NON-VOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    21.
    发明申请
    NON-VOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20100171166A1

    公开(公告)日:2010-07-08

    申请号:US12650367

    申请日:2009-12-30

    IPC分类号: H01L29/788

    摘要: A non-volatile memory device and a method of fabricating the same are provided. The method can include disposing an isolation layer on a semiconductor substrate. The isolation layer may protrude from the main surface of the semiconductor substrate and define an active region. In a recess defined by the protrusion of the isolation layer and the active region, a diffusion-retarding poly pattern and a floating gate may be formed in sequence. A control gate may be disposed on the isolation layer to cover the diffusion-retarding poly pattern and the floating gate.

    摘要翻译: 提供了一种非易失性存储器件及其制造方法。 该方法可以包括在半导体衬底上设置隔离层。 隔离层可以从半导体衬底的主表面突出并限定有源区。 在由隔离层和有源区的突起限定的凹部中,可以依次形成扩散阻滞多晶型和浮栅。 控制栅极可以设置在隔离层上以覆盖扩散阻滞多晶型图案和浮动栅极。

    Storage electrode of a capacitor and a method of forming the same
    23.
    发明申请
    Storage electrode of a capacitor and a method of forming the same 有权
    电容器的存储电极及其形成方法

    公开(公告)号:US20060113575A1

    公开(公告)日:2006-06-01

    申请号:US11291798

    申请日:2005-11-30

    IPC分类号: H01L29/94

    CPC分类号: H01L28/91 H01L27/10852

    摘要: In an embodiment, a storage electrode of a capacitor in a semiconductor device is resistant to inadvertent etching during its manufacturing processes. A method of forming the storage electrode of the capacitor is described. The storage electrode of the capacitor may include a first metal layer electrically connected with a source region of a transistor through a contact plug penetrating an insulating layer on a semiconductor substrate. A polysilicon layer may then be formed on the first metal layer. A second metal layer is formed on the polysilicon layer.

    摘要翻译: 在一个实施例中,半导体器件中的电容器的存储电极在其制造工艺期间耐受无意的蚀刻。 描述形成电容器的存储电极的方法。 电容器的存储电极可以包括通过穿过半导体衬底上的绝缘层的接触插塞与晶体管的源极区域电连接的第一金属层。 然后可以在第一金属层上形成多晶硅层。 在多晶硅层上形成第二金属层。