a received timing difference (RTD) capability of the UE. The RTD capability indicates a RTD supported by the UE between a first cell and a timing reference cell. The UE receives, from the base station, an instruction of a configuration, which is determined according to the RTD capability of the UE. The UE performs the configuration according to the instruction. The RTD capability of the UE may include a parameter indicating the UE supporting advanced RTD capability or limited RTD capability.