Charging station for mobile device with solar panel

    公开(公告)号:US11387681B2

    公开(公告)日:2022-07-12

    申请号:US15809576

    申请日:2017-11-10

    摘要: A charging device configured to charge a mobile device through the solar cells integrated on the mobile device. The charging device converts wall power to light energy which can be absorbed by the solar cells and then converted to electricity for storage in the rechargeable battery of the mobile device. The charging device includes a light source configured to emit a light beam having a spectrum tuned to the spectral response of the solar cells. The charging device includes a proximity sensor for detecting the presence of a mobile device within the charging device housing and responsively signaling the activation of the light source. The charging device includes logic for wirelessly communicating with the mobile device as well as controlling the charging process in various stages and aspects. The light source may be LEDs that also serve to transmit light communication signals to the mobile device.

    SYSTEMS AND METHODS FOR HIGH-RATE ELECTROCHEMICAL ARSINE GENERATION

    公开(公告)号:US20220090275A1

    公开(公告)日:2022-03-24

    申请号:US17472075

    申请日:2021-09-10

    摘要: A system and method for generating arsine are disclosed. The system may include a shell having a top interior surface. The system may also include a cathode-anode assembly positioned in the shell and forming an elongated structure substantially parallel to the top surface. The cathode-anode assembly may include a first electrode and a second electrode surrounding the first electrode and forming a gap therebetween. The second electrode may include a plurality of channels along a length of the second electrode. The plurality of channels may allow circulation of electrolyte within and around at least a portion of the cathode-anode assembly and allow gases generated in response to current applied to the cathode-anode assembly to escape from the cathode-anode assembly. Such gases may be used as precursor gases for a high-volume metal-organic chemical vapor deposition (MOCVD) operation.

    LOW TEMPERATURE METALLIC INTERCONNECT FOR SOLAR CELL SHINGLING

    公开(公告)号:US20220069141A1

    公开(公告)日:2022-03-03

    申请号:US17459032

    申请日:2021-08-27

    摘要: The present disclosure relates to electrical connections between shingled solar cells in a solar cell assembly. More particularly, the present disclosure describes the use of low temperature metallic interconnects that reduce resistivity between solar cells and assembly time. In an aspect, an assembly of shingled solar cells is described that includes a first solar cell having an insulating film on a back side, the insulating film having vias that expose a back metal layer of the first solar cell, and a second solar cell having a bus bar on a front side. In this assembly, the back metal layer of the first solar cell is electrically connected to the bus bar of the second solar cell through multiple electrical connections formed by low temperature solder that fills the vias in the insulating film of the first solar cell. A method of fabricating or manufacturing the assembly is also described.

    SPUTTERED THEN EVAPORATED BACK METAL PROCESS FOR INCREASED THROUGHPUT

    公开(公告)号:US20210391494A1

    公开(公告)日:2021-12-16

    申请号:US17459611

    申请日:2021-08-27

    摘要: A method is described that includes sputtering multiple layers on a back surface of the photovoltaic structure, the photovoltaic structure being made of at least one group III-V semiconductor material, and evaporating, over the multiple layers, one or more additional layers including a metal layer, the back metal structure being formed by the multiple layers and the additional layers. A photovoltaic device is also described that includes a back metal structure disposed over a back surface of a photovoltaic structure made of a group III-V semiconductor material, the back metal structure including one or more evaporated layers disposed over multiple sputtered layers, the one or more evaporated layers including a metal layer. By allowing evaporation along with sputtering, tool size and costs can be reduced, including minimizing a number of vacuum breaks. Moreover, good yield and reliability, such as reducing dark line defects (DLDs), can also be achieved.