Systems and methods for shingling cells using an adhesive film

    公开(公告)号:US11107939B2

    公开(公告)日:2021-08-31

    申请号:US16257569

    申请日:2019-01-25

    摘要: This disclosure describes various structures, devices, and arrangements that replace a PSA used to hold shingled cells together with an adhesive film. For example, in an aspect, the present disclosure is directed to a shingled arrangement of photovoltaic (PV) cells. In some aspects, the shingled arrangement of PV cells may include a first PV cell, a second PV cell, and an adhesive film placed between a backside the first PV cell and a front side of the second PV cell. The adhesive film may be thermally bonded to the first PV cell and to the second PV cell after the application of localized heat and pressure and holds the first PV cell and the second PV cell together. Additionally, a bus bar of the second PV cell may be electrically connected to the first PV cell by a conductive via formed through the adhesive film.

    METHODS AND SYSTEMS FOR REDUCING DEFECTS

    公开(公告)号:US20220099593A1

    公开(公告)日:2022-03-31

    申请号:US17484924

    申请日:2021-09-24

    IPC分类号: G01N21/95 G06T7/00

    摘要: Aspects of the present disclosure include methods, apparatuses, and computer readable media for transmitting a light such that is incident on a semiconductor device, detecting a first reflected light from a first layer of the semiconductor device and a second reflected light from a second layer of the semiconductor device, identifying a defect in the first layer based on the first reflected light and the second reflected light, wherein the defect provides a shunt path between a top electrode to be deposited on the first layer and the second layer, and performing a defect reduction procedure on the semiconductor device to compensate for the defect in response to identifying the defect.

    PHOTOVOLTAIC DEVICES INCLUDING FLEXIBLE BYPASS DIODE CIRCUIT

    公开(公告)号:US20220085219A1

    公开(公告)日:2022-03-17

    申请号:US17474884

    申请日:2021-09-14

    IPC分类号: H01L31/02 H01L31/05 H01L31/18

    摘要: A photovoltaic device may include a flexible diode circuit having one or more bypass diodes mounted to one or more semiconductor layers using surface mount technology (SMT). The bypass diode and the one or more of the semiconductor layers may allow the flexible diode circuit to be manufactured as a thin, flexible ribbon, thereby providing efficiency in manufacturing and storing of the flexible diode circuit and/or the photovoltaic device, and also increasing a packing factor and areal power of the photovoltaic device, as compared to a typical photovoltaic device.

    REPLACEABLE SOLAR MODULE FOR AUTOMOTIVE USE

    公开(公告)号:US20220080835A1

    公开(公告)日:2022-03-17

    申请号:US17476023

    申请日:2021-09-15

    IPC分类号: B60L8/00 B60L53/80 B60R11/00

    摘要: Removable solar panels from corresponding body parts (removable or fixed) of a vehicle may allow removal and replacement of the panels without removing and replacing the corresponding body parts. In an example, a removable photovoltaic panel for a vehicle may include an array of photovoltaic devices interconnected and assembled together, the array of photovoltaic devices may have a form factor of a surface of a corresponding body panel of the vehicle. The removable photovoltaic panel may also include an attachment layer configured to attach the array of photovoltaic devices to the surface of the corresponding body panel.

    SYSTEMS AND METHODS FOR LARGE SCALE GAS GENERATION

    公开(公告)号:US20220074057A1

    公开(公告)日:2022-03-10

    申请号:US17472106

    申请日:2021-09-10

    摘要: A system and method for generating gas are disclosed. The system may include one or more current sources to generate an electrical current. The system may also include one or more cathode-anode assemblies electrically coupled with the one or more current sources. The one or more cathode-anode assemblies may generate a gas in response to receiving the electrical current from the one or more current sources. Each of the one or more cathode-anode assemblies may include a first electrode and a second electrode forming a concentric cylindrical structure, wherein the second electrode surrounds the first electrode and forms a gap between the second electrode and the first electrode. The system may also include electrolyte provided in the gap.

    Multi-junction optoelectronic device with group IV semiconductor as a bottom junction

    公开(公告)号:US11271133B2

    公开(公告)日:2022-03-08

    申请号:US15957446

    申请日:2018-04-19

    摘要: A multi-junction optoelectronic device and method of manufacture are disclosed. The method comprises providing a first p-n structure on a substrate, wherein the first p-n structure comprises a first base layer of a first semiconductor with a first bandgap such that a lattice constant of the first semiconductor matches a lattice constant of the substrate, and wherein the first semiconductor comprises a Group III-V semiconductor. The method includes providing a second p-n structure, wherein the second p-n structure comprises a second base layer of a second semiconductor with a second bandgap, wherein a lattice constant of the second semiconductor matches a lattice constant of the first semiconductor, and wherein the second semiconductor comprises a Group IV semiconductor. The method also includes lifting off the substrate the multi-junction optoelectronic device having the first p-n structure and the second p-n structure, wherein the multi-junction optoelectronic device is a flexible device.