摘要:
An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transducing and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.
摘要:
A headset assembly with a recording function for communication includes a left earphone, a right earphone, a call module, and a recording module. The left and the right earphones respectively have a speaker and a microphone. The call module is electrically connected to the left or the right earphone. The recording module is electrically connected to the left and the right earphones. In a first operation mode, the call module communicates with an external communication device through the microphone and the speaker of the left or the right earphone. In a second operation mode, the recording module receives an ambient sound signal through the microphones simultaneously, and records and stores the ambient sound signal. As the microphones are placed in a left auricle and a right auricle, recorded sound may have an effect of a head-related transfer function (HRTF), thus achieving an effect of a stereo sound field during playback.
摘要:
A headphone having a headband and two acoustic transducers disposed at two ends of the headband is disclosed. Each acoustic transducer includes a baffle plate installed with a speaker, a spacer, a vent and an acoustic modulator. The baffle plate and speaker divide the acoustic transducer into a front and a back chamber. The front chamber is configured for communicating with a user's ear. The spacer is disposed behind the speaker to divide the back chamber into a first back chamber and a second back communicated with each other. The vent is disposed in a back wall of the acoustic transducer to communicate the first back chamber with outside. The first acoustic modulator is disposed between the front and second back chambers. The headphone modulates resonance frequency at low frequency bands through the acoustic modulator.
摘要:
An acoustic transducer device is provided. The device includes a body, a speaker, a microphone, and a processor. The body has a cavity, a sound exit, and a sound entrance. The cavity interflows with the sound exit and accommodates the speaker. The microphone is disposed within the body beside the speaker. The microphone interflows selectively with the cavity or the sound entrance. The processor is electrically connected to the speaker and the microphone. When the microphone interflows with the cavity, the microphone receives a sound signal generated from the cavity and transmits the sound signal to the processor for cancelling noise in the cavity. When the microphone interflows with the sound exit, the microphone receives an external sound signal and transmits the external sound signal to the processor for cancelling noise from the external.
摘要:
A noise attenuation device comprising a first tube for receiving an acoustic signal, a first housing defining a first cavity between a first surface and a second surface, the first tube being coupled to the first housing at the first surface for conducting the acoustic signal into the first cavity, wherein one end of the first tube contacts the first surface at a first region with a first area, a second housing defining a second cavity between a first surface and a second surface, and a second tube coupled between the second surface of the first housing and the first surface of the second housing for conducting the acoustic signal between the first cavity and the second cavity, wherein one end of the second tube contacts the second surface of the first housing at a second region with a second area, wherein the first tube, the first housing and the second tube form a filter structure and the area of the first surface of the first housing is greater than the first area and the area of the second surface of the first housing is greater than the second area.
摘要:
A noise reduction device include at east a cavity; a plurality of ducts noise reduction, at least one of the ducts being connected to the cavity for transmitting an acoustic signal including a noise signal into/out of the cavity; a noise reduction circuit, for receiving the acoustic signal including the noise signal and generating an electrical signal; a microphone for receiving the acoustic signal inside the cavity, converting the received acoustic signal into another electrical signal and transmitting the electrical signal to the noise reduction circuit; and a speaker for receiving the electrical signal generated by the noise reduction circuit, using the received electrical signal to generate an out of phase acoustic signal accordingly, and feeding the out of phase acoustic signal into the cavity to interfere with the noise signal inside the cavity. With the noise reduction circuit and cavity structure designed in the noise reduction device, the full range of noise is attenuated
摘要:
An acoustic wave sensing device integrated with micro-channels and a method for the same are described. The present invention uses a piezoelectric substrate with a thinner portion serving as a sensing area and formed via a micromaching or chemical process. An inter-digital transducer (IDT) is located on the thinner portion to produce flexural plate waves (FPW). The micro-channels can be formed together with the thinner portion via the same manufacturing process, or integrated into the piezoelectric substrate via linkage. In the present invention, a novel manufacturing process and design are proposed for fabrication of the acoustic wave sensing devices with a good piezoelectric characteristic, a stable temperature compensation property, and a robust structure. Thereby, the techniques of flexural plate waves can be applied for liquid sensors. In this way, the drawbacks of the conventional acoustic wave sensing devices, such as poor piezoelectric properties and fragile film structures, are removed.